Fab Equipment Engineer in United States

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Intel's Foundry Automation (IFA) team is hiring a Software Application Development Engineer. As part of our team, you will partner with end users in Fab Manufacturing and Engineering to deliver innovative solutions specially crafted for the ever-changing needs of our highly automated factories. To integrate these solutions, you will work closely with our Software Development teams and execute testing, implementation, troubleshooting and documentation of business processes. You will work at the intersection of software engineering and advanced manufacturing, collaborating with cross-functional teams to analyze business processes, gather requirements, implement software releases, and drive continuous improvement. This is a unique opportunity to make a direct and meaningful impact on Intel's 24/7 manufacturing capabilities while growing your technical expertise in a dynamic, fast-paced environment. Key Responsibilities: Collaborate with internal customers and partners to identify emerging data and business needs, and translate those needs into effective software solutions Analyze existing manufacturing processes and procedures to identify opportunities for optimization and improvement Gather and document business and technical requirements from stakeholders across Fab Manufacturing and Engineering Execute the im

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Summary Department Introduction The Front End Process and Cost Transformation (PROCT) team drives manufacturing performance by improving cost, productivity, operational efficiency, and process capability across Micron’s semiconductor fabrication network. The team partners closely with engineering, manufacturing, and business leaders to deliver pivotal initiatives that accelerate performance, optimize resources, and support Micron’s business objectives! Position Overview As a Fab PROCT FE Engineer, you will lead initiatives that improve manufacturing cost, maximize factory performance, and drive business process improvements across Front End operations. You will partner with multi-functional teams to find opportunities, solve complex operational challenges, and implement data-driven solutions that improve productivity, quality, and operational efficiency. This role combines program leadