Yield Analysis Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an MTB Test Planner at Micron, you will be responsible for driving planning and operational execution for backend test manufacturing. This includes test capacity planning, production prioritization, WIP management, cycle time monitoring, material readiness tracking, and shipment support to meet customer and business commitments. You will collaborate closely with Global Planning, Tactical Supply Planning (TSP), Manufacturing, Engineering, Quality, Supply Chain, and other cross-functional teams to align supply commitments, manage production capacity, optimize inventory, and support customer demand fulfillment. This role requires strong analytical thinking, problem-solving skills, and the ability to make data-driven decisions in a dynamic manufacturing environment. Strong communication and cross-functional collaboration skills are essential to drive alignment and support business objectives across supply chain and site teams. Responsibilities 1) Production and Supply Planning * Develop and maintain production plans to support customer and business demand requirements. * Monitor production performance, capacity availability, inventory levels, cycle time, yield performance, and operational constraints to ensure supply commitments are met. * Work with cross-functional teams to align priorities and resolve production-related issues impacting shipment commitments. * Support production scheduling and lot prioritization act

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Overview｜職缺概述 Micron Taiwan is building a long‑term HBM talent pool to support the expansion of advanced memory manufacturing in Taichung. This evergreen posting is intended to attract talents across Engineering, Manufacturing, Quality, Automation, Facilities, and Operations Leadership functions. Micron 台灣持續擴展 HBM（High Bandwidth Memory）製造與營運團隊 ，此 evergreen 職缺用於建立長期人才庫，將依業務需求媒合合適職務。 Potential Roles｜涵蓋職務方向（不限於） Manufacturing / Process 製造／製程工程師 Automation & Manufacturing Systems Engineer 自動化與製造系統工程師 Industrial Engineer 工業工程師 Product Quality Assurance / Quality Engineering (PQA / PQE) 產品品質保證／品質工程 HBM Manufacturing / Test Production Supervisor HBM 製造／測試產線主任 Assembly Equipment Engineer / Process Engineer 設備／製程工程師 Facilities Engineer 廠務工程師(水處理/HVAC/氣體系統/擴建工程專案/二次配) What You Will Do｜工作內容摘要 Depending on role alignment, responsibilities may include: Support and improve HBM manufacturing, assembly, test, automation, or facility systems 支援並優化 HBM 製造、封裝、測試、自動化或廠務系統 Drive process optimization and yield improvement, enhance product quality, and support new product introduction and production ramp 負責分析與優化

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron in Boise, ID, we are investing $15 billion in semiconductor manufacturing, a historic initiative. As a global leader in memory and storage innovation, we drive information into intelligence that encourages the world to learn, communicate, and progress faster than before. We are looking for hardworking individuals to join our expansion team and contribute to growth and innovation in the semiconductor industry. As a High-Volume Manufacturing Shift Process Engineer, you will be a part of a world-class team supporting our critical high-volume manufacturing ramp. In this role you will drive operational excellence, maintain process stability, improve yield, and increase manufacturing output. Collaborating with equipment engineers, shift operations teams, process owners to quickly resolve issues, you will also help implement continuous improvements and ensure manufacturing goals are met safely and efficiently. This is a shift position rotating 3-4 days off a week. Responsibilities: Monitor and optimize manufacturing processes to improve yield, quality, efficiency, and overall equipment efficiency while supporting area benchmarks and wafer output goals. Analyze process performance using Statistical Process Control (SPC), Fault Detection and Classification (FDC), Design of Experiments (DOE), and other engineering methodologies to identify trends, resolve excursions, and drive detailed problem solving. Lead issue resolution activities by identifying, escalating, and addressing process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Build, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor engineers with less experience and provide technical leadership to project teams. Define and improve compose methodologies applying AI-enabled tools, automation, and protocols. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and collaborators. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Location: Richardson, TX We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities · Lead the design and execution of sophisticated memory subsystems and top-level integration activities. · Own design planning, technical decision-making, risk assessment, and schedule execution. · Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. · Review design specifications, microarchitecture documents, and implementation plans. · Drive memory array design, including address decoders and data path, internal power supplies, and custom circuit design activities depending on project needs. · Lead design reviews and drive issue resolution across organizations. · Guide engineers who are developing their skills and provide technical leadership to project teams. · Define and improve building methodologies by applying AI-enabled tools, automation, and guidelines. · Support silicon bring-up, debug, characterization, and yield improvement activities. · Communicate project status, risks, and mitigat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The OCT CPEE Diffusion Engineer is responsible for driving process and equipment engineering excellence within the Diffusion area to achieve world-class performance in safety, quality, cost, output, and technology enablement. The engineer will work closely with Manufacturing, Process Integration, Yield Enhancement, MAE, Central Teams, and Equipment Suppliers to improve equipment capability, manufacturing efficiency, productivity, and cost effectiveness. This role requires strong technical expertise, analytical problem-solving skills, and the ability to influence cross-functional teams to deliver sustainable business results Key Responsibilities Technical Excellence Drive Diffusion process and equipment performance improvements to support manufacturing objectives. Identify and implement opportunities to improve Manufacturing Availability (MA), Utilization, Throughput, WPD, and RPT. Lead technical investigations for equipment, process,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Building, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor early-career engineers and provide technical leadership to project teams. Define and improve develop methodologies applying AI-enabled tools, automation, and standard processes. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and collaborators. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering,

