Design Methodology in United States

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We're looking for an Optical Interconnect System Engineer to design, qualify, and deploy scalable optical connectivity for large-scale AI infrastructure. This role spans fiber-system architecture, optical-mechanical integration, validation, reliability, deployment, and serviceability. You will work with optical, mechanical, electrical, networking, manufacturing, reliability, and data-center teams to translate system needs into practical interconnect solutions. This is a hands-on role for someone who can connect design decisions with installation, qualification, troubleshooting, and long-term operational performance. In this role, you will: Define optical interconnect architectures and requirements across hardware platforms and rack-level systems. Design high-density fiber systems for performance, density, reliability, installation, and serviceability. Lead optical-mechanical integration and cross-functional design reviews. Develop test and qualification plans for optical components, modules, switching platforms, and integrated systems. Own optical loss budgets, routing guidelines, handling requirements, and serviceability criteria. Support system bring-up, deployment, troubleshooting, failure analysis, and reliability improvement. Create reusable design guidelines, interface requirements, and qualification methods. You might thrive in this role if you have: Core experience Experience desi

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role As an Engineer on our hardware optimization and co-design team, you will co-design future hardware from different vendors for programmability and performance. You will work with our kernel, compiler and machine learning engineers to understand their unique needs related to ML techniques, algorithms, numerical approximations, programming expressivity, and compiler optimizations. You will evangelize these constraints with various vendors to develop and influence future hardware architectures towards efficient training and inference on our models. If you are excited about efficiently distributing a large language model across devices, dealing with and optimizing system-wide/rack-wide networking bottlenecks and eventually tailoring the compute pipe and memory hierarchy of the hardware platform, simulating workloads at different abstractions and working closely with our partners, this is the perfect opportunity! This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. Key Responsibilities Co-design future hardware for programmability and performance with our hardware vendors Assist hardware vendors in developing optimal kernels and add support for it in our compiler Develop performance estimates for critical kernels for different hardware configurations and drive decisions on compute core and memory h

Associate Systems Engineering Support Analyst Company: The Boeing Company Boeing Defense, Space & Security (BDS has an exciting opportunity for an Associate Systems Engineering Analyst (Level 2) for Flight Simulation Labs , located in Berkeley, MO . The Flight Simulation Labs organization has expertise supporting marketing, design, development, integration, test and training objectives for Boeing military aircraft. As a Systems Engineering Analyst, you will be responsible for researching, analyzing, and compiling technical data to optimize system performance throughout the program lifecycle. You will apply systems engineering processes, methodologies, and tools to develop and refine system architectures, functional requirements, and product designs for programs such as T-7, F-15, F-18, and MQ-25. Position Responsibilities Apply systems engineering methodologies to design, develop, and maintain systems, tools, and new product solutions Serves as system administrator for Engineering tools in the Flight Simulation Labs organization Identifies opportunities and implements data analysis and automation including dashboard and reporting for the organization Derives and develops basic architecture, functional requirements, and product designs, ensuring alignment with project objectives Collaborates with cross functional project teams including engineering, IT, cyber, networking, software, customers, and suppliers to achieve organizational goals Engages in continuous improvement initiatives for all Flight Simulation Labs processes and tools This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government re

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI is developing custom silicon to power the next generation of frontier AI models. We’re looking for experienced Design Verification (DV) Engineers to ensure functional correctness and robust design for our cutting-edge ML accelerators. You will play a key role in verifying complex hardware systems—ranging from individual IP blocks to subsystems and full SoC—working closely with architecture, RTL, software, and systems teams to deliver reliable silicon at scale. In this role you will: Own the verification of one or more of: custom IP blocks, subsystems (compute, interconnect, memory, etc.), or full-chip SoC-level functionality. Define verification plans based on architecture and microarchitecture specs. Develop constrained-random, directed, and system-level testbenches using SystemVerilog/UVM or equivalent methodologies. Build and maintain stimulus generators, checkers, monitors, and scoreboards to ensure high coverage and correctness. Drive bug triage, root cause analysis, and work closely with design teams on resolution. Contribute to regression infrastructure, coverage analysis, and closure for both block- and top-level environments. You might thrive in this role if you have: BS/MS in EE/CE/CS or equivalent with 3+ years of experience in hardware verification. Proven success verifying complex IP or SoC designs in industry-standard flows Proficient in SystemVerilog, UVM, and common simulation and debug tools (e.g., VCS, Questa, Verdi). Strong knowledge

