Yield Analysis Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advance

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Main Responsibilities: Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications. Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products. Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect out

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bondin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is seeking an experienced and highly motivated individual to join our team as a Senior Advanced CMOS Device & Process Integration Engineer. The successful candidate will combine strong engineering judgment with AI-assisted analytics ( Claud Assist, Code Assist, etc. ), coding, modeling, and knowledge-management tools to accelerate technology development and improve the quality and efficiency of technical decision-making. AI is expected to enhance, rather than replace, the engineer’s technical ownership, device expertise, and accountability. This position provides an opportunity to make significant technical contributions to current and future CMOS technologies for advanced memory products. As a Senior Advanced CMOS Device & Process Integration Engineer, you will own key device or process integration workstreams within advanced CMOS technology development. You will work closely with Process Engineering, Circuit Design, Layout, Product Engineering, Reliability, Manufacturing, Yield Enhancement, and Modeling/TCAD teams to define technical requirements, plan silicon experiments, resolve complex device issues, and transfer robust technologies into high-volume manufacturing. You will be expected to independently identify technical risks, develop data-driven solutions, and influence cross-functional engineering decisions. Responsibilities inc

At Vanta, our mission is to help businesses earn and prove trust. We believe that security should be monitored and verified continuously, and we empower companies to practice better security and prove it with ease. Vanta has a kind and talented team, and while some have prior security experience, many have been successful at Vanta without it. Partner Marketing at Vanta drives revenue growth and market expansion through high-impact cloud, technology and ecosystem partnerships. Our team builds and invests in joint campaigns, co-marketing initiatives, and MDF programs to generate pipeline, accelerate deals, and deepen partner relationships. As we scale, repeatable programs, partner-ready plays, and data-driven insights are critical to maximizing the impact of our partner investments. As the Senior Manager, Partner Marketing Programs at Vanta, you will build, scale and execute the foundational engine behind our global partner marketing strategy. This is a highly visible, highly cross functional role working closely with partner product marketing, partner enablement, partner marketing, partner sales, systems and finance. You will champion three critical focus areas to propel our partnership strategy forward: Orchestrate high-impact partner communications and community engagement —including product launches, enablement webinars, and an active partner community—designed to keep partners fully enabled, deeply engaged, and continuously choosing Vanta. Maximize Market Development Fund (MDF) Impact and ROI —strategically allocating, tracking, and optimizing investments to turn MDF into a high-yield engine for measurable pipeline expansion across our entire partner ecosystem. Scale partner pipegen programs by transforming Vanta's campaign calendar and product roadmap into robust, partner-ready packages, campaign kits, and sales plays that drive joint pipeline. Reporting to the Head of Global Strategic Partner Marketing, you will empower our partner network to grow and scale wit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and

NVIDIA’s Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first-principles thinking and engineering judgment at the highest level translate directly into product outcomes at scale. We are looking for a Principal Performance and Manufacturing Architect who has built the models, defined the specs, and seen them validated through silicon. You have owned the connection between design intent and manufacturing reality, not as a reviewer or a contributor, but as the person who set the methodology and proved it worked. You turn ambiguous physical phenomena into quantified, defensible margin terms. You do not wait for data to confirm your hypothesis; you design the experiment that gets it. You improve how the organization ships products after every program. The exceptional hire also uses AI deliberately — with proven workflow impact and the judgment to know where it compresses real work and where it introduces risk. What you'll be doing: Own the physics, from mechanism to margin. Build first-principles models connecting AVF, defect mechanisms, and DVFS transients to field FIT, system-level yield, and DPPM vs. coverage — calibrated per node and population shift — so every margin term in the V/F curve and P-state table is named, sourced, and defensible. Set the screen that resolves escapes. Specify ATE and SLT voltage, frequency, and timing conditions that capture worst-case transient VF windows — making it unambiguous whether a marginal defect or timing violation is detected or escapes at every manufacturing stage. Make the POR the authoritative source. Author the methodology document for each program and drive alignment across build, product definition, reliability, and test engineering — so every team is making decisions from the same model. Prove the model before produc

NVIDIA's accelerated computing platforms move data at speeds that push the limits of what silicon and physics allow. Whether a high-speed interface trains reliably, maintains accurate margins, and survives every platform topology it will ever see is a question we answer ourselves. This role does that work. The Silicon Co-Design Group leads the boundary between what was designed and what was built. When a GPU, CPU, or SoC ships with interfaces that work at scale, this team is the reason. Most engineers debug within a layer. You will own the full stack. When an interface fails to train, the link margin is unexpectedly tight, or a customer reports a critical silicon issue, you trace the problem through protocol behavior, signal integrity, firmware, platform topology, and silicon marginalities. You then confirm that the fix works. Your methodology shapes how NVIDIA validates high-speed interfaces across generations. Your decisions affect yield, production ramp, and field quality. This is not a coordination role. The engineers who do it well hold protocol depth and system breadth simultaneously, never lose the thread across hardware, firmware, and software, and have the judgment to know when to go deeper and when to act. They are rare. Should that describe you, read on. What you'll be doing: Own post-silicon bring-up, characterization, validation, and debug of PCIe, NVLink, C2C, and other HSIO interfaces across NVIDIA GPUs, CPUs, and SoCs from first power-on through production readiness. Close the hardest failures. Drive root cause across protocol behavior, signal integrity, firmware and driver interactions, platform topology, and silicon marginalities and own every fix through to confirmation. Define validation strategy. Set test coverage, debug priorities, margining methodology, and stress criteria f

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an IT Network Engineer at Micron, you will be responsible for the operational health (Security, Availability, Performance, Interoperability and Reliability) of Micron’s data communications systems. You will support the acquisition, installation, maintenance, and administration of Micron’s data and voice communications systems. Network Engineers specialize in LAN/WAN, Wireless, and Telecommunications hardware, software and cabling. You will regularly work with Micron’s Business Units to ensure solutions meet or exceed business requirements. You will be expected to suggest, promote, and leverage published standards to minimize environment complexity and ensure regulatory as well as license compliance. Responsibility Collaborate with various teams and functional areas in developing and improving business processes with clear and agreed-upon business rules Develop process improvement strategies across the network Prioritize and manage multiple projects based on Department and corporate objectives Lead and collaborate with various engineering groups to optimize current processes and align the network to improve manufacturability, yield, quality and cost performance of products Work with process integration team to implement and integrate new/improved process workflow Maintain documentation for new and improved processes Communicate project strategy, status and actions through meetings, presentations and reports to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an IT Network Engineer at Micron, you will be responsible for the operational health (Security, Availability, Performance, Interoperability and Reliability) of Micron’s data communications systems. You will support the acquisition, installation, maintenance, and administration of Micron’s data and voice communications systems. Network Engineers specialize in LAN/WAN, Wireless, and Telecommunications hardware, software and cabling. You will regularly work with Micron’s Business Units to ensure solutions meet or exceed business requirements. You will be expected to suggest, promote, and leverage published standards to minimize environment complexity and ensure regulatory as well as license compliance. Responsibility Collaborate with various teams and functional areas in developing and improving business processes with clear and agreed-upon business rules Develop process improvement strategies across the network Prioritize and manage multiple projects based on Department and corporate objectives Lead and collaborate with various engineering groups to optimize current processes and align the network to improve manufacturability, yield, quality and cost performance of products Work with process integration team to implement and integrate new/improved process workflow Maintain documentation for new and improved processes Communicate project strategy, status and actions through meetings, presentations and reports to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Test Process Technician, you are responsible for the installation and maintenance of manufacturing equipment. Sustain and improve key performance indices of the equipment through continuous improvement activities Responsibilities: Validate test floor deviation lots and investigate deviations. Determine root causes of test-related issues and classify problems appropriately. Provide proper disposition of affected lots and follow up on corrective actions. Escalate issues to relevant engineering or support teams when required. Debug testing-related issues and support manufacturing during troubleshooting activities. Provide guidance to manufacturing personnel on lot handling and testing requirements. Monitor test process performance and ensure compliance with quality standards. Support continuous improvement initiatives to improve yield, quality, and productivity. Requirements:- Diploma in mechanical engineering & Electronic/Electrical Engineering Fresh graduates are encouraged to apply Some understanding of Semiconductor Testng processes will be added. A good teammate equipped with excellent interpersonal and communication skills. Leveraging AI to

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product & System Engineering Media Health team, you will work together with a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will work within the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Member of Technical Staff (MTS) – 3D NAND Process Integration Job / Role Summary The role drives advanced 3D NAND technology pathfinding and process integration within the Advanced NAND Technology team in Singapore. It leads the translation of device concepts, materials, and process architecture into validated, manufacturable technology solutions. The position coordinates end-to-end development from concept through technology validation, applies data-driven, AI-assisted, and model-based methods to resolve complex scaling challenges, and collaborates across Device, Probe, Test, Design, and Operations to improve performance, yield learning, execution, and future-node roadmap readiness. Main Responsibilities Lead 3D NAND integration, pathfinding, and advanced architecture enablement in support of the technology roadmap. Drive end-to-end technology development from concept through validation, including learning vehicles, chara