Solutions Architects Manager Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets . Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity. Own and advance product integration programs and loop‑level domain expertise , maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration , including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp. Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team drives leading-edge process capability, best-in-class yield (bits per wafer), high product quality, and rapid time to maturity through innovation and strong cross-functional collaboration. Supporting a global DRAM and NAND technology portfolio across development and manufacturing sites in the U.S., Japan, Taiwan, and Singapore, the team ensures consistent execution of manufacturing excellence worldwide! As a Frontend Central Process Integration Senior Engineer, you will identify, align, and deploy best-known methods across the global network and develop optimized processes to achieve product maturity and sustainable performance improvement. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline transparency to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. </li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: Lead PI loop structural uniformity integration and cross loop integration projects for critical loops such as Capacitance loop to address yield and quality challenges, collaborating with cross module process/PI technical experts and suppliers to improve integration structures to achieve BIC yield performance. Build Model based root cause analysis and enhance critical inline defense line for structure including uniformity. Maintain and enhance product integration programs or loop domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach. Node over node shift left uniformity, bevel and backside BKM implementation at early development stage to accelerate wafer overall and edge yield and quality ramping. Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Job Requirements: Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front end and backend assembly process. Good model based problem solving together with data driven decision making, and presentation skills. Proven abili

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next ‑ generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best ‑ in ‑ Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device ‑ and stack ‑ level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design ‑ For ‑ Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross ‑ functional partners—including Fab, Product Leads, Design Engineeri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job description We are seeking a Wafer Manufacturing Section Manager to lead high-volume semiconductor frontend production in a fast-paced, multinational environment. This role requires strong manufacturing execution, team leadership, and process understanding, with the ability to collaborate closely with Engineering teams to drive yield and productivity. We are not looking for a pure process engineer — this role owns manufacturing execution with strong process collaboration. Job Responsibilities &#x1f539; Production Management Lead daily wafer fabrication operations to meet output, cycle time, and delivery targets Manage and develop production teams in cleanroom environment Monitor and drive manufacturing KPIs (WIP, cycle time, OEE, tool utilization) Ensure shift execution discipline and production stability &#x1f539; Process & Engineering Interface Work closely with Process Engineering (PE), Equipment Engineering (EE), and Yield teams Support process control, excursion handling, and root cause analysis Drive continuous improvement on yield, defect reduction, and productivity Support new process qualification and technology transfer &#x1f539; Operational Excellence Lead continuous improvement initiatives (Lean / Six Sigma concepts preferred) Optimize fab capacity and resour

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance. Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach. Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary. Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals. Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles. Travel to Micron Fab locations as necessary for face-to-face work. About Micron Technology, Inc. We are an industry leader in innovative memory

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline visibility to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations tha

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish strategy, models and systems to improve wafer at risk reduction for RAM Defense line hardening. • Establish strategy, model and systems to improve RAM quality control and reduce defect OOC% variation. • Establish strategy, model and systems to improve RAM operation efficiency to achieve labor productivity improvement, Cycle time performance, tool utilization performance for lower cost. • Establish and improve BKM (Best Known Method) related to RAM defense line hardening and operation efficiency. • Ensure BKM sharing spans across all sites regardless of technology and/or site mission differences. • Implement abnormal analysis and improvement. • Lead Copy Smart Team (CST), facilitate taskforce discussion and drive RAM network alignment on strategy business process and roadmap to achieve area objectives and deliver to timelines/commitments. • Support and performs audit and establish metrics that can efficiently audit adoption rate and compliance to business process, BKM and strategy. • Actively provide recommendations to improve and optimize programs and processes to the respective program and/or process owners. • Manage projects with proper Project Management process with metric to track project success. • Track Fab performance metrics for benchmarking purposes. Identify gaps and area of improvements for Fabs. • Provide tactical support and coordination for the Fabs as required for issues of People, Safety, Time to Mat

