Principal Engineer in Japan

業務内容 次世代DRAM技術開発におけるプロセスインテグレーション業務を担当いただきます。 将来世代DRAMノード向けプロセス技術の開発および統合 キャパシタモジュールの設計、開発、最適化 複数のプロセスモジュールにまたがるインテグレーション業務 DOE（実験計画法）の設計・実行、およびデータ解析によるプロセス条件の最適化 歩留まりおよび品質に関する課題の特定と解決 プロセス、設計、デバイス、品質部門との連携 応募資格 技術要件 半導体プロセスに関する基礎知識 プロセスインテグレーションまたは関連するエンジニアリング分野の知識…

As the Operations Central Team (OCT) Dry Etch Tool Installation Qualification (TIQ) Engineer at Micron Technology, Inc., you will be building growth mindset, facilitate and drive improvement on Micron TIQ engineering globally, driving global business processes, and enabling the…

Staff/Principal Engineer, Operations Central Team Dry Etch Tool Installation Qualification at Micron in Hiroshima, Fab 15, Japan. Full-time · On-site.

Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data‑driven root‑cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM)…

Role Purpose Provide technical leadership for mechanical facilities systems including HVAC, cooling water, exhaust, and thermal management infrastructure in designated Japan site. Key Responsibilities Lead construction of major mechanical utility systems (PCW, CTW, HVAC,…

Role Purpose Lead design, construction, and commissioning for high‑purity gas and chemical distribution systems supporting semiconductor manufacturing in designated Japan site. Key Responsibilities Oversee engineering design, installation, and qualification of bulk/specialty…

Role Purpose Lead instrumentation, monitoring, and controls systems engineering for facilities utilities in semiconductor construction projects. Key Responsibilities Design and implement control schemes for utilities (gas, chemical, water, HVAC, electrical). Develop P&IDs,…

Role Purpose Lead civil, structural, and architectural design and construction for semiconductor buildings and supporting structures. Key Responsibilities Oversee site civil works, foundations, structural steel, seismic design, architectural finishes, and building envelopes.…

Role Purpose Lead construction and start‑up of electrical infrastructure supporting high‑availability semiconductor operations in designated Japan site. Key Responsibilities Oversee design and installation of substations, switchgear, UPS, emergency power, grounding, and…

Role Purpose Deliver ultrapure water (UPW), waste treatment, and water infrastructure projects for semiconductor facility expansion in designated Japan site Key Responsibilities Lead UPW plant construction, wastewater treatment upgrades, and distribution system installations.…

Build What’s Next in Spares Engineering Your Opportunity Join a high-impact engineering team where your ideas can shape performance across a global semiconductor manufacturing network. In this role, you will lead Spares Engineering initiatives across cost, productivity, quality,…

As the Operation Central Team (OCT) team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process/equipment expert in CMP Process,…

As a Central Product Integration Engineer at Micron Technology, you will provide technical leadership across the global Micron network to drive yield, product quality, and New Product Introduction (NPI) through deep technical expertise, business process development, and project…

As the OCT (Operations Central Team) MTE Materials Cash Cost Leader at Micron Technology, you will drive material cost reduction for Front End manufacturing. You will lead Value Engineering (VE), alternate sourcing, consumption optimization, and materials strategy to deliver…

Our vision is to transform how the world uses information to enrich life for all . As a team member of technology development reliability group, you will be working with DRAM device/process development team and circuit design team. You will be responsible for analyzing…