Sr Advanced Packaging Technology Development Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Realtime Defect Analysis (RDA) Engineer in APTD, you will learn how to use pioneering defect detection equipment and processes to solve issues and drive continuous improvement. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development (TD). We're seeking an engineer who is passionate about creative problem solving and finding innovative solutions. This position will provide the opportunity for you to collaborate with engineers in process integration, process development, data science, and yield analysis within and outside of TD. Ideal candidates will investigate process anomalies through root-cause analysis, data manipulation, and correlations. You will be expected to support experimentation, data analysis, baseline health metrics, and systematic and random defect improvement. Your ideas will impact the team glo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: A senior advanced assembly technology development engineer is responsible for introducing new technology to enable next generation packaging. This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone. This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully. Responsibilities Explore new technology on semiconductor industry such as flip chip, TCB and hybrid bonding process equipment and packaging material. Provide plan and resource requirement to enable new technology. Set up DOE plan and execute. Build sample and perform data analysis skill. Lead efficiency trouble shooting skill to improve process. Prepare documentation for process transfer from TD to HVM Review process stability by FDC, SPC and test result. Self-motivated and capable of working independently, proactively identifying opportunities and driving projects with minimal direction. <span

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Advanced Package/Product Integration Drive package product integration for next-generation advanced packaging technologies. Identify integration risks and implement corrective actions during development. Support design rule development and package architecture optimization. Hiring Need: Current workload exceeds available engineering bandwidth, increasing program delay and technical risk exposure. 2. Cross-Functional Technical Leadership Act as primary interface among product engineering, process engineering, manufacturing, suppliers, and customers. Drive alignment on technical decisions and risk mitigation plans. Lead failure analysis and corrective action activities. Hiring Need: Growing project complexity requires additional senior technical leadership to avoid bottlenecks and improve execution efficiency. 3. Customer Support and Technical Engagement Support customer technical reviews and package feasibility assessments. Provide technical recommendations for package implementation and risk reduction. Address customer escalations related to package performance and reliability. Hiring Need: Increased customer interaction volume requires dedicated engineering support to maintain responsiveness and customer satisfaction. 4. Reliability Improvement Drive root-cause investigations for package failures. Improve package yield, reliability, and manufacturing robustness. Develop long-term corrective and preventive actions. Hiring Nee

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Build and Maintain Strong R and D Supplier and Business Relationships Manage Global R and D Supplier Relationships Partner with Engineering to communicate Technology Roadmap Requirements Interact with Micron and Supplier executives Source and Select Suppliers to Meet Future Technical Requirements Support Micron Supplier Qualification Process Assess Supply Chain Risk and Business Continuity Assessment Communicate Micron Supplier Quality Requirement Documentation Publish Financial and Legal Risk Profile for new Suppliers Analyze Commodity Markets to Identify and Communicate Opportunities and Threats Identify potential new Suppliers Monitor Supply and Demand Dynamics Disseminate Competitive Landscape information Drive Negotiation Processes to Enable Future Cost Structures and Document Agreements Manage Procurement Strategies for new Equipment (including creation through stakeholder input, communication, and execution) Execute documentation (NDA, SOW, CDA, JDP, Evaluate Agreements) in support of R and D development efforts Negotiate Total Cost of Ownership projections and commitments Utilize current supplier performance information to secure improvements for future performance Provide input into Global Supplier Strategies Coordinate with R and D, WW Ops, and Procurement stakeholders Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking an experienced NAND Storage Architect, Strategist, and Product Manager to drive, define and implement next-generation NAND technologies and methods for managing stored data in client SSDs. We bring together technical expertise, market insight, and cross-functional partnership to develop products that advance how the world uses information. Join us and influence the future of NAND storage! In this role, you will connect NAND architecture with business priorities, customer requirements, and market opportunities. You will work across Product Management, System Architecture, Engineering, Marketing, Operations, OEMs, and industry partners to develop differentiated storage solutions. Key Responsibilities Define NAND architecture, technology-node, and storage-solution strategies aligned with Micron’s business goals. Develop NAND storage requirements, including performance, reliability, power, packaging, cost, and system-level capabilities. Lead NAND roadmap planning from concept through product lifecycle achievements, using market trends, customer insights, and AI-workload requirements to guide decisions. Own NAND Storage Marketing Requirements Documents and support Technical Requirements Document development. Translate OEM, ecosystem, and business needs into clear product requirements and actionable technology plans. Evaluate NAND industry trends, competitor roadmaps, architectures, and emerging technologies to see opportunities for differentiation. En

