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Intern - Advanced DRAM Cell/Device Engineer — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we're not just designing chips. We're building the physical architecture that powers artificial intelligence, accelerates cloud computing, enables autonomous vehicles, and connects the world through mobile and edge devices. Every breakthrough in AI — from large language models to next-generation data centers — runs on memory. And every bit of that memory lives inside a package that someone like you designs! We're looking for a Senior Package Design Engineer who is passionate about sadvanced semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This is a high-impact, highly visible role where you'll work across the full product lifecycle — from early-stage co-design with silicon teams all the way to High Volume Manufacturing (HVM). If you thrive where precision meets innovation, where your decisions shape products reaching millions of users worldwide, and where your expertise directly influences how the AI era unfolds — this role is for you! Responsibilites: Lead Co-Design from Silicon to System - Partner with silicon design, Business Units, customers, and package architecture teams to define new product concepts from the earliest stages of chip development - Optimize die floorplans, interconnection schemes, and package architectures — from concept to HVM - Drive trade-off studies and architecture decisions for advanced DRAM products targeting AI/D

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Boise Facilities team supports the critical infrastructure that keeps site operations running smoothly and efficiently. The team works on complex systems that directly impact uptime, safety, and manufacturing performance. It’s a highly collaborative environment where engineering expertise drives real impact! The Senior/Staff Facilities SCADA Engineer plays a key role in designing, maintaining, and improving automation systems that power facility operations. This individual brings deep PLC and SCADA expertise to ensure reliability, scalability, and integration across systems. The role partners closely with engineering, operations, and vendors to support commissioning, solve issues, and lead continuous improvement efforts. Responsibilities: Design, develop, and maintain PLC programs using Siemens Step 7, TIA Portal, and FasTrak 505 Workshop Configure and support HMI applications using AVEVA System Platform OMI Lead deployment and fixing of Siemens automation hardware across platforms Partner with multi-functional teams to support system reliability, performance, and commissioning Document PLC code, system changes, and configurations Use Agentic AI to improve current process workflows and drive continuous improvement Minimum Qualifications: Bachelor’s degree in Controls Engineering or related field, or equivalent experience 5+ years of PLC programming, hardware, and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Full Stack Software Development Engineer at Micron, you will be part of the AI Platform Solutions Group (AIPS) within TPG, where you will design and deliver next-generation, AI-native applications that accelerates the capability for engineering teams we support to innovate. In this role, you will focus on building intelligent, scalable systems that integrate advanced AI capabilities—including large language models, retrieval-augmented systems, and agentic workflow orchestration—directly into engineering-critical applications and workflows. You will partner with multi-functional team members to translate complex business challenges into adaptive, high-performance solutions that employ autonomous agents, contextual reasoning, and workflow automation to drive decision-making and productivity. While your primary focus will be within AI Platform Solutions and TPG, the platforms and solutions you build will be architected for reuse and scale, enabling enterprise-wide impact across Micron’s global operations. We require a minimum of seven years of software engineering experience involving medium- to high-complexity design and implementation. Having experience in the semiconductor industry is advantageous. Responsibilities Design, develop, and maintain full-stack applications across front-end, API, and backend layers. Translate business and functional requirements into scalable, secure, and maintainable technical solutions. Own the end-to-end software development lifecycle, including design, dev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Full Stack Software Development Engineer at Micron, you will be part of the AI Platform Solutions Group (AIPS) within TPG, where you will design and deliver next-generation, AI-native applications that accelerates the capability for engineering teams we support to innovate. In this role, you will focus on building intelligent, scalable systems that integrate advanced AI capabilities—including large language models, retrieval-augmented systems, and agentic workflow orchestration—directly into engineering-critical applications and workflows. You will partner with multi-functional team members to translate complex business challenges into adaptive, high-performance solutions that employ autonomous agents, contextual reasoning, and workflow automation to drive decision-making