Solution Architect Enablement Business Partner Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ASIC IP STA Engineer (6-10 Years) | DDR PHY / ONFI PHY / IO Expander Location: Bengaluru, India Experience: 6-10 Years Enducational Qualification : BE/B-Tech/M-Tech (EEE, ECE, Micron Electronics, VLSI) Key Requirements Member of the AMS IP Physical Design team , responsible for post-layout STA signoff and timing closure of high-speed interface IPs, with close collaboration across IP Design, SoC Synthesis, and SoC Physical Design teams throughout IP development and SoC integration. 6-10 years of experience in Static Timing Analysis (STA) with a proven track record of 4 &#43; successful tapeouts . Strong hands-on expertise with Cadence Tempus (preferred). In-depth experience in MMMC timing analysis and closure across functional, scan, MBIST, and other DFT modes. Experience working on high-speed Memory Interface IPs such as DDR PHY, ONFI PHY, IO Expander (IOE) , or similar high-performance interface designs. Strong understanding of timing constraints development, validation, and debug , including clocks, generated clocks, timing exceptions, and mode-specific constraints. Experience in Liberty (.lib) and ETM timing model generation, validation, correlation, and quality assessment . <span

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What Makes This Opportunity Unique At Micron, we're not just offering a job; we're presenting a chance to be part of a team that develops the future of memory and storage solutions. As a Staff Engineer, ASIC STA in our Bengaluru office, you will have the opportunity to work with powerful technology and contribute to highly innovative projects. Your work will help us deliver flawless results and uphold our world-class standards! Job Responsibilities Proficient at Synthesis, Static Timing Analysis (STA), and Logic Equivalence Checking (LEC) Ability to understand and integrate new mixed signal complex IPs Expertise in developing constraints and timing models Manage synthesis to timing closure, ensuring all checks for silicon success Experience with hierarchical designs involving high-frequency clocks Proficient with scripting, automation, and EDA tools Proficiency with AI and AI-enabled workflows Solid understanding of low power builds involving multiple power domains Identify and meet requirements for critical paths of multi-GHz builds Collaborate effectively in multi-functional and globally dispersed teams Requirements M.S./M.Tech, BS/BE in Electronics or related field Minimum of 6&#43; years of relevant experience Proven ability to successfully implement complex builds Ambitious and determined to compete at a global level <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Construction Engineering department is responsible for the design and construction efforts for high-tech, large-scale projects for Micron in the US. Current high-profile projects include the design and construction of two high-volume manufacturing fabs in Boise, ID1 and ID2, and a third fab in Clay, New York. We are seeking an experienced Chemical Systems Engineer to oversee the third-party design of chemical delivery and handling systems for high-tech large-scale construction projects. The Chemical Systems Engineer will manage external design firms, ensuring that chemical systems meet stringent project specifications, safety standards, and regulatory requirements. This role requires deep technical expertise in chemical systems, strong project management skills, and effective collaboration with multidisciplinary teams to deliver safe, efficient, and compliant systems for semiconductor manufacturing. Job Responsibilities: Manage third-party design firms in developing chemical delivery and handling systems, including storage, distribution, and hazardous waste management. Coordinate with external and internal stakeholders—including contractors, vendors, procurement, finance, construction and design teams—to ensure alignment with facility needs and project schedules. Ensure seamless integration of third-party designs with facility systems using Building Information Modeling (BIM) tools like Revit and Navisworks. Review capacity plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This Notice is provided as a result of the filing of applications for permanent alien labor certification for the positions noted below. Any person may provide documentary evidence bearing on an application to the Certifying Officer, U.S. Department of Labor, Employment and Training Administration, Office of Foreign Labor Certification, 200 Constitution Avenue NW, Room N–5311, Washington, DC 20210. Employer: Micron Technology, Inc. Job Title: Firmware Engineer Job Requisition: JR42883 Job Location: Longmont, Colorado Job Type: Full Time Rate of Pay: $100,000 to $254,000 Duties: Develop high-performance controller firmware for innovative volatile and non-volatile memory systems. Assist in evaluating, designing, building, bench testing, debugging, and failure analyzing firmware for new high-performance memory controllers and Solid State Drives that will increase performance, while reducing power, latency and SoC (System on Chip) complexity for the target markets. Work closely with system test engineers, system failure analysis engineers, firmware engineers, firmware test engineers, system hardware design engineers, product engineers, memory design engineers, firmware tools developers, and production engineers to solve cross-functional product development issues. Validate customer requirements and perform failure analysis on FW related issues. Develop structure

