Cad Cam Programmer And Prototype Engineer Titleist in United States

Product Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced memory products. This role spans backend implementation from Netlist to GDSII, with a strong focus on timing closure, power integrity, and manufacturability in advanced process technologies. The successful candidate will work closely with RTL, DFT, CAD, and verification teams to deliver high‑quality physical designs, contribute to methodology improvements, and help push performance, power, and area (PPA) targets in complex, multi‑hierarchy designs. Key Responsibilities: Own and execute physical design implementation from synthesized netlist through GDSII, including floorplanning, placement, clock tree synthesis, routing, and physical signoff Utilize AI-Enabled tools in the Netlist to GDS flow Perform and drive timing closure across multiple modes, corners, and scenarios using industry‑standard STA tools Analyze and resolve congestion, timing, IR drop, EM, and power integrity issues Develop and refine floorplans, power grids, and clocking strategies for high‑performance designs Work with placement and timing closure of custom analog hard IP macros in a digital-on-top design flow Collaborate closely with RTL designers to influence partitioning, constraints, and micro‑architecture decisions early in the design cycle Implement and va

We're looking for a Senior Mechanical Engineer for Midjourney Medical — from precision electromechanical assemblies up to the large-scale structures and mechanisms that hold everything together and make it move. This role spans the full range of scale: one week you might be refining a compact transducer mount, the next you're architecting a structural frame or designing the motion system that positions hardware within it. This is a hands-on role on a small cross-functional team. You'll take problems from whiteboard sketch to working hardware yourself — designing in CAD, prototyping in the shop, testing, iterating, and integrating with research teams, electrical and software engineers along the way. We move fast and expect you to drive your own work: identifying what needs to happen next, making sound engineering calls without waiting for permission, and shipping hardware that works. What you'll do Own parts of the mechanical systems end to end — structures, mechanisms, and electromechanical integration Design large-scale structures: frames, weldments, enclosures, and support systems, with attention to stiffness, weight, manufacturability, and serviceability Design mechanisms: linkages, motion stages, actuation systems for precise, reliable positioning and articulation Integrate transducers, electronics, cabling, and thermal management into large physical systems Perform engineering analysis (tolerance stack-ups, structural/FEA, mechanism kinematics) to de-risk designs before committing to hardware Build and test relentlessly — 3D printing, rapid prototyping, and hands-on fabrication are core to how you'll validate designs Select parts and materials for system-level integration, balancing performance, cost, and lead time Drive projects independently from concept through validation, and collaborate closely with a small cross-disciplinary team to hit project goals What we're looking for Bachelor's degree in Mechanical Engineering or a related field 5+ years of experien

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity We are looking for a recent graduate or early-career engineer to join the Mech/Thermal Platform team as a Graduate Mechanical Engineer. You will contribute to the mechanical design, thermal validation, and verification of advanced AI hardware and data center systems. You will work with experienced mechanical, thermal, hardware, and systems engineers throughout the development lifecycle. The role combines 3D computer-aided design, prototype evaluation, lab testing, data analysis, troubleshooting, and clear engineering documentation. What You Will Do Create and update mechanical parts, assemblies, and drawings using Creo or comparable 3D CAD software. Take ownership of defined mechanical design tasks from requirements and concepts through detailed design, review, release, and verification. Apply mechanical design, materials, manufacturing, heat transfer, and thermodynamics principles to engineering decisions. Develop mechanical and thermal test plans and procedures for prototypes and development systems. Set up and operate laboratory equipment, collect accurate data, analyze results, and document conclusions. Evaluate prototypes and identify mechanical, thermal, assembly, or manufacturability issues. Support design verification, troubleshooting, root-cause analysis, and implementation of verified design improvements. Maintain accurate engineering documentation, including design notes, drawings, test procedures, results, and change r

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. We are seeking a Senior Mechanical Engineer to support new product development in genomics instrumentation. This is a highly technical mechanical design role focused on the development of custom mechanisms, precision motion systems, and electromechanical assemblies used in advanced instrumentation. The ideal candidate will be an engineer with experience designing motorized mechanisms and precision motion systems, including a strong understanding of system requirements, motion architecture, controls integration, structural design, and performance validation. The ideal candidate also has experience developing motion solutions from requirements through implementation and understands the engineering principles behind achieving precise, reliable motion in complex systems. Responsibilities Design and develop custom mechanical mechanisms for use in genomics instruments, including motion systems, precision assemblies, and fluidic or sample‑handling components. Integrate mechanical designs with electrical, firmware, and control systems Create and maintain 3D CAD models, engineering drawings, and support