and productivity. While your primary focus will be within AI Platform Solutions and TPG, the platforms and solutions you build will be architected for reuse and scale, enabling enterprise-wide impact across Micron’s global operations. We require a minimum of seven years of software engineering experience involving medium- to high-complexity design and implementation. Having experience in the semiconductor industry is advantageous. Responsibilities Design, develop, and maintain full-stack applications across front-end, API, and backend layers. Translate business and functional requirements into scalable, secure, and maintainable technical solutions. Own the end-to-end software development lifecycle, including design, dev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This internship offers hands-on exposure to advanced semiconductor exploration and engineering progress in EUV lithography and materials engineering. The role supports technology innovation that enables next-generation memory and semiconductor products through close collaboration with multi-functional process engineering teams. As an EUV Lithography & Materials Intern based in Boise, Idaho, you will contribute to projects focused on photolithography process development, materials optimization, and patterning performance improvements. You will partner with engineers across Photolithography, Metrology, Dry Etch, Wet Process, and related fields to complete research initiatives, analyze data, and communicate technical findings. During the internship, you will complete two to three project assignments supporting current and future semiconductor manufacturing technologies. Responsibilities Design and implement experiments using Design of Experiments (DOE) methodologies to optimize photolithography processes, including EUV lithography, photoresist development, and related patterning applications. Plan, coordinate, and perform experiments in semiconductor cleanroom environments, including collaboration with remote fabrication facilities when required. Analyze and interpret process data and imaging results using in-house and commercial software tools, including CD-SEM measurements, line width roughness (LWR), registration, and cross-sectional analysis. Communicate project plans, pro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Wet Process Group evaluates emerging hardware platforms, develops and optimizes process chemistries, and performs fundamental research to support next-generation semiconductor technologies. As a Wet Process Intern, you will partner with engineers to develop innovative wet processing solutions that meet future device requirements while improving existing manufacturing processes. You will contribute to projects focused on process capability, productivity, contamination control, and surface/interface characterization. In this role, you will gain hands-on experience supporting research and development activities, analyzing experimental results, and collaborating with multidisciplinary engineering teams to drive continuous process improvements. Responsibilities Develop, execute, and evaluate wet process experiments to support future semiconductor technology nodes and process development initiatives. Assist with chemistry development, contamination reduction, and surface/interface characterization projects to improve process performance and capability. Analyze experimental data and communicate findings through technical reports, presentations, and project updates. Collaborate with multi-functional engineering teams to improve process productivity, efficiency, and manufacturability. Apply Artificial Intelligence (AI), AI-Enabled analysis tools, and data-driven methodologies to improve research efficiency, process optimization, and data analysis workflows. Minimu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global leader in DRAM technology, driving innovation that enables the next generation of computing, artificial intelligence, and data-driven applications. The DRAM Technology Development organization focuses on advancing semiconductor manufacturing capabilities through collaborative research, process innovation, and technology scaling. Team members work across multiple engineering fields to develop breakthrough memory solutions that shape the future of the industry. As a Process Integration Engineer, you will contribute to the development of next-generation DRAM technologies by collaborating with process, materials, device, and design engineering teams. This role is responsible for coordinating module-related development activities, defining technical requirements, resolving complex integration challenges, and supporting the successful execution of technology development programs. The ideal candidate will possess strong semiconductor process integration knowledge and a passion for advancing future memory architectures within a fast-paced R&D environment. Responsibilities Define technology landmarks, design rules, structural and electrical specifications, and integration requirements for next-generation DRAM products. Collaborate with multi-functional teams including simulation, process development, process architecture, circuit design, and quality engineering to achieve technical objectives and project timelines. Lead module-related integration activities, identify techni

