Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv
Jobs in United States
Electrical in United States
199 active opportunities · Updated October 2026
Showing
15 jobs
Explore current electrical jobs across United States. Filter by work mode, employment type, experience, department, date posted and distance.
Job Details: Job Description: Note: This role requires regular onsite presence to perform essential job responsibilities. This position drives technology development and enablement for both high-volume manufacturing and future process technologies. Responsibilities include providing process integration and equipment solutions, conducting feasibility studies to meet device performance requirements, and leading the design and development of advanced manufacturing processes. The role involves material selection, parameter optimization, metrology, equipment engineering, and system design to enable new product architectures and functional requirements. The successful candidate will lead pathfinding activities that support process and hardware development for next-generation manufacturing technologies and will contribute to technology roadmaps that enable future product innovation. The role also includes identifying and implementing equipment and process improvements to enhance manufacturing efficiency, optimize production output, and improve operational performance. Qualifications: Minimum Qualifications Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 6+ years of semiconductor industry experience , primarily in dry etch process development. Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 9+ years of semiconductor industry experience , primarily in dry etch process development. 3+ years of experience collaborating with equipment suppliers (e.g., Lam Research, TEL, Applied Materials, Hit
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Intercon
Job Details: Job Description: In this role, you will lead cross-functional collaboration to advance circuit simulation and modeling capabilities for advanced foundry technologies. Your responsibilities will include: Vendor collaboration: Partnering with EDA vendors to enhance and validate industry-standard simulation tools and design flows. Technology alignment: Working closely with technology leaders, VLSI physical design teams, and PDK teams to ensure simulation and modeling capabilities are aligned with roadmap needs. PDK readiness: Driving readiness of high quality simulation and modeling solutions so they are available in time for PDK delivery. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Bachelor’s degree in electrical engineering or computer engineering or related engineering discipline with 12+ years or master’s degree in electrical engineering or a related discipline and at least 10 years of industry experience in the semiconductor field; or Ph.D. in Electrical Engineering or a related discipline with a minimum of 8 years of industry experience in the semiconductor field. 5+ years supporting circuit simulation tools and working with circuit simulation vendors to develop solutions. 5+ years collaborating with EDA vendors on optimizing circuit simulation and modeling for advanced technology nodes. 3+ years of hands-on experience with BSIM or other compact models for transistor modeling at advanced nodes (e.g., FinFET, GAA).</
Job Details: Job Description: The Role and Impact As a GPU Platform Hardware Design Engineer, you will play a pivotal role in designing and developing high-quality GPU hardware platforms that drive innovation in high-performance computing, graphics, and visualization technologies. You will lead the design process from initial feasibility studies through board layout, tapeout, and platform power-on, ensuring robust functionality and compatibility with industry standards. Your expertise in platform-level requirements, electrical engineering applications, and system bring-up will directly contribute to delivering cutting-edge GPU systems that accelerate Intel's leadership in computing. Business group The Data Center Group (DCG) is dedicated to advancing Intel's role in powering the digital world with leading-edge technologies. Focused on delivering innovative solutions for data center and cloud environments, DCG supports high-performance computing and graphics to enable capabilities such as AI, machine learning, and advanced visualizations. As part of the GPU IP Engineering team within DCG, you'll contribute to developing GPU systems that meet the evolving demands of the industry while supporting Intel's broader mission to create world-changing technology. Key Responsibilities - Design, develop, and evaluate electronic components, PCBs, and integrated circuits for GPU hardware platforms. - Translate platform-level requirements into detailed specifications and ensure adherence throughout the design process. - Define component placement and trace routing rules to optimize board layouts for performance, power, and signal integrity. - Conduct feasibility studies, board layout, tapeout, and platform power-on activities. - Perform functionality tests and utilize tools to verify platform configurations and compatibility. - Research, develop, and validate firmware, hardwa
ABOUT TOPGOLF Topgolf is a sports entertainment company that has changed how millions of people experience golf and where you can build a serious career. Our venues are high-energy, high-volume environments where performance matters and results are visible. Every day, we bring together golf, food and beverages , events, and entertainment into one experience that keeps guests coming back. WHAT WE’RE SEEKING Do you see a building and immediately understand what it takes to keep it operating at its best? Are you proactive about maintenance, disciplined compliance, and confident managing vendors, budgets, and unexpected problems at the same time? We are looking for a facilities Manager who takes full ownership of the physical environment. Someone who understands that the guest experience starts when they pull into the parking lot, and that a well-maintained facility reflects the standards the whole team holds. Reactive maintenance is a last resort. Proactive leadership is the expectation. If you take pride in a facility that is always ready, this is the role that matters . THE ROLE The Facilities Manager leads the Facilities team in maintaining and improving every aspect of the venue; from the game system and entertainment technology to HVAC, electrical, plumbing, buildi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include but are not limited to the following: Team oriented approach to create new strategies for DRAM DFT. New DRAM Test Flow Strategy. Fail Pattern Recognition. Improved methodology for test time reduction and improved quality. Assist in solutions to high visibility DRAM product issues. Create supporting software tools to assist in Engineering Analysis. Invent and Innovate anything and everything related to DFT. Employer will accept a Bachelor’s degree in Electrical Engineering, Computer Science, Electrical and Computer Engineering or related field. Position requires: 1) CMOS circuit knowledge 2) Basic programming skills in Python, Java, C or C++ 3) DRAM knowledge 4) Statistics 5) Basic lab experience or equivalent applied software profiling/analytics As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.<s
$100K – $500K/yr