Who we are About Stripe Stripe is a financial infrastructure platform for businesses. Millions of companies - from the world’s largest enterprises to the most ambitious startups - use Stripe to accept payments, grow their revenue, and accelerate new business opportunities. Our mission is to increase the GDP of the internet, and we have a staggering amount of work ahead. That means you have an unprecedented opportunity to put the global economy within everyone's reach while doing the most important work of your career. About the team Stripe’s Design organization builds the product and brand experiences that millions of businesses and developers rely on. We’re a cross-functional, global organization of product designers, content designers, design researchers, design systems engineers, motion designers, and design program specialists. Our mission is to make economic infrastructure simple and accessible. Design plays a central role by making complex flows understandable, crafting clear product language, and building consistent systems that scale. The Design Operations team leads Design’s business operations, runs cross-organizational programs, and builds the systems that help teams collaborate and produce high-quality work. Design Program Managers guide complex programs through the design lifecycle and apply design thinking to our operating model. They prototype and iterate on how our team works. We’re looking for a Design Program Manager to partner with the Research team. This full-time role reports to the Head of Design Operations. What you’ll do Responsibilities Lead and build programs for the Research organization. Develop and implement processes and resources that support impactful research and scale the use of user insights across Stripe. Improve our operating model and processes, including automating tasks, improving workflows, and developing repeatable methodologies. Measure the impact of these changes. Prepare researchers to use agentic workflows, including des

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Our Tensix team is building custom AI compute cores, RISC-V CPUs, and chiplet-based architectures for datacenter, edge, and automotive AI. Design Verification Engineers on this team validate compute IP and subsystems and build scalable DV infrastructure to keep verification fast, automated, and production-grade. This role is hybrid, based out of Toronto, ON, Austin, TX or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Experienced in modern verification methodologies with strong SystemVerilog skills and exposure to structured testbench development. Comfortable working from block-level to system-level verification and reasoning about microarchitecture behavior from specs and waveforms. Proficient in Linux environments with Python, or Bash scripting for automate builds, parse logs, manage CI pipelines. Skilled in coverage-driven verification and confident debugging across RTL, testbench, and workload scenarios. Motivated by AI hardware and eager to learn verification strategies for new architectures and domains. What We Need Contribute to verification of Tensix IP and subsystems from early planning through tape-out, owning cov

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We’re looking for a Timing Engineer to join our silicon team. In this role, you’ll drive static timing analysis and closure for complex, high-performance designs. You’ll collaborate closely with logic, DFT, and physical design teams to debug constraints, optimize paths, and ensure our chips meet performance targets across corners and modes. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Experienced in STA and passionate about enabling silicon to meet aggressive performance goals. Analytical and detail-oriented, with a strong understanding of timing paths, constraints, and optimization strategies. A collaborative team player who works well across logic, DFT, and physical design boundaries. Resourceful and self-driven, capable of developing scripts and methodologies that improve timing closure workflows. What We Need 7+ years of industry experience and a proven record of successful tapeouts. Deep knowledge of STA tools and techniques, including noise, crosstalk, and OCV analysis. Proficiency in writing and debugging SDC constraints, creating ECOs, and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will be joining a brilliant team to collaborate with Micron’s various design and verification teams all over the world, support the efforts of design verification flow development, optimization, and implementation and work with cross-functional team to assure the best cost, quality, reliability, time-to-market, and customer satisfaction As Memory Design Group CAD Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, developing enhancing and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits. You will work closely with the Design, Layout teams, supporting their use of electronic design automation tools and methodologies to increase design and layout productivity and work efficiency. Responsibilities : Develop tools, flows, and methodologies to increase the productivity and reliability of our Memory designs Integrate commercial EDA (Electronic Design Automation) tools into design flows Provide training, documentation, and support to end users on new tools and method. Work closely with design, layout, verification and process teams. Undertake independent research and development of ne

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. NVIDIA is seeking best-in-class ASIC Verification Engineers to verify the design and implementation of the world’s leading inference accelerator. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of outstanding people around the globe. Their mission is to push the frontiers of what is possible today and define the platform for the future of computing. In this position, you will help to build the high-performance processor elements that implement programmable compute and graphics functionality. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of inference accelerator You will be responsible for verification of the ASIC design, architecture, reference models and micro-architecture using advanced verification methodologies Understand the design and implementation of your unit, define the verification scope, develop the verification infrastructure and verify the correctness of the design Collaborate with architects, designers, and pre and post silicon verifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de