Site Incharge Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s DRAM Technology Development group, where engineers operate at the leading edge of semiconductor process and product innovation. This role sits at the intersection of process technology, product requirements, and manufacturing execution, and is critical to enabling next generation DRAM technology. As a Principal Node Development Product Engineer, you will play a technical role in driving product readiness through close engagement with process integration, device, yield, test, design, and manufacturing teams. You will own deep process‑aware product knowledge, identify node‑specific risks, and translate silicon behavior into actionable decisions that ensure robust, scalable next generation DRAM products. Responsibilities Serve as a technical contributor during development stage of next gen DRAM! Drive process‑aware product optimization, identifying sensitivities, interactions, and integration risks Analyze silicon data (electrical, parametric, yield, reliability) to identify systematic process or integration limiters Partner with design, process integration, test, and device teams to debug yield and performance issues and converge on root cause Collaborate closely with manufacturing and TD to enable smooth node readiness, learning cycles, and factory ramp Translate process changes into product impact assessments, including PPA, yield, reliability, and test coverage Guide test content and monitoring strategies to ensure early detection of process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team committed to advancing Dry Etch processes within Micron’s R&D organization, pushing the limits of plasma etch technology to enable future memory products. We work at the intersection of physics, materials, and manufacturing to solve hard problems and move new ideas from concept to production. This is a highly collaborative environment where deep technical expertise directly shapes Micron’s technology roadmap! As an R&D Dry Etch Process Development Engineer, you will develop and optimize plasma dry etch processes for advanced memory technologies. You will take ownership from early research through pilot line execution and global process transfer. Experienced engineers in this role drive multi‑area technology roadmaps and influence Micron’s leadership in semiconductor manufacturing. Responsibilities: Develop and optimize plasma dry etch processes to meet structural and electrical requirements Drive dry etch technology roadmaps and deliver solutions for future product nodes Perform root cause defect analysis and failure mode investigations Partner with integration, yield, manufacturing, and vendors to ensure robust processes Support process transfer from R&D pilot line to global production fabs Minimum Qualifications: Bachelor’s degree in Electrical, Mechanical, Materials, Chemical Engineering, Physics, or related field with 5+ years of semiconductor experience Strong understanding of d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will act as a key interface between a variety of engineering groups and specialties, improving a diverse range of expertise to innovate new and improved test strategies, features, and technologies! You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering (DE) to run simulations pre-silicon to validate test strategies and Design for Test circuits. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE) Assist in pre-silicon checklist items and work with TE to define required tester resources Work with TE and PE to modify test programs for specific product requirements to ensure that silicon performance meets expectations Support TE by aiding in test program debug, data analysis, and test development Support fabrication sites and process integration through test development to increase effective process feedback Debug and identifying root causes for failures using test and experimental data, and elec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development Group, where we turn advanced materials into manufacturable memory technology. Our thin films teams work at the groundbreaking edge of DRAM scaling, partnering across R&D, manufacturing, and suppliers to enable future nodes. We operate in a fast paced, hands‑on environment where strong fundamentals and execution matter! As a Thin Films Engineer, you will develop and integrate deposition processes that directly enable Micron’s next-generation DRAM! This role owns thin film concepts from early development through high‑volume manufacturing, with a strong focus on EUV patterning films. You will work closely with cross‑functional teams and external partners to deliver robust, scalable processes that meet aggressive technology requirements. Responsibilities: Develop, optimize, and transfer thin film deposition processes for EUV‑enabled DRAM technology Lead process characterization, troubleshooting, and defect reduction through VME Drive thin film roadmap activities aligned to future technology nodes Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions Analyze large physical and electrical datasets and communicate clear recommendations Minimum Qualifications: PhD or MS with 4+ years of semiconductor experience in materials or process development Strong foundation in materials science, chemical reaction engineering, and thin film physics H

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Process Integration Engineer in the Advanced DRAM organization, you will develop the innovative solutions required to produce the most advanced Memory products on the planet! You will work within a team of world-class engineers to drive new technology development and build Micron’s cutting-edge next-generation memories. This will require a strong background in materials science and semiconductor device physics, along with a creative mindset and a penchant for out-of-the-box thinking. Responsibilities: Lead technology pathfinding activities to enable state-of-the-art device components, such as charge storage devices, hi-k/metal gate transistors, thin-film transistors (TFTs), among others. Design experiments and analyze results, processing silicon and collaborating with the process, materials analysis, device characterization, modeling, reliability, and other teams. Evaluate operating and failure mechanisms, sources of noise,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Technology Development Planning is where we keep complex programs moving fast and on track. We connect capacity, tools, and people to create the space teams need to learn and deliver. Our work directly shapes execution speed, risk reduction, and how smoothly development runs inside manufacturing! This role leads area‑level planning to ensure technology development stays on schedule and scales smoothly into high‑volume manufacturing. You’ll partner closely with process, equipment, and HVM teams to manage risk, guide smart capital decisions, and keep TD material flowing reliably through the fab. Responsibilities: Lead area planning to manage capacity, cycle time, and WIP for TD programs Identify and solve systemic issues impacting equipment efficiency and learning pace Partner with equipment, process, and HVM teams to assess risk and define mitigations Drive data‑based operational planning and scenario analysis for critical timelines Represent TD planning in cross‑functional and leadership forums Minimum Qualifications: Bachelor’s degree or equivalent practical experience Strong understanding of fab flow, process areas, and manufacturing systems Experience leading projects and driving execution across teams Ability to analyze data and make independent, prioritized decisions Strong communication and stakeholder alignment skills