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a Signal Integrity Engineer to join our growing team. The ideal candidate will have a wealth of exposure designing high speed interconnects, breakout design, material trade-offs and verification. A background in electrical engineering, electronics or relevant fields is required. Must love all things high speed! This role is hybrid, based out of Santa Clara, CA or Austin, TX or Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have a Bachelor’s degree in Electrical Engineering (or equivalent) and 5+ years working in high-speed digital design with a focus in high-speed PCB or package design at 10Gbps and above (e.g. 100GbE, GDDR6, PCIe Gen5+). You’re comfortable working with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT as well as knowledge of high-speed connector technologies, including NPO, CPO, and emerging standards. You are proficient with PCB ECAD tools (ideally Cadence Allegro). You communicate clearly (written and verbal), think critically, and love solving complex signal integrity problems. You’re enthusiastic about all things high speed and enjoy collaborating acro
1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro
NVIDIA is seeking an a PCB Library Engineer to join our PCB Design Infrastructure team. In this role, you will help develop and maintain the PCB library assets used across NVIDIA's Data Center, AI, Networking, Automotive, and Graphics products. Working alongside experienced PCB designers, library engineers, mechanical engineers, manufacturing engineers, and component engineers, you will create and validate component footprints, schematic symbols, mechanical components, panel definitions, and other critical design assets that enable successful product development. This position provides an excellent opportunity to build expertise in PCB design, manufacturing, component engineering, and design automation while supporting some of the most advanced computing platforms in the world. What you'll be doing: Develop PCB footprints, padstacks, schematic symbols, and mechanical library content using Cadence PCB design tools. Review component datasheets, package drawings, and engineering specifications to create accurate design libraries. Support library verification, release, and documentation processes. Partner with PCB design, mechanical engineering, manufacturing engineering, and operations teams to resolve library-related issues. Learn and apply industry standards, including IPC requirements, DFM, DFA, and DFT principles. Support quality initiatives to ensure library content is accurate, manufacturable, and scalable. Participate in continuous improvement and automation efforts within the library environment. Develop a strong understanding of PCB fabrication, assembly, and component technologies. What We Need to See: BS degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field or equivalent experience. <p
Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.
NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C
About the Team OpenAI’s Industrial Compute team is building and productizing infrastructure capabilities that help organizations deploy and operate advanced AI systems at scale. The team works across AI hardware, systems engineering, physical infrastructure, and customer delivery to turn emerging technologies into reliable, repeatable infrastructure solutions. Our work sits at the intersection of technical strategy, product development, engineering, and deployment. We partner closely with customers and internal engineering teams to solve complex infrastructure challenges spanning compute, power, cooling, controls, and facility efficiency. About the Role We are seeking a senior, hands-on Data Center Infrastructure Architect to develop and optimize the physical infrastructure required for large-scale AI deployments. This is a broad technical role spanning data center architecture, electrical and mechanical systems, high-density compute, controls, telemetry, and digital modeling. You will use simulation, operational data, and digital-twin approaches to evaluate infrastructure designs, identify system-level constraints, and improve efficiency, reliability, cost, and speed of deployment. The ideal candidate can move fluidly between first-principles analysis, facility and equipment design, computational modeling, engineering review, and real-world implementation. You should be comfortable working across disciplines rather than operating solely within electrical, mechanical, or software boundaries. Key Responsibilities Define system-level architectures for high-density AI data centers across power, cooling, IT equipment, controls, and facility infrastructure. Develop digital twins and other computational models that represent the behavior of data center systems under changing workloads, environmental conditions, equipment configurations, and failure scenarios. Use design and operational data to identify constraints, improve PUE and related efficiency metrics, and optimize
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern Product Yield Enhancement (PYE) Engineer at Micron Technology Inc., you will assist in taking next generation DRAM devices from design to mass production! PYE Engineers are crucial partners between Research and Development, Manufacturing, Product Engineering and Global Quality teams. Our goal is to offer hands-on and substantial engineering projects that allow interns to gain valuable experience with memory systems and the product life cycle while adding impact to Micron’s business. Our intern programs help prepare engineers for future roles and offer an extraordinary experience that supplements your academic experience! The PYE Engineering role is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory while delivering the quality and reliability that customers expect from the Micron brand. This position is for a 3-month internship. Responsibilities: Your job duties will include detailed DRAM electrical and physical failure analysis. Identify defects introduced by the semiconductor fabrication process. You will data mine using statistical analysis, AI assisted engineering tools, and automation workflows. Find the root cause of failure mechanisms, communicating results with Management, Product, Process and Test Engineering teams. Complete 3-month internship. Minimum Qualifications: Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering,
This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your role at Baxter As an Automation Technician, you will play a key role in building, installing, troubleshooting, and supporting the automated manufacturing equipment that keeps our operations running efficiently. You'll combine your electrical and automation expertise with hands-on problem solving to ensure equipment is operating safely, reliably, and at peak performance. This is where your technical skills directly impact advanced manufacturing systems, helping bring innovative automation solutions to life while supporting the production of products that help save and sustain lives. Working closely with engineers, designers, manufacturing teams, and external partners, you will support automation projects from assembly and testing through installation and startup. Success in this role is measured by equipment reliabil
Other cities to consider
More places hiring for this role
Get new electrical jobs in United States by email
Daily job updates · Unsubscribe anytime