Design Quality Engineer in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will be joining a brilliant team to collaborate with Micron’s various design and verification teams all over the world, support the efforts of design verification flow development, optimization, and implementation and work with cross-functional team to assure the best cost, quality, reliability, time-to-market, and customer satisfaction We are seeking a talented CAD senior engineer specialized in analog and digital simulations to join our high-achieving engineering team. As a CAD senior engineer, you will play a pivotal role in optimizing and simulating complex analog and digital circuits, contributing to the development of state-of-the-art products that shape our industry. You will get a chance to develop the industry's first and unique flows to enhance productivity and reduce pre-silicon failures. Responsibilities: Work closely with memory design teams and solve their daily challenges and provide complete solutions for the future. Proactively identify problem areas for improvement, propose, and develop innovative solutions. Develop highly scalable, and clean software systems. Continuously evaluate and implement new tools and technologies to improve the current software flows. Work with EDA vendors to evaluate and integrate E

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a mid- to senior-level Physical Design Engineer who will contribute to the physical design of high-performance chips for industry-leading AI/ML architectures, spanning implementation from synthesis through tapeout. You will partner with front-end and physical design engineers to optimize floorplanning, timing, power, performance, and area across multiple IPs. Along the way, you will build end-to-end ASIC expertise while learning from experienced engineers across the chip development process. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An engineer excited to work on high-performance designs for industry-leading AI/ML architectures. A collaborative problem solver who enjoys working with experienced engineers across ASIC disciplines. Grounded in logic design fundamentals and gate- and transistor-level implementation. Curious about how early architectural and RTL decisions shape physical implementation and final chip quality. What We Need A BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a relat

Work Flexibility: Onsite What You Will Do: This role is on the Electrical Engineering team at Stryker Medical division's Acute Care business unit. We primarily work with patient handling and patient care equipment within the hospital space such as stretchers, hospital beds, and support surfaces. This role falls under the team addressing the high-acuity market, with a focus on products that often come into direct contact with patients. It includes gaining a deep understanding of customer needs through research and partnership with upstream marketing and through direct interactions with customers. Working with a diverse team, you will design, develop, modify, evaluate, and verify electrical components and sub-systems for medical devices. The role includes the full development process from research to product launch. Design and develop electrical circuits and subsystems for medical devices. Coordinate engineering changes and complete documentation in accordance with quality management system requirements. Review and modify C/C++ code to support product functionality and performance Apply electrical system and circuit test methods to evaluate product designs. Build and support prototypes and conduct bench testing activities. Collaborate with manufacturing, sourcing, and cross-functional teams to support ongoing production activities. Analyze and test designs for electromagnetic compatibility, reliability, safety, manufacturability, and testability. Support

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent licenses RISC-V and AI IP to customers who need hardened, PPA-proven deliverables on their target node and foundry. This role owns physical implementation of those IP blocks end to end, from synthesis through PnR, timing closure, and GDSII signoff, and directly determines how fast we can commit to a customer's timeline. This role is hybrid, based out of Toronto, ON; Austin, TX; or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on physical design engineer who owns blocks end to end, with a track record of block-level and IP tapeouts on advanced nodes. Driven by PPA outcomes, working closely with RTL owners to close critical paths and hit power budgets. Rigorous about signoff quality, because our IP ships to customers who integrate it without you in the room. What We Need BS/MS/PhD in EE/ECE/CE/CS with 5+ years of block-level or IP-centric physical design through tapeout. Expertise with industry-standard tools (Innovus, ICC2/FusionCompiler, PrimeTime) and scripting languages (Tcl, Python, Perl). Deep understanding of advanced node challenges, low-power design (UPF, power gating, multi-Vt, voltage sc

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a highly skilled Physical Design Engineer with deep expertise in physical design and methodology. This individual contributor role sits within our physical design team and is central to delivering power, performance, and area (PPA) optimized datapath and interconnect solutions for next-generation AI accelerators. You’ll work closely with RTL designers to define and execute on physical design strategies. You will develop tools, flows and methodologies to increase team productivity. Your work will directly impact silicon’s performance and cost efficiency, as well as the team’s execution velocity and quality. In this role, you will: Develop, build and own tools, flows and methodologies for physical implementation Own physical implementation of floorplan blocks from floorplanning to final signoff Collaborate with RTL designers to drive optimal block implementation solutions Analyze and optimize design for timing, power, and area trade-offs, working in collaboration with EDA vendors and ASIC partners Qualifications: BS w/ 4+ or MS with 2+ years or PhD with 0-1 year(s) of relevant industry experience in physical design and methodology development Demonstrated success in taping out complex silicon designs Hands-on experience with block physical implementation and PPA convergence Strong coding experience with python, bazel, TCL Strong experience building physical design tools, flows and methodologies Strong understanding of microarchitecture, RTL design,

About the Team OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core platform development, embedding deeply with customers to translate frontier model capabilities into systems that materially improve engineering workflows and accelerate innovation. Our work turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem. About the Role We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time. In the near term, you will serve as the team’s physical design SME across semiconductor deployments: helping FDEs, Product, and Research understand backend implementation workflows, pressure-test AI-assisted solution ideas against real physical design constraints, and raise the quality of our customer-facing technical work. You will help the broader team build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice. Over time, we expect this role to expand beyond SME support into broader FDE ownership: partnering directly with customers, shaping deployment strategy, building and iterating production-grade AI systems, driving technical workstreams, and helping turn high-touch semiconductor deployments into repeatable solutions. This is a strong fit for someone who brings deep physical design expertise today and is excited to grow into a customer-facing, syst

