Yield Analysis Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. This job requisition is to seek senior technical leaders in the field of process engineering to join ID1, reporting directly to Director of DE/WP/CMP. As a member of technical staff (MTS) or Senior member of technical staff (SMTS), you will play a pivotal role in driving innovation, leading technical projects, defining the technical roadmap, and mentoring fellow engineers. Your expertise will be instrumental in developing cutting-edge DRAM process solutions to support yield ramp-up. Your contribution will have a lasting impact on the DRAM industry! Responsibilities for Process Engineering MTS/SMTS include (but not limited to): Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures. Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability. Define and execute

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join our Advanced DRAM organization and help shape the future of memory technology! We are a team of world class engineers and scientists working in a leading-edge R&D environment to solve some of the industry's most sophisticated semiconductor challenges and to transform breakthrough concepts into manufacturable solutions. As a Process Integration Engineer, you will help define the future of memory technology by identifying novel solutions to scaling, performance, and power challenges in advanced semiconductor devices. You will work with experts in process development, device engineering, modeling, characterization, and reliability to develop and integrate new technologies from concept through implementation in silicon. Responsibilities: Lead integration activities for advanced semiconductor devices, including charge storage devices, thin-film transistors (TFTs), and related device structures Evaluate device operating mechanisms, failure modes, noise sources, and variability to improve device performance and reliability Partner with cross-functional teams to identify and resolve performance, yield, reliability, and product margin challenges Design, implement, and analyze experiments in the R&D fab to optimize process flows and meet product requirements Analyze inline, parametric, and probe data to drive yield improvement, process margin, and cost reduction Communicate sophisticated technical issues and lead teams toward achieving project goals <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Idaho Semiconductor Manufacturing (Triton) LLC Responsible for the installation, functionality, and maintenance of an equipment toolset. This include all the hardware and software in the toolset, as well as the interface to any other systems that the tool must connect to for its proper operation. Maintain the tool performance as measured by availability to production and primary quality metrics. Complete all required safety training and conduct all work in accordance with safety policies and regulations. Follow-up on safety and quality related issues and work toward resolution with stakeholders. Perform and facilitate audits. Reduce incidents of personal injuries, safety hazards or environmental releases. Operate and maintain tools according to documentation and guidelines to ensure safety and quality expectations are met. Ensure proper tool documentation/reaction mechanisms exist for shift teams and submit updates to content. Maintain a constant improvement program for defect reduction/yield improvement. Review and document XLD issues to ensure root cause, follow-up documentation, and communication across TD & HVMs. Review and identify hardware related failures and create and execute plans to fix root-cause. Partner with suppliers to resolve tool problems, defect issues, and maximize tool availability. Improve communication and collaboration with vendors and area, department, and network partners. Collaborate with supervisors and areas leaders to create personal performance and development goals. Communicate proactively with ME shift a

Technical Program Manager III itD is seeking a Technical Program Manager III to drive hardware program execution for next-generation AR wearable devices. This role will play a critical part in managing PCB development and electrical component integration, ensuring seamless collaboration between electrical engineering, layout, and manufacturing teams. The ideal candidate will bring deep experience in hardware engineering or program management and a proven track record of delivering complex PCB and wearable device programs from design through production. Location: Onsite – Sunnyvale, CA Duration: 12 Months (potential for extension / FTE conversion) Pay Rate: $75 - $80 per hour, depending on experience We provide comprehensive medical benefits, a 401k plan, paid holidays, and more. Please note that we are only considering direct W2 candidates at this time, as we are unable to offer sponsorship. Responsibilities Lead end-to-end program management of PCB development, including flex circuits and multi-layer boards (MLBs) from design through production Drive design release processes, ensuring alignment across electrical engineering, layout, and cross-functional teams Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds, optimizing for schedule, quality, and yield Collaborate closely with electrical and layout engineers to develop and refine circuit designs for compact wearable devices Track program schedules, dependencies, and risks, proactively driving mitigation strategies Coordinate with APAC-based teams and vendors, including participation in early morning or evening meetings Ensure successful integration of small electrical components into advanced AR wearable form factors Provide strong program leadership, driving ownership, clarity, and execution across stakeholders Internal Responsibilities Attend regular internal practice community meetings Collaborate with your itD practice team on industry thought leadership Complete client case