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary Micron is seeking a Senior Digital Design Engineer to contribute to the development of advanced DRAM digital and mixed-signal blocks. This role is responsible for RTL design, implementation, synthesis, timing analysis, power optimization, and design quality throughout the RTL-to-GDS flow. The engineer will collaborate with architecture, verification, and physical design teams to deliver high-performance, power-efficient designs that meet product specifications and PPA (Power, Performance, Area) objectives for next-generation memory products. Responsibilities Design, develop, and deliver RTL for complex DRAM digital and mixed-signal blocks, ensuring alignment with product specifications and performance targets. Perform front-end design quality checks including linting, CDC/RDC analysis, logic synthesis, timing constraint development, and timing closure activities. Collaborate with architecture, verification, and physical design teams to optimize power, performance, area (PPA), and overall design quality. Develop and maintain synthesis and timing constraints (SDC), analyze timing reports, and drive timing closure across multiple operating scenarios. Improve design methodologies, automation, and RTL-to-GDS flows to enhance development efficiency, design quality, and time-to-market. Minimum Qualifications Master’s degree in Electrical Engineering (or equivalent) with 4+ years of experience, or Bachelor’s degree with 5+ years

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary Micron is seeking a Principal Physical Design Engineer to provide technical leadership for advanced DRAM digital design implementation and signoff methodologies. This role will drive physical design execution from RTL through tapeout, with a strong focus on timing closure, power integrity, EMIR analysis, and design reliability. The engineer will collaborate across architecture, RTL, implementation, CAD, and technology teams to develop scalable physical design solutions that achieve power, performance, area (PPA), and reliability targets for next-generation memory products. Additionally, this individual will lead methodology innovation, mentor engineers, and influence the future roadmap for physical design and power integrity across the organization. Responsibilities Lead physical design implementation of complex DRAM digital designs, including floorplanning, place and route, clock tree synthesis, timing closure, and tapeout activities. Drive power integrity strategies and signoff methodologies, including PDN planning, IR drop analysis, electromigration (EM) verification, and EMIR signoff. Collaborate with multi-functional teams to resolve timing, congestion, power, signal integrity, and reliability challenges at both block and full-chip levels. Develop and deploy methodology improvements, automation solutions, and guidelines to improve build quality, efficiency, and scalability. Mentor engineers and provide technical leadership while influencing future memory products t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary Micron is seeking a Senior Digital Design Engineer to contribute to the development of advanced DRAM digital and mixed-signal blocks. This role is responsible for RTL design, implementation, synthesis, timing analysis, power optimization, and design quality throughout the RTL-to-GDS flow. The engineer will collaborate with architecture, verification, and physical design teams to deliver high-performance, power-efficient designs that meet product specifications and PPA (Power, Performance, Area) objectives for next-generation memory products. Responsibilities Design, develop, and deliver RTL for complex DRAM digital and mixed-signal blocks, ensuring alignment with product specifications and performance targets. Perform front-end design quality checks including linting, CDC/RDC analysis, logic synthesis, timing constraint development, and timing closure activities. Collaborate with architecture, verification, and physical design teams to optimize power, performance, area (PPA), and overall design quality. Develop and maintain synthesis and timing constraints (SDC), analyze timing reports, and drive timing closure across multiple operating scenarios. Improve design methodologies, automation, and RTL-to-GDS flows to enhance development efficiency, design quality, and time-to-market. Minimum Qualifications Master’s degree in Electrical Engineering (or equivalent) with 4+ years of experience, or Bachelor’s degree with 5+ years

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team develops the innovations that power AI, mobile, and computing platforms around the world. Our DRAM Engineering team brings together experts across design, verification, manufacturing, and product development to solve complex technical challenges and deliver advanced memory solutions. We are passionate about innovation, collaboration, and building technology that enables the next generation of computing. As a Semiconductor Design Engineer, you will help develop advanced DRAM and emerging memory products from concept through silicon validation. This role offers opportunities to contribute across circuit design, simulation, verification, and optimization while working closely with global engineering teams. Depending on experience, you may also lead technical projects, mentor engineers, and influence future memory design strategies. Responsibilities: Design, simulate, and optimize digital, analog, and mixed-signal circuits for DRAM and emerging memory products. Translate product requirements into circuit solutions and validate performance across operating conditions. Perform circuit verification, silicon correlation, debug, and tape-out support activities. Collaborate with design, verification, layout, CAD, product, and process teams to improve product quality and manufacturability. Contribute to design automation, AI-assisted workflows, technical reviews, and engineering protocols. Minimum Qualifications: <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, the Process Pathfinding organization develops next-generation semiconductor memory technologies and innovative device architectures. The team focuses on advancing process technologies that enable future memory products through fundamental research, process integration, and collaboration across engineering fields. This is an outstanding opportunity to contribute to innovative semiconductor development in a fast-paced, knowledge-focused environment. As a DRAM Dry Etch Process Pathfinding Intern, you will support the development of advanced plasma etch processes for emerging memory technologies. Working alongside experienced engineers and multi-functional partners, you will gain hands-on experience with dry etch equipment, semiconductor process development, materials characterization, and data-driven problem solving. This role provides exposure to advanced manufacturing environments while contributing to process solutions that improve device performance and reliability. Responsibilities Conduct experiments and fundamental research to develop innovative dry etch solutions for next-generation memory technologies. Partner with the Pathfinding team to develop and optimize dry etch processes that meet physical and electrical performance requirements. Apply analytical, statistical, and problem-solving methods to evaluate process performance, hardware capability, and process capability, and aid in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are shaping the memory technologies that power today's most advanced computing platforms, from AI accelerators to mobile and client devices. Our DRAM Engineering team brings together skilled engineers across the globe to solve complex technical challenges, drive innovation, and deliver high-performance memory solutions. If you enjoy tackling difficult problems and turning ideas into products, you'll find exciting opportunities to make an impact here. As a Semiconductor Design Engineer (Principal / Member of Technical Staff / Senior Member of Technical Staff), you will play a key role in designing and optimizing next-generation DRAM products. You will work closely with global design, verification, and multi-functional teams to develop innovative circuit solutions that balance performance, power, quality, reliability, and cost. This role also offers the opportunity to influence technical direction, mentor engineers, and help advance future memory technologies. Responsibilities: Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry. Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets. Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities. Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partne

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Analog Verification Engineer at Micron Technology, Inc., you will help shape advanced analog verification methodologies for next-generation DRAM products. In this role, you will develop scalable verification solutions, improve coverage and efficiency, and contribute to high-quality silicon through innovation, automation , and close collaboration with design teams. Experience with reliability verification methodologies is a strong plus, but not a requirement; candidates with solid analog verification expertise and a willingness to grow in reliability-focused verification are encouraged to apply. Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path, you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity. Responsibilities Define and drive DRAM analog verifi