ABOUT BASETEN Baseten powers mission-critical inference for the world's most dynamic AI companies, like Cursor, Notion, OpenEvidence, Abridge, Clay, Gamma and Writer. By uniting applied AI research, flexible infrastructure, and seamless developer tooling, we enable companies operating at the frontier of AI to bring cutting-edge models into production. We're growing quickly and recently raised our $1.5B Series F , led by Altimeter Capital, Conviction Partners, and Spark Capital. Join us and help build the platform engineers turn to to ship AI products. THE ROLE We're looking for a Web Designer / Design Engineer to own baseten.co day to day, from concept through production. You'll design and build landing pages, bring product launches to life, run experiments, improve conversion, and keep raising the quality bar on the site. This is a high-ownership role on the brand design team, sitting between brand design and frontend engineering. We want the website to be one of the best expressions of the Baseten brand and one of the best developer-focused sites on the internet, which means treating it as a product that's constantly evolving rather than something we redesign every few years. You'll have a lot of autonomy to ship, while partnering closely with brand, product marketing, engineering, and leadership on bigger launches. RESPONSIBILITIES Own the design and frontend implementation of the Baseten marketing site. Ship landing pages, product pages, launches, and campaigns from concept through production. Improve the site continuously, finding and acting on opportunities to make it better rather than waiting for a redesign cycle. Partner with growth and product marketing to test messaging, layouts, and conversion improvements without sacrificing craft. Build polished interactions, motion, and details that make the site feel distinctly Baseten. Build and evolve the components, patterns, and design systems that let the team move quickly without lowering the bar. Turn complex

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing solutions that shape the future of memory products in a fast-paced, learning-focused environment. As a Design Verification Engineer, you will help develop next-generation memory technologies by verifying and optimizing digital and analog circuit designs. In this role, you will work closely with global multi-functional teams across the product lifecycle to deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Your work will directly contribute to bringing advanced memory products from concept to production. Responsibilities: Verify circuit functionality, reliability, power, and compliance with product specifications Drive verification planning, coverage closure, circuit debug, and design improvements Perform circuit modeling and simulation using industry-standard tools Support silicon validation, reticle experiments, and tape-out activities Partner with engineering, manufacturing, and product teams to deliver manufacturable designs Minimum Qualifications: Bachelor’s degree in Electrical Engineering or a related field 4+ years of semiconductor design, verifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

NVIDIA silicon runs the world's AI infrastructure. The frequency it delivers across every voltage, process corner, and workload is not assumed. It is measured, correlated, and validated. This role does that work. The Silicon Co-Design Group is where architecture intent becomes silicon reality. We own the boundary between what was designed and what was built, and we are the team that knows the difference. When a program ships at frequency and at quality, this team is a reason why. You will be the person who follows through between simulation and silicon. When the model is wrong, a frequency corner that doesn't hold, a Vmin that walks, a critical path that timing analysis missed, you find out why, and your data is what the rest of the program acts on. Architecture, design, and product teams do not guess. They use your numbers. The engineers who do this well are rare. They think like circuit designers, work like experimentalists, and reason like data scientists. If that is you, read on. What you'll be doing: Own silicon speed characterization from first power-on through production sign-off, covering frequency, Vmin, Vmax, and timing margins across the full PVT space. Close the correlation gap. Tie pre-silicon timing analysis and critical path predictions to measured silicon, quantify where the model diverges from reality, and produce analysis that architecture and design can act on with confidence. Trace failures to their source, whether a microarchitectural bottleneck, a critical path that doesn't close under voltage, a clocking issue, or a process corner the model didn't anticipate, and drive the resolution. Own and build AI agents that work at your direction: automated test orchestration, intelligent data pipelines, and analysis flows that expand coverage and compress cycle time without sacrificing difficulty. Know where AI accelerates real work and whe

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure. A hands-on problem solver who excels at debugging and driving signoff through complex verification flows. A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces. A mentor and technical leader passionate about building efficient, manufacturable silicon. What We Need BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verif

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned physical design engineer who thrives on complex, full-chip implementation challenges. Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams. Passionate about optimizing chip-level implementations for power, performance, and area. Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules. What We Need 8+ years of top-level SOC physical design experience on complex, multi-million gate designs. Deep expertise in hierarchic

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a software engineer to help build the design methodology, software abstractions, and infrastructure that enable a small silicon team to develop complex chips rapidly and with high confidence. You will turn evolving architecture and design needs into reusable tools and workflows that improve iteration speed, quality, and then apply those tools to help construct world-class silicon. You’ll work closely across architecture, design, verification, performance modeling, and systems software. This role is well suited for an engineer who enjoys building high quality software and is motivated by the challenge of improving velocity and quality of the silicon development process. In this role, you will: Develop and scale design methodologies for rapid first-party chip development and apply them to construct complex custom chips Create abstractions that allow hardware structures, configurations, experiments, and results to be represented consistently across tools. Automate high-value engineering workflows and improve their reproducibility, observability, testability, and ease of use. Partner with architects, RTL designers, verification engineers, compiler engineers, and systems software engineers to gather requirements and then implement solutions. Use methodology and tooling to identify design risks early, accelerate iteration, and improve confidence in performance and implementation tradeoffs. Contribute across multiple aspects of software and hardware

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de