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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Validation Execution Assist in executing Validation Runs on IQP/ETV materials under defined timelines, ensuring coverage completeness across MBIST and Native Mode flows. Support time-bound data crunching (log parsing, statistical summaries) and contribute to summary report preparation. Platform & Test Program Support Operate and debug programs on SM3/Cobra (MBIST) and Advantest V93K (Native) . Assist in hardware readiness: handler, socket, loadboard, and probe card setup. Technical Analysis & Simulation Validate high-speed I/O (>11 Gbps) and assist with eye diagram and signal integrity checks. Support Verilog simulation tasks (testbench execution, waveform review) to reproduce sightings and validate fixes. Data & Automation Develop basic scripts in Python for log parsing and data visualization. Maintain documentation in Confluence/Jira and version control in Git/Perforce. Debug & Collaboration Participate

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life. Join an inclusive team focused on one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solution we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while contributing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. Job Description: As a CAD Applications Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, improving EDA and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for Design Verification . You will work closely with the Design and Layout teams to increase their productivity and work efficiency. Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Responsibilities and Tasks include, but not limited to: Develop, deploy, and support robust, configurable, and scalable tools to enable hardware verification acros

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to accelerate intelligence to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Capital Engineer serves as a key contributor to Global FE Capital Management by driving process governance, continuous improvement, and digital transformation initiatives. The role focuses on strengthening capital planning and management processes, ensuring compliance and operational excellence, implementing AI and automation solutions, and delivering actionable insights through analytics and performance reporting. Working closely with Site Planning teams, Finance, Procurement, Facilities, and digital stakeholders, the engineer will lead cross-functional initiatives that improve efficiency, standardization, productivity, and business outcomes across the capital organization. Roles and Responsibilities 1. Capital Process Governance & Compliance Drive governance and compliance for Global Frontend (FE) capital management processes. Establish, document and maintain process standards, business rules, controls, and operating procedures.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. We are looking for an Engineer/Senior Engineer in Product Engineering, NAND Functional and Design Validation Infrastructure (FDV-Infrastructure) , experienced in silicon validation, failure analysis, and infrastructure development. Strong focus on automation, data‑driven validation, and leveraging AI to improve test efficiency, coverage, and debug productivity. Key Responsibilities: Design and execute functional and design validation flows for advanced RG NAND devices using silicon platforms Develop and maintain test program infrastructure , including deterministic usage ‑ case tests, random sequence generators and new NAND interface. Implement automation frameworks using C ‑ based programming, Python, and Perl to improve test development and execution efficiency Apply AI/ML ‑assisted techniques (data analytics, pattern recognition, anomaly detection) to: Accelerate failure triage and root ‑ cause analysis workflows I

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify , diagnose, and propose y

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Advanced Device Technology and Systems, Advanced Technology Enablement Dry Etch, F10 Project Title Dry Etch Process Performance Optimization Using Data Analytics and Artificial Intelligence Project Description Dry etch is a critical semiconductor manufacturing process that has a significant impact on product yield, cycle time, and manufacturing capacity. This internship project focuses on applying process engineering, data analytics, and AI-Enabled methods to understand process behavior, identify performance gaps, and develop improvement recommendations. The intern will work with manufacturing, equipment, and process datasets to explore opportunities related to process stability, productivity, and yield. The project will provide practical exposure to dry etch process engineering, industrial data analytics, data visualization, and Artificial Intelligence applications. Objective of the Project Analyze dry etch process and equipment performance using manufacturing data. Identify sources of process variation, performance drift, productivity loss, and yield impact. Develop data-driven recommendations for improving process stability

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary At Micron, we are transforming the future of semiconductor manufacturing through data, artificial intelligence, and advanced analytics. As a Senior/Staff Data Scientist , you will leverage massive volumes of manufacturing, engineering, and business data to develop predictive models, uncover actionable insights, and drive intelligent decision-making across our global operations. In this role, you will collaborate with world-class engineers, data scientists, and business leaders to solve complex real-world challenges using machine learning, statistical modeling, and advanced analytics. You will have the opportunity to develop innovative AI-driven solutions that improve product quality, optimize manufacturing performance, accelerate operational excellence, and shape the future of intelligent manufacturing. If you are passionate about turning data into impactful business solutions and thrive in a highly automated, data-rich environment, we invite you to join our team and make a meaningful difference. Responsibilities Collaborate with cross-functional teams including Engineering, Manufacturing, Product, and Business stakeholders to identify opportunities for data-driven solutions and process improvements. Analyze l

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Process Equipment Engineering (PEE) Project Title AI-Enabled CMP Equipment Health & Breakage Risk Prediction Dashboard Project Description Chemical Mechanical Planarization (CMP) tool performance directly influences wafer quality, equipment reliability, and manufacturing efficiency. This project focuses on developing an AI-Enabled dashboard that integrates fab equipment and manufacturing data to identify early indicators of wafer breakage, equipment degradation, and yield excursions. The intern will work on data exploration, predictive analytics, and visualization techniques to develop an intelligent monitoring solution that enables proactive decision-making. Through this project, the intern will gain exposure to semiconductor manufacturing equipment, reliability engineering methodologies, Artificial Intelligence applications, and data-driven engineering practices within a high-volume manufacturing environment. Objective of the Project Develop an AI-Enabled equipment monitoring and risk prediction dashboard capable of identifying potential CMP tool-related wafer breakage and excursion risks before significant manufacturing impact occurs. Oppo

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department SSD Assembly Process & Equipment Engineering Project Title AI-Enabled SSD Depanel Process Characterization and Optimization Project Description This internship project focuses on characterizing process variations in SSD depanel operations within a high-volume manufacturing environment. The project aims to deepen understanding of the interactions between process parameters, equipment performance, and product quality outcomes. The intern will undertake a structured engineering project involving Design of Experiments (DOE), statistical analysis, process characterization, and data-driven optimization techniques. In addition, the intern will explore AI-Enabled approaches to improve engineering productivity, automate data interpretation, and accelerate insight generation from process characterization activities. The project provides an opportunity to gain hands-on experience in process engineering, equipment operations, and advanced manufacturing technologies within the semiconductor industry. Objective of the Project Characterize key process variables affecting SSD depanel performance and product quality. Establish a robust op

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Manufacturing Wet Process Engineering (MFG WET) Project Title AI-Enabled Germhold Reduction for Dry Strip Workstation Project Description This internship project focuses on leveraging data analytics and AI-Enabled methodologies to understand and reduce equipment Germholds within the Dry Strip workstation in a semiconductor manufacturing environment. The project aims to identify key factors contributing to Germhold occurrences, develop data-driven insights, and evaluate opportunities to improve workstation efficiency and manufacturing capacity. The intern will gain hands-on experience working with operational datasets, engineering teams, and manufacturing equipment while exploring the application of Artificial Intelligence, machine learning, and predictive analytics within semiconductor manufacturing processes. Objective of the Project Identify key drivers and trends associated with equipment Germholds in the Dry Strip workstation. Apply data analytics and machine learning techniques to uncover opportunities for Germhold reduction. Develop a structured methodology to improve understanding of equipment performance and opera