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enterprise Information Systems (EIS) PMO | Career Level: Professional Contributor III (P3) Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. As an IT Project Manager at the P3 level, you will own medium-to-complex projects end-to-end: shaping the business case, driving planning and execution, and delivering measurable outcomes on time and within budget. You will operate with real independence, determining the best path to the objective while partnering closely with business sponsors, technical teams, vendors, and Micron leadership. This role is positioned for a project manager who has moved beyond executing defined tasks and is trusted to lead through ambiguity, influence stakeholders without formal authority, mentor less experienced team members, and build the independent judgment needed for driving project outcomes Responsibilities: Project Initiation Develop project charters that clearly define objectives, scope, benefits, and success criteria. Identify stakeholders and build RACI matrices that establish clear decision rights from day one. Define high-level scope, milestones, and timelines aligned to the business case and Micron’s strategic roadmap. Identify cross-domain depen

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: As a Design Engineer for Non-Volatile Memory Datapath Functional Group at Micron, you will support design and validation activities of Datapath and DDR high-speed interfaces of Flash Memory (non-volatile memory) products. Prior experience in Plane Datapath Design is a plus. In this highly challenging role, you will be engaged in high-speed circuits block level and sub-system level design and timing optimization and supervising their layout. You will be working with project/cross-functional teams to understand full chip floor plan and how to fit and place your circuits at full chip level. You will be also working with Application Engineering team to understand the new specs and translate them into circuit requirements. You will also work with CMOS/modeling team to define CMOS characteristics to realize and enable high-speed circuits. In addition to design activities, you will be heavily engaged in high-speed circuits functional and timing validation from base cells all the way to full-chip level using wide variety of simulation tools such as HSPICE, Fast SPICE and NC Verilog. Having 'Design/Verification &#43; AI' approach accelerates the design process. So, you should be able to adept to ‘Design &#43; AI’ approach with N

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data‑driven root‑cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross‑fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5&#43; years (Senior) or 8&#43; years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability to act as a technical point of contact for blocking issues and lead problem solving involving multiple functions Strong data-driven approach and communication skills; comfortable working with

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Micron Technology is a global leader in memory and storage solutions. As a Validation Engineer for DRAM Compute Products , you will be responsible for preparing, executing, and analyzing validation tests to ensure product functionality and reliability. You will work closely with cross-functional teams to identify and resolve silicon issues, expand validation coverage, and contribute to the development of new testing methodologies. Additionally, we require the use of AI tools and methodologies to improve our efficiency and schedule, resulting in overall savings Responsibilities Prepare validation tests and hardware setups for silicon testing. Execute validation tests and analyze results for accuracy and completeness. Categorize and report silicon issues efficiently. Investigate functionality and margin-related test results. Mitigate software and hardware limitations during validation by working with Design teams to assure quality. Report findings confidently to Design and support root cause analysis. Use Artificial Intelligence (AI) to develop tools, improve processes and shorten overall schedule Minimum Qualifications Bachelor’s degree in Electronics or Electrical Engineering or Master’s degree. 2–5 years of relevant experience. Strong circuit-level understanding, including simulation and debugging. Advanced proficiency in C, C&#43;&#43;, and/or Pyth

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location: MSB (990 Bendemeer Road) Department: Lean Transformation Office Project Title: Automation Tool Operational Excellence Project Description: Micron Manufacturing utilizes an Automated Material Handling System (AMHS) to reduce manual touchpoints and improve traceability, safety, and quality. The intern will have the opportunity to participate in recurring engineering discussions and cross-functional collaboration sessions with the engineering team and various departments. Through these sessions, the intern will contribute ideas and learn how operational challenges are evaluated and resolved. The intern will learn the processes within AMHS and apply problem-solving methodologies, coupled with data analytics, to study practical manufacturing challenges and contribute to improvements in a state-of-the-art semiconductor manufacturing environment. Objective of the Project: The objective of this project is to develop the intern’s understanding of AMHS operations and apply data analytics and structured problem-solving methodologies to identify operational improvement opportunities. Opportunities for Full-Time Employment: The intern may be considered for futu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advance

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Main Responsibilities: Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications. Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products. Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect out

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bondin

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: We are seeking a highly motivated engineer to join our Technology Development team focused on advanced thin film deposition processes for next-generation memory technologies. This role spans responsibilities from process development to technical leadership, depending on experience level (Principal/Staff) . Main Responsibilities: Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures Design and execute complex DOE experiments to improve process capability, uniformity, and reliability Perform in-depth root-cause analysis using advanced modeling and characterization techniques Collaborate with integration, other process areas, metrology, and equipment engineering teams to solve critical technical challenges Drive innovation in film deposition for improved performance, cost efficiency, and sustainability </