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Air Proprietary Tooling Engineer (Entry-Level or Associate) Company: The Boeing Company The Boeing Defense, Space & Security (BDS) team is seeking motivated Tooling Engineers located in Berkeley, MO . This role will support design, development, installation, and sustainment of production tooling and assembly aids used across manufacturing and maintenance programs. The role partners with manufacturing, quality, suppliers, and design engineering to deliver safe, compliant, and cost-effective tooling solutions that enable efficient production. At The Boeing Company, our mission is to connect, protect, and explore our world and beyond. Position Responsibilities Develop and qualify production tooling, jigs, fixtures, and assembly aids from concept through production release Translate manufacturing and design requirements into tooling specifications, drawings, 3D CAD models, and bill of materials Perform tolerance stack-up, fit checks, and tooling validation through analysis, prototyping, and hands-on trials Support tooling fabrication and inspection, including supplier management, fabrication oversight, and acceptance criteria verification Lead root-cause analyses for tooling-related manufacturing issues and implement corrective actions and continuous improvement Create and maintain tooling documentation: process plans, safety assessments, work instructions, inspection plans, and change records Collaborate with multidisciplinary teams—manufacturing, quality, stress, systems, and supply chain—to ensure tooling meets program schedule, safety, and quality goals Ensure compliance with company and regulatory standards, maintain configuration control and toolin

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in Node Development group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry leading DRAM! You will engage on new technology at design start and be part of a team responsible for delivering technology to enable the full product portfolio, initial device qualification and production ramp. This will be accomplished through innovation and by cross-functional engagement with partner groups; Design, Test, Technology Development, Marketing, Manufacturing and Quality Assurance departments to co-optimize product and process. While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world-class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity. Responsibilities Include: Enable new process node startup, qualification, yield, and ramp Collaborate with internal engineering groups; Design, Technology Development, Design for Test, and Quality teams to understand yield issues and priorities. Provide direction to development teams using thorough knowledge for process integration Develop and key metrics for feedback on a new technology Support design verification and validation using CAD tools and simulation

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an Physical Design Engineer to lead cross-functional efforts to solve complex physical design challenges and develop end-to-end RTL-to-GDS methodologies across advanced nodes, with a strong focus on PPA and runtime improvements. The engineer will architect, integrate, and deploy AI/ML-driven solutions into production physical design flows, creating custom CAD tools and partnering with internal teams and EDA vendors to drive next-generation, ML-enabled capabilities. This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are BS in Electrical or Computer Engineering (or equivalent experience) with 5+ years in Physical Design CAD methodology at advanced nodes. Proven track record improving PPA and/or runtime on high-performance, low-power taped-out designs. Hands-on with industry-standard EDA tools (e.g., Fusion Compiler) across synthesis, P&R, STA, signoff, and hierarchical flows. Strong Python/Tcl and data skills, with interest or experience in ML frameworks (PyTorch, TensorFlow), and the ability to drive complex projects independent

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Our IP delivery timelines are set as much by flow maturity as by design work. This role develops, deploys, and owns the RTL-to-GDSII methodology the IP physical design team runs on, so a new block, node, or customer variant starts from a working flow instead of a cold start. This role is hybrid, based out of Toronto, ON; Austin, TX, or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A physical design or CAD methodology engineer who has built flows that production teams depend on daily. Automation-minded, happiest when you are removing manual steps and making PPA exploration repeatable. Building with AI as part of how you develop flows, and opinionated about where LLMs and ML-driven optimization genuinely help versus where they do not. An effective partner to design teams and EDA vendors, and a clear writer who documents flows well enough that others can run them without you. What We Need An Engineer with 5+ years developing and supporting physical design methodology or CAD flows in production use. Expertise with industry-standard tools (FusionCompiler/ICC2, Innovus/Genus, PrimeTime, RedHawk) and scripting languages (T

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure. A hands-on problem solver who excels at debugging and driving signoff through complex verification flows. A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces. A mentor and technical leader passionate about building efficient, manufacturable silicon. What We Need BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verif

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking Manufacturing Engineers to lead the development of processes, tooling, and prototype builds for custom motors and actuators. You will own a primary area as a Stator Process / Manufacturing Engineer, Tooling / Fixture Engineer, or Prototype Manufacturing Engineer, taking that work from early development through validation and repeatable execution in close partnership with mechanical, electromagnetic, electrical, test, quality, and supplier teams. These roles focus on the development, integration, and validation of electromechanical manufacturing capabilities, including stator winding processes, assembly and inspection tooling, and actuator prototype builds. You will help translate engineering designs into reliable hardware while establishing scalable processes, equipment, and build practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 5 days a week. In this role, you will Each opening focuses on one of the three specialties below, with shared responsibility for reliable processes and hardware. Stator Process / Manufacturing: develop and validate stacking, winding, termination, and potting processes. Establish process parameters, work instructions, and defect controls that produce consistent results across trained operators. Tooling / Fixture: design and deliver winding tools, assembly fixtures, inspection gauges, and bench equipment, from CAD and drawings through fabrication, commissioning, and troubleshooting. Improve setup time, labor, and repeatability. Prototype M