Technology Risk Management Specialist Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality. This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations. Responsibilities Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards. Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, tim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment. Maintain Equipment knowledge as it relates to the process. Improve utilization/capacity/cost by machine upgrade, procedure optimization, or material selection. Optimize and identify equipment variables. Understand DOE/FMEA/OCAP/8D/SPC/Repair/PM (preventive) techniques Perform containment/prevention actions of process and equipment deviations Prepare and update equipment operation manuals, maintenance logs, and incident reports. Support the introduction of new equipment and technologies, including validation and evaluation. Design equipment components (Improve equipment capability by exploring new ideas/concepts and implement on equipment) Coordinate with vendors for equipment upgrades, repairs, and technical support. Conduct regular equipment performance analysis and propose improvements by using and applying AI. Locate and research technical information on equipment, materials, and/or processes in journals, literature, web, etc. Requirements Bachelor’s degree or above in Electrical, Mechanical, Materials, Electronics Engineering, or related fields. Familiarity with semiconductor equipment operation and maintenance procedures and work experience: 3 years above Strong analytical and problem-solving skills. Good teamwork and communicatio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Platform Architecture team defines the electrical, thermal, and power-delivery architectures that enable Micron's next-generation High Bandwidth Memory (HBM) solutions. Working closely with architecture, design, packaging, and technology teams, the organization drives innovation in signaling, power integrity, thermal management, and system optimization to support AI, high-performance computing, and data center applications. As an HBM Platform Architecture Intern, you will contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures for advanced memory systems. You will work alongside experienced architects to analyze design trade-offs, develop modeling tools, and investigate solutions that improve performance, power efficiency, reliability, and scalability for next-generation memory products. Responsibilities Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies. Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems. Analyze power delivery networks (PDNs), including IR-drop, electromigration (EM), power integrity, and power grid optimization for advanced HBM architectures. Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities. Collaborate with architecture, design, packaging, and technology teams to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Global Quality (GQ) Non-Volatile Memory Quality Reliability Assurance (NVMQRA) Returned Material Authorization (RMA) Failure Analysis (FA) Engineer at Micron Technology, you will perform advanced system-level failure analysis of customer-returned products while leveraging AI-enabled diagnostic tools, data analytics, and automation technologies to accelerate root-cause determination. You will collaborate with cross-functional engineering teams to drive corrective actions, quality improvements, and customer satisfaction initiatives. In addition, you will lead strategic projects focused on AI transformation, process automation, operational excellence, and continuous improvement of Failure Analysis capabilities across the organization. Responsibilities and Tasks Perform FA of Customer Returns • Understand customer failure mode and observed fail conditions • Perform initial FA, including usage of Agentic-AI tool • Replicate customer test environment • Perform Automated Test Equipment (ATE) analysis and interpret results • Perform detailed fault isolation once failure has been confirmed • Collaborate with cross-functional resources and support groups to identify root cause and corrective action • Summarize findings and submit for Component / Firmware / Module FA Provide FA Diagnostic Reports to Internal Customers • Verify summarize analysis at electrical and physical level • Identify potential risks

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Key Responsibilities: Process Optimization: Establish, monitor, and optimize daily assembly process parameters to ensure stable production lines. Troubleshooting & Failure Analysis: Lead the containment and root-cause analysis of manufacturing defects and process abnormalities. Yield & Quality Improvement: Implement Statistical Process Control (SPC) to reduce process variation, drive yield enhancement, and prevent quality excursions. Documentation: Author and update standard operating procedures (SOPs), failure mode and effects analysis (FMEA), and technical reports. Cross-functional Support: Collaborate with equipment, product, and quality engineering teams to resolve technical bottlenecks. 2. Role Requirement Work Experience: 0 to 2 years of experience in semiconductor manufacturing, packaging, or assembly processes (Fresh graduates with a strong research background in related fields are highly welcome). Work Environment: Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Attributes: Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. 3. Education Degree: Master’s degree (M.S.) is required. Engineering, Electrical Engineering, Physics, or a related STEM discipline. 4. Skills and Experience Core Technical Knowledge: Fundamental understanding of semi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Architecture Modeling team develops software, modeling platforms, and analytical tools that enable the evaluation and optimization of next-generation storage system architectures. By combining simulation, data analytics, automation, and AI-enabled engineering practices, the team helps accelerate architectural decision-making and improve engineering productivity across product development organizations. As an Architecture Modeling Intern, you will develop software tools and automation solutions that support architecture modeling, simulation analysis, and performance characterization efforts. You will collaborate with architects, firmware engineers, and systems engineers to analyze complex datasets, identify performance bottlenecks, improve engineering workflows, and leverage AI technologies to enhance productivity and technical decision-making. Responsibilities Develop software tools and automation solutions for architecture modeling, simulation analysis, and performance characterization activities. Create workflows to process, analyze, visualize, and report on large engineering datasets to improve insight generation and decision-making. Design dashboards, reporting tools, and analytics solutions that improve engineering productivity and identify performance trends or anomalies. Apply AI-assisted development techniques, automation frameworks, and intelligent analytics to accelerate software development and engineering workflows. Collaborate with cross-functional engineering teams to so