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related brea

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Process Equipment Engineering (PEE) Project Title AI-Enabled CMP Equipment Health & Breakage Risk Prediction Dashboard Project Description Chemical Mechanical Planarization (CMP) tool performance directly influences wafer quality, equipment reliability, and manufacturing efficiency. This project focuses on developing an AI-Enabled dashboard that integrates fab equipment and manufacturing data to identify early indicators of wafer breakage, equipment degradation, and yield excursions. The intern will work on data exploration, predictive analytics, and visualization techniques to develop an intelligent monitoring solution that enables proactive decision-making. Through this project, the intern will gain exposure to semiconductor manufacturing equipment, reliability engineering methodologies, Artificial Intelligence applications, and data-driven engineering practices within a high-volume manufacturing environment. Objective of the Project Develop an AI-Enabled equipment monitoring and risk prediction dashboard capable of identifying potential CMP tool-related wafer breakage and excursion risks before significant manufacturing impact occurs. Oppo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunity At Micron, you'll join a world-class team that is ambitious and committed to delivering flawless results. As an MTB PWF TF Process Engineer, you will work with pioneering technology and processes vital to developing our innovative products. This position provides an outstanding mix of challenges and opportunities to help you grow professionally while contributing to a global industry leader's success. Responsibilities Identify, diagnose and resolve assembly process-related problems to ensure smooth operations. Coordinate and complete process, equipment, and material evaluation/optimization initiatives, implementing changes at various process steps. Lead and participate in continuous yield improvement and cost reduction activities to drive efficiency. Validate and fan out new process baselines, including new processes, tools, and materials for new product introductions. Support SPC (Statistical Process Control), FDC (Fault Detection and Classification), RMS (Reliability Monitor System), and APC (Advanced Process Control). Ensure portability of processes across different sites to maintain consistency and quality. Manage and audit material suppliers to achieve quality, cost, and risk management objectives. Support both internal and external audits to guarantee compliance and excellence. AI Agent Development & Workflow Automation Generative AI for Manufacturing Analytics <d

InMobi (Corporate) InMobi Group is a global technology company shaping the future of agentic commerce and advertising. Through its ecosystem of businesses — including InMobi Advertising and flagship consumer platform Glance — InMobi leverages data, machine learning, and generative AI to help brands reach audiences more precisely and consumers discover products more intuitively. Glance, which is pioneering new models of agentic commerce, is owned and operated by Glance InMobi Pte. Ltd., a non-consolidated subsidiary of InMobi Pte. Ltd. InMobi Advertising InMobi Advertising, part of global technology company InMobi, is an agentic advertising platform helping brands and merchants achieve their business outcomes. Through its proprietary intelligence, AI-led solutions, and vast consumer reach — including flagship consumer platform Glance — InMobi Advertising delivers the omnichannel performance defining what's next in advertising and commerce. Glance is owned and operated by Glance InMobi Pte. Ltd., a non-consolidated subsidiary of InMobi Pte. Ltd. To learn more, visit advertising.inmobi.com. Glance Glance is an intelligent shopping agent, redefining the commerce experience. Powered by proprietary agentic intelligence and generative AI, Glance delivers a hyper-personalized consumer experience across mobile and TV — shaping the new era of shopping. Glance is operated by Glance InMobi Pte. Ltd., a non-consolidated subsidiary of global technology leader InMobi, and is backed by Mithril Capital, Google and Jio Platforms. To learn more, visit glance.com. Overview of the Role: We are looking for a Machine Learning Engineer to develop and optimize our ad science models, open-source LLMs, and the underlying infrastructure that powers them — with a constant eye toward performance and cost. AI and ML sit at the core of InMobi's business, and our science teams are tackling some of the field's most interesting problems: creative optimization, user personalization, targeting, yield m

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Diffusion Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our DIFI equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Installation and qualification of industry leading diffusion equipment in our new cleanroom Diffusion equipment performance, inc

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Senior Manufacturing Engineer serves as the senior technical authority for assembly process and equipment design within the Industrialization team. This position designs the assembly lines, fixtures, and material flow systems that convert KARNO prototype and development builds into repeatable, scalable production operations — and then systematically removes waste, labor content, and variation from those operations. Working closely with industrialization leadership, design engineering, production, quality, and supply chain, the Senior Manufacturing Engineer owns the most complex assembly value streams end to end: line and station design, fixture and tooling design, material presentation and handling, process qualification, and continuous waste reduction. This position sets the technical standard for how assembly processes are designed and documented at Hyliion, provides mentorship and design review for other manufacturing engineers, and is accountable for measurable improvement in cycle time, first-pass yield, labor content, and ergonomics across the assembly areas. AI at Hyliion At Hyliion, AI is core to how we work. We equip every team member with leading AI tools and count on you to use them — to move faster, solve harder problems, and help us realize the full potential of KARNO technology for the world. Duties and Responsibilities Assembly Line and Cell Design : Design assembly lines, cells, and workstations for KARNO core, module, and subassembly operations. Establish work sequencing, balance work content to takt, define station layouts and footprints, and design lines that accommodate planned rate increases rather t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Opportunity Summary: For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. The Sr. Dry Etch Equipment Engineer is responsible for driving equipment reliability, long‑term corrective actions, and performance optimization of Dry Etch toolsets in a high‑volume semiconductor manufacturing environment. This role leads systematic solving, eliminates chronic failures, improves tool health, and partners closely with Production, Process Engineering, and suppliers to support yield, cycle time, and cost‑reduction goals. The engineer provides technical leadership, drives continuous improvement, and ensures the Dry Etch area operates with high stability, quality, and efficiency. (Disclaimer) While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a team member who is anxious to grow in both technical breadth and depth. If you are open to learning from and being a valued member of a team of seasoned engineers, we are eager to help build on your existing foundation and expand your individual and collaborative skills in this exciting and unique opportunity. What’s Encouraged Daily: Lead detailed, root‑cause‑focused fixing to eliminate ch