Who We Are Verkada is transforming how organizations protect their people and places with an integrated, privacy-sensitive AI-powered platform that includes solutions for video security, access control, air quality sensors, alarms, intercoms, and visitor management. We’ve got serious momentum in the market: more than 30,000 customers (including 100+ of the Fortune 500), a $5.8B valuation , more than $1 billion in annualized bookings, and backing from CapitalG, Sequoia Capital, General Catalyst, Felicis Ventures, Next47 and more. Physical AI is one of the most consequential technology shifts of our time, and Verkada is at the center of it. You can look at all kinds of communities to see our platform’s impact in the world. It's the retailer that uses our agentic AI to deter theft before it happens. The warehouse that uses AI-powered alerts to make sure its team is protected on the floor with proper PPE. The school that’s alerted to a threat in real-time and triggers a lockdown in seconds, not minutes. We’re rapidly scaling this impact: today, more than 2 million Verkada devices are deployed across 170+ countries. About the Role Everything at Verkada begins with design. Every part of our product experience is carefully crafted to be simple, elegant, and powerful. As a Lead Product Designer, you will be responsible for delivering best-in-class web and mobile tools (user interface designs, interaction models, prototypes, etc.) in a fast-paced, collaborative environment. You’ll work with product managers, designers, and engineers to design our software, from defining a product vision to tweaking pixels before each release. What You'll Do Collaborate closely with designers, engineers, and product managers in a highly agile development environment with quick ideation and prototyping. Build and foster a collaborative work environment. Run inspiring and formal brainstorming sessions with engineers, product, and other designers. Developing product strategies that d

WPP is the trusted growth partner for the world’s leading brands. We unite cutting-edge media intelligence and data solutions, world-class creativity, next-generation production, transformative enterprise solutions and expert strategic counsel in a single company – powered by exceptional talent and our agentic marketing platform, WPP Open, to help our clients navigate change, capture opportunity and deliver transformational growth. We work with the world's most valuable brands and have global reach across 100+ markets, with deep local expertise. Our people are the key to our success. We're committed to fostering a culture of creativity, belonging and continuous learning, attracting and developing the brightest talent, and providing exciting career opportunities that help our people grow. For more information, visit WPP.com. WPP is embarking on a major 3-year transformation to simplify, modernise, and unify its technology platforms across the group. This change is critical to: · Enable cost-effective transformation and operational efficiency · Accelerate adoption of AI, data, and digital platforms · Ensure consistent delivery of value and benefits across all agencies and markets · Minimise disruption and maximise engagement during large-scale change Workday is a cornerstone of this transformation, providing a single, modern system of record for people data and for driving efficiency through our operations and finance functions. By standardising core processes, improving data quality and enabling better insights, Workday supports consistent ways of working, stronger governance and future‑ready capabilities, while creating the foundation for scalable change, automation and AI‑enabled decision making across WPP. Why we're hiring: In this role you will be a me

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Hands on experience in SV, UVM based Verification. Good scripting skills using perl, python is a plus Good understanding of digital / mixed signal circuits and experience in Digital /Mixed signal Verification. Understand the usage of industry standard tools like Virtuoso, Xcellium, Simvision, vsim, Waveview, Finseim, Hspice and Micron-specific simulators Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments and contribute to cross-group communication to work towards standardization and group success About

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks Join us at Micron and be a part of a team that is transforming how the world uses information to enrich life for all. As an IE Layout Senior Engineer, you will play a crucial role in our mission with responsibilities that build our world-class environment: Drive the planning and build of Fab/Lab/Office layouts. Compose layouts for new expansion areas, ensuring flawless execution. Manage space expansion projects with proven efficiency and precision. Actively engage in Micron’s environmental sustainability projects to contribute to our ambitious goals. Define methodologies for layout planning optimization, aiming for outstanding results. Build intelligent systems that simplify layout planning and management processes. Tongluo site fab/non-fab layout planning Requirements To compete for this role, you must bring a combination of expertise and ambition: Bachelor’s degree in Engineering or related field. A minimum of 3 years working in layout planning and managing projects. Proven track record in developing intelligent systems for layout optimization. Outstanding problem-solving skills and meticulous attention to detail. Ability to work collaboratively in a diverse and inclusive team environment. Excellent communication skills, both written and verbal. At Micron, we offer an unparalleled opportunity to work with inno

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project Title Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement Description Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection system covering Cornerfill (CF), Selective Solder (SS) and Enclosure Assembly (EA). The project aims to reduce conversion ambiguity, setup errors and process variability across BOL operations. Scope 1. Selective Solder Tooling Enhancement (SS) - Qualify and release selective solder process enhancement toolings to improve setup stability, consistency and repeatability - Address tooling‑related contributors to process variation during selective solder operations 2. BOL Conversion Readiness Enhancement (CF, SS, EA) - Develop and implement a tooling selection system defining required toolings for each product conversion across BOL - Standardize tooling requirements to eliminate ambiguity during CF, SS and EA conversions - Improve conversion clarity, reduce human dependency and minimize conversion‑related errors Deliverables 1. Qualify and release selective solder tooling enhancements, including: - Uflex quick‑change gripper - Fixed preheater jig positioning standardization - Hold‑down unit design improvements<