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of ground breaking memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. Position Overview: We are seeking an experienced Process Engineer with expertise in depositing thin films who will thrive in a fast paced and results oriented environment! Our goal is to employ robust solutions to thin film challenges that meet the detailed physical and electrical requirements for Micron’s industry-leading memory products. In this role, you will develop and optimize novel solutions to film deposition challenges for the next generations of Micron’s memory systems. You will to take ideas from conception through development and implementation in manufacturing. Best-qualified candidates will have deep subject matter expertise in Thin Films in semiconductor Advanced Packaging R&D roles. We offer a highly collaborative and innovative atmosphere, allowing you to interact with various groups including process integration, electrical failure analysis, yield enhancement, manufacturing, and various semiconductor equipment manufacturers. You will have the opportunity to drive and define Micron’s thin film technology roadmaps, generating intellectual property which will have a direct influence on our global industry leadership. Job Responsibilities: <ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Key Responsibilities: Process Optimization: Establish, monitor, and optimize daily assembly process parameters to ensure stable production lines. Troubleshooting & Failure Analysis: Lead the containment and root-cause analysis of manufacturing defects and process abnormalities. Yield & Quality Improvement: Implement Statistical Process Control (SPC) to reduce process variation, drive yield enhancement, and prevent quality excursions. Documentation: Author and update standard operating procedures (SOPs), failure mode and effects analysis (FMEA), and technical reports. Cross-functional Support: Collaborate with equipment, product, and quality engineering teams to resolve technical bottlenecks. 2. Role Requirement Work Experience: 0 to 2 years of experience in semiconductor manufacturing, packaging, or assembly processes (Fresh graduates with a strong research background in related fields are highly welcome). Work Environment: Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Attributes: Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. 3. Education Degree: Master’s degree (M.S.) is required. Engineering, Electrical Engineering, Physics, or a related STEM discipline. 4. Skills and Experience Core Technical Knowledge: Fundamental understanding of semi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Architecture team drives exploration and analysis of next‑generation AI memory and system environments. The organization partners closely with DTPCO, Design, and Product/System teams to understand how evolving AI workloads shape memory system behavior and architectural strategies. The HBM Design Architecture Intern supports early‑stage research, performance modeling, and tool development that guide future HBM architectural decisions. This role provides hands‑on exposure to AI system trends and memory subsystem analysis while working closely with senior engineers and technical mentors. Responsibilities Research emerging trends in compute, networking, and storage infrastructure to understand how future AI workloads may evolve. Support HBM architecture analysis by gathering and synthesizing data related to bandwidth, latency, and system‑level memory requirements. Help develop or refine simulation frameworks used to model AI cluster performance and memory subsystem behavior. Participate in building trend dashboards using CSP benchmarks and industry datasets. Collaborate with DTPCO mentors to explore architectural intercept opportunities for next‑generation AI systems. </ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Memory Systems Architecture team defines the next generation of High Bandwidth Memory (HBM) solutions that power artificial intelligence, high-performance computing, and data center applications. The team drives architectural innovation across memory systems, controllers, interfaces, and reliability features to deliver industry-leading performance, scalability, and efficiency for future computing platforms. As a Memory Systems Architecture Intern, you will contribute to the architecture and microarchitecture development of future HBM products. You will work alongside experienced architects to evaluate new memory features, analyze architectural trade-offs, develop performance models, and explore solutions that improve memory performance, reliability, and efficiency for AI and high-performance computing workloads. Responsibilities Research and evaluate next-generation HBM architecture and microarchitecture features, including memory scheduling, refresh management, reliability features, thermal behavior, and memory controller interactions. Develop and enhance performance models, simulators, and analytical tools using Python, C&#43;&#43;, or similar technologies to assess architectural trade-offs and system performance. Analyze workload behavior, simulation results, and architectural data to provide recommendations for future HBM product development. Utilize AI-assisted engineering tools and workflows to accelerate software development, specification analysis, data exploration, and technical documentat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities GenAI System Development: Design, build, and improve GenAI-powered and agentic systems supporting ASIC semiconductor engineering workflows such as code generation, data extraction, analytics, documentation automation, failure triage, root cause analysis, and technical