Principal Staff Engineer in Singapore

Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Role Summary: As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test…

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Job / Role Summary The Staff Engineer owns defined Realtime Defect Analysis (RDA) scope within NAND Technology Development, developing and sustaining advanced defect detection and inspection strategies that accelerate learning, improve yield, and support technology transfer to…

As a key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and…

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked…

Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory…

Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering at Micron in Singapore.

Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis at Micron in Singapore.

Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and…

Staff/ Principal Engineer, OCT MTE Material Engineering at Micron in Singapore. Full-time · On-site.

Staff/Principal Engineer, NAND Product Engineering at Micron in Singapore.

Principal Engineer - Process Development, CMP, NAND Job / Role Summary The Principal Engineer provides technical leadership for Chemical Mechanical Planarization (CMP) process development supporting advanced 3D NAND and future technology nodes. This role leads process…

About the Role: Join our Product Engineering team to develop AI and Machine Learning solutions that transform semiconductor workflows. This role focuses on model development and agentic AI applications, enabling smarter testing, faster yield advancement, and engineering…

As a Staff/Principal NAND CMOS Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D…