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s advanced lithography and automation organization, where we tackle some of the most complex patterning challenges in semiconductor manufacturing. Our team works at the intersection of process technology, automation, and data, helping shape how next‑generation memory devices are built worldwide. If you enjoy solving hard technical problems and seeing your work scale globally, this is the place to do it! As a Photolithography Automation Engineer, you will play a key role in advancing overlay, critical dimension uniformity, and patterning through automation and data-driven solutions. This role offers hands-on technical impact today, while also influencing Micron’s long-term automation roadmap. You will collaborate closely with process engineers, automation experts, and vendors to bring new ideas from development into high-volume manufacturing. Responsibilities: Identify overlay, CD uniformity, and patterning challenges and define automation or data science solutions Execute and support automation projects in partnership with process development teams Collaborate with internal teams and vendors to improve photo automation systems Define hardware and software requirements for lithography automation solutions Document and standardize automation methods across technologies and global sites Minimum Qualifications: Bachelor’s degree in engineering, Physics, or a lithography-related field plus 5 years of relevant experience, or MS/PhD p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology group at Micron Technology develops and validates advanced memory solutions that enable the transformation of information into intelligence. The team operates in a collaborative, inclusive, and globally distributed environment, partnering closely with design, product, test, process, manufacturing, and quality organizations to deliver industry‑leading DRAM technologies. The Design Validation Product Engineer supports the validation of new DRAM products by focusing on real‑silicon behavior through bring‑up, characterization, and debug. This role builds a strong technical foundation in DRAM architecture, semiconductor devices, and validation methodologies while working closely with multi-functional engineering teams. Responsibilities Support DRAM design validation through silicon bring‑up, characterization, and validation testing of new memory products Analyze electrical and functional data to identify trends, marginalities, and failure mechanisms Assist with debug of validation issues using simulations, test results, and laboratory measurements Use engineering lab equipment and testers to characterize device behavior and performance Document validation results, test coverage, and observed behaviors while collaborating with design, test, manufacturing, and quality teams Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field Strong fundamentals in digital logic,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Owner within SMAI, you will play an important role on t he team that defines, drives, and delivers end-to-end smart manufacturing solutions, integrated across functions of the business. The team applies industry-leading methodologies in automation, artificial intelligence (AI), and generative AI (GenAI) to enhance Micron’s product development, business, and administrative processes across the company. This role offers a rare opportunity to help build and shape a growing Smart Manufacturing and AI team that is directly supporting the growth of Micron’s domestic manufacturing footprint in Boise. As a Senior / Staff Product Owner, you’ll play a foundational role in defining how AI and GenAI are embedded into early technology development and yield ramp , driving real , measurable impact on factory performance. You’ll work at the intersection of manufacturing, data science, and product strategy , pa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Waferless Metrology team within Micron’s Metrology organization, supporting advanced semiconductor manufacturing using inspection guided by design software. We are a small, highly engaged group that values precision, speed, and practical problem solving. Our work directly impacts yield, cycle time, and manufacturing confidence! This role plays a key part in enabling waferless, non-contact metrology for advanced processes. You will translate design data into reliable, production-ready recipes that support both high-volume manufacturing and R&D. The work is collaborative, detail-focused, and performed onsite without cleanroom requirements. Responsibilities: Develop and validate waferless metrology recipes using CAD data Translate CAD designs into measurement locations and alignment strategies Partner with process, yield, and equipment teams to define inspection targets Automate and support recipe generation for manufacturing and R&D Analyze metrology results and resolve recipe execution issues Minimum Qualifications: Bachelor’s degree in engineering, physics, materials science, or equivalent practical experience 2+ years of experience in semiconductor metrology, process engineering, or CAD-based recipe development Experience with CAD tools and metrology platforms such as SEM or CD-SEM Strong analytical and problem-solving skills Preferred Qualifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior/Principal Dry Etch engineer, you will be part of a ground-breaking Advanced NAND Development team! The position promises ample opportunities for innovation, collaboration and testing new dimensions on state-of-the-art dry etch chambers. You will deliver Dry etch process and HW solutions to meet Micron’s program requirements while driving dry etch technology roadmaps to continue enabling Micron’s global leadership in semiconductor manufacturing. You will be working in a highly collaborative atmosphere, interacting with various groups such as process integration, process areas such as CVD, Lithography, & CMP, yield enhancement, manufacturing, and equipment vendors, to ensure robust etch processes that meet the detailed physical and electrical requirements for Micron products. Your responsibilities include, but are not limited to: Leading Dry etch process development. Innovate/explore/develop dry etch processes to meet structural and electrical specifications. Work and innovate with process integration teams to influence integration flows and specs. Collaborate and lead multi-functional teams to tackle sophisticated structural problems. Ability to work independently, with minimal direction, and focus on meeting commitments. Support root cause and outstanding defect analysis. Produce and present process and technology roadmaps for cu

Senior/Staff HBM PYE Product Development Failure Analysis Engineer — Boise, ID - Main Site. Apply via Workday.

Dry Etch Process Development Engineer — Boise, ID - Main Site. Apply via Workday.