Our Mission You call. You wait. You call again. In every other part of your life, you book in seconds. In healthcare, you’re blocked. We’re here to give power to the patient. For nearly 20 years, we’ve built the leading healthcare marketplace - helping tens of millions of people find and book the care they need. Now, we’re going further: building our infrastructure beyond Zocdoc’s marketplace to power access to care wherever patients search, from provider websites and insurance directories to search engines, AI platforms, and more. Healthcare still lacks something every other major consumer industry takes for granted: a seamless way to go from seeking to getting . We don’t want to own the front door to care; there isn't one. We want to make sure all of those doors open when patients are knocking. Fixing healthcare starts with fixing access to it. And we're still just getting started. Your Impact on Our Mission Zocdoc’s most important asset is our people. An Executive Assistant serves as a trusted and valuable business partner to our leadership team. Their primary responsibility is to optimize and prioritize the leadership's time, ensuring the smooth execution of their goals. By working closely with the team, possessing excellent communication skills, delivering top-notch customer service, and fostering a strong relationship with leadership, this person guarantees that the executives can concentrate on high-yield strategic initiatives. You’ll enjoy this role if you are… Guided by a strong EQ, autonomous, urgent, and creative A highly motivated problem-solver who works well under pressure Passionate about organization and structure, but adaptable and resourceful when things change The kind of person who enjoys working with others and finding ways to collaborate effectively A strong and effective communicator across all mediums (in person, slack, email, phone) Your day-to-day is… Full ownership of multiple calendars for our C-suite level leader

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking an Integration Reliability Engineer to develop the methods that enable complex products to be assembled, integrated, tested, and fielded reliably throughout the product lifecycle. You will support integration strategy, build readiness, interface risk management, failure investigation, and reliability growth across product development and production. This role spans Design Engineering, Manufacturing Engineering, Test Engineering, Operations, Program Management, and field support. The work is hands-on and connected to integration builds, production environments, test activities, and hardware failure investigations in Victorville, Ca.. Key Responsibilities Define integration strategies that establish readiness for component, assembly, and production. Conduct risk assessments, and inspection plan reviews for complex products and assemblies. Develop and improve control plans, initial controls, and methods for integrating complete systems. Support component integration, built-to-print assembly, validation activities, and the transition from development into repeatable production. Monitor yield, build health, and process robustness to identify risks affecting throughput and product realization. Lead systemic root-cause and co

Job Details: Job Description: The Role and Impact Join Intel as a Module Engineer, where you will play a pivotal role in enhancing the production of advanced integrated circuits. In this position, you will own and optimize high-volume manufacturing equipment and processes, ensuring precision and minimizing defects. Your contributions will directly impact manufacturing efficiency, quality, and scalability, enabling Intel to maintain its leadership in semiconductor innovation. Business Group The role is part of Intel's Assembly Test Manufacturing (ATM) division, which serves as the backbone of Intel's back-end manufacturing operations. ATM supports Intel's diverse portfolio of products across key business segments, including client, server, automotive, and connectivity. The group focuses on advanced packaging and manufacturing technologies to deliver competitive solutions, aligning with Intel's IDM 2.0 strategy to drive innovation and global leadership. Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost goals. Conduct tests and measurements to control critical dimensions and minimize defectivity in production lines. Recommend and implement modifications to improve operational efficiencies, manufacturing techniques, and output performance. Expand high-volume manufacturing capacity to demonstrate technology capabilities and ensure seamless transfer to global manufacturing sites. Execute equipment maintenance, repair activities, and continuous improvement initiatives aligned with safety, quality, productivity, and yield metrics. Develop systems for excursion prevention and identify discrepant material or activities within equipment and processes. Manage equipm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Our Team as a STAFF ENGINEER, TDT PD CMP At Micron, we are driven by the pursuit of excellence and innovation. As a Chemical Mechanical Planarization (CMP) Process Development Engineer, you will play a key role on our Technology Development Taiwan (TDT) CMP team. You will contribute to the progress of our innovative DRAM technology. If you have a passion for semiconductor development and enjoy working in a dynamic and collaborative environment, we invite you to join us in defining the future of the semiconductor industry! Key Responsibilities Develop and refine CMP processes to support advanced DRAM technology acceleration. Collaborate with diverse teams to develop new outstanding semiconductor devices. Perform rigorous process characterization, develop new consumables, and evaluate new hardware. Conduct groundbreaking research and innovate to contribute to Micron’s extensive patent portfolio. Drive continuous process and efficiency improvements to meet yield, quality, and cycle time requirements. Direct and manage CMP consumables and equipment suppliers. Plan and complete well-designed experiments, presenting results in clear and concise reports. Minimum Qualifications Proficiency in both Chinese and English languages. Expertise in CMP process development. Hands-on experience with CMP polishing equipment, including familiarity with equipment operation, optical metrology, profilometry, common polishing

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The resp