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we're not just designing chips. We're building the physical architecture that powers artificial intelligence, accelerates cloud computing, enables autonomous vehicles, and connects the world through mobile and edge devices. Every breakthrough in AI — from large language models to next-generation data centers — runs on memory. And every bit of that memory lives inside a package that someone like you designs! We're looking for a Senior Package Design Engineer who is passionate about sadvanced semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This is a high-impact, highly visible role where you'll work across the full product lifecycle — from early-stage co-design with silicon teams all the way to High Volume Manufacturing (HVM). If you thrive where precision meets innovation, where your decisions shape products reaching millions of users worldwide, and where your expertise directly influences how the AI era unfolds — this role is for you! Responsibilites: Lead Co-Design from Silicon to System - Partner with silicon design, Business Units, customers, and package architecture teams to define new product concepts from the earliest stages of chip development - Optimize die floorplans, interconnection schemes, and package architectures — from concept to HVM - Drive trade-off studies and architecture decisions for advanced DRAM products targeting AI/D

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Team Leader (PDTL) for High Bandwidth Memory you will lead the introduction, ramp and high-volume production success of our groundbreaking products targeted to deliver lowest power per bit solutions in the field of ML(machine learning) and AI (artificial intelligence). PDTLs are the technical program owners and leaders, providing direction and leadership to cross-functional teams, including partners such as business units, quality, test, supply chain, packaging development and manufacturing. The success of a sophisticated product such as HBM relies vastly on PDTLs driving vertical integration of this wide network of partners across the company. This impactful role has a broad scope and will develop your skills working in an inclusive diverse environment of multicultural teams across worldwide geographies! Key Responsibilities include, but are not limited to: Technical Leadership : Lead HBM

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​

Job Details: Job Description: oin Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not limited to Advanced Packaging Factories, New Wafer Fabrication factories (Fabs), Fab Conversions, Process Tools Install, Infrastructure, and Progressive Build. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding, fast-paced environment, this is the right place for you. Everywhere you go, you'll find an opportunity to make a difference. In any given workday, you will be given the responsibility to innovate and create an impact on our business. The Install Qualification Operation Sr Specialist is responsible for driving key milestones enabling tool installation, readiness, and qualification within Intel Foundry Construction and Sourcing (FCS). The role is responsible for equipment install execution from pre-design through design finish and set to SL2 signoff, ensuring safe delivery, accurate scope definition, efficient construction, and prompt vendor qualification. This position requires five days per week of onsite presence and close coordination with manufacturing, design, construction, OEMs, trade contractors, and supplier partners. Please consider that this is an Intel Contract position (3 years). Responsibilities will include but are not limited to: Safety and Compliance: Champion Intel's Culture of Caring and ensure safe behaviors across design and construction activities. Enforce cleanroom, IP protection, and site protocols to maintain compliance with all applicab

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We define ESD and latch-up architecture for next-generation HBM products across advanced nodes and 3D integration. Our team works across device, circuit, and packaging domains to solve reliability challenges that directly impact product quality. We take on complex problems and turn them into scalable solutions that enable high-performance memory! As an SMTS/DMTS HBM ESD/Latch-Up Architect, you will define protection strategies across base die, DRAM stacks, and interconnects. This role shapes product reliability from early architecture through silicon validation. You will work across teams and influence technical direction while solving system-level ESD challenges. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Define end-to-end ESD and latch-up architecture across base die, DRAM die, and interconnects Develop protection strategies for high-speed I/O, TSV interfaces, and advanced packaging Establish ESD/LUP standards, rule decks, and signoff criteria Drive correlation between d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits Requirement: 1 years of experience in semiconductor manufacturing, packaging, or assembly processes. Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses infor