knowledge retrieval. LLM Workflow Engineering: Build, evaluate, and optimize LLM-based workflows, including prompting, developing skills, retrieval-augmented generation (RAG and Graph-RAG), benchmarking, and quality evaluation. Machine Learning Production: Develop and implement machine learning and deep learning models for classification, regression, anomaly detection, failure analysis, and engineering decision support. Cross-Functional Collaboration: Partner with domain experts and cross-functional teams to translate complex engineering problems into scalable AI/ML and analytics solutions. Production Deployment: Support deployment, monitoring, and operationalization of AI/ML solutions in cloud and enterprise environments. Technical Communication: Communicate technical findings, recommendations, and model outcomes clearly to both technical and non-technical stakeholders. Innovation Leadership: Identify and drive high-impact o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Senior Manager, Test Process Engineering Location: Ahmedabad, India Organization: Component Test Engineering Department: CAT Position Summary Micron is seeking a highly motivated Senior Manager, Test Process Engineering to lead the Component Test Process Engineering team. This position is responsible for driving manufacturing excellence through the development, optimization, standardization, AI proficiency or AI‑enabled ways of working where applicable, and deployment of semiconductor test processes across global test operations. The successful candidate will lead a team of engineers focused on test process control, yield improvement, quality enhancement, new product introduction (NPI), manufacturing readiness, equipment and process qualifications, and continuous improvement initiatives. This role requires close collaboration with Product Engineering, Quality, Manufacturing, Equipment Engineering, Industrial Engineering, R&D, and global site teams to achieve world-class operational performance as well as leveraging AI to accomplish KPI's. Key Responsibilities Leadership & People Management Lead, develop, and mentor a high-performing team of Test Process Engineers. Establish team goals, development plans, and performance objectives aligned with business priorities. Drive a culture of accountability, innovation, safety, inclusion, and continuous improvement. Build tec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are building the future of semiconductor manufacturing through world-class facilities engineering and construction at our Boise campus. Our team partners across engineering, construction, operations, and technology disciplines to deliver complex projects that enable Micron's growth and innovation. We value collaboration, technical excellence, continuous improvement, and the use of emerging technologies to improve project outcomes. As an Engineering Design Manager, you will serve as an individual contributor responsible for leading and coordinating engineering design execution for major semiconductor facility projects. While this role provides technical leadership and oversight of external architecture and engineering partners and guides matrixed project teams, it does not have direct people management responsibilities. You will play a critical role in ensuring design quality, constructability, schedule alignment, and successful project delivery from concept through construction. Responsibilities: Lead engineering design activities from concept development through issued-for-construction design packages Coordinate multidisciplinary engineering teams and external A&E partners to deliver safe, compliant, constructible, and high-quality designs Drive design reviews, resolve technical issues and design conflicts, and manage design-related risks throughout project execution Partner with construction, procurement, operations, and project stakeholders to align engineering deliverables w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Metrology Process Development Engineer in Technology Development, you will be primarily responsible for starting up, developing, and optimizing metrology processes used for semiconductor process flows for future generation memory products. This role requires both using existing semiconductor metrology methods and defining emerging process characterization solution spaces. In this position your responsibilities will include, but are not limited to: Driving the understanding of new metrology technology and measurement techniques to ensure that our measurement capabilities meet the technical and device roadmaps Partnering with metrology equipment vendors on continuous improvement of software/hardware and development of new measurement techniques to support process characterization, process optimization, and process control Optimizing and maintaining the calibration of metrology systems that support our technology development Working closely with process development and process integration engineers to optim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks Global Standardization and BKM (Best Known Methods) Governance: Lead the development, standardization, benchmarking, and continuous improvement of FE ME operation/equipment metrics, capacity readiness processes, business processes, and BKMs across all sites. Govern Fab Manufacturing Engineering operational ground rules and ensure consistent alignment of methodologies, metrics, and best practices globally. Act as a global/area technical SME to optimize area operations, systems integration, and digital ecosystem adoption, driving global standardization and systemization of BKMs into long‑term ME blueprints. Facilitate WW ME forums, area network meetings, and sustain/audit existing global BKMs and business processes. Analyze line performance, equipment utilization, OEE, workstation/block WPD, and capacity readiness using Theory of Constraints and Lean Manufacturing. Proactively drive area efficiency improvement by deep‑diving into root causes of equipment availability losses, operating losses, and baseline capability gaps—partnering with Site Manufacturing, Process, Equipment, and SIC teams. Forecast potential roadblocks in constraint workstation management and work with Site Manufacturing Managers to create mitigation plans. Lead proof‑of‑concepts and deployment of automation solutions, scheduling enhancements, BKM dashboards, and digital reporting to improve fab productivity. Govern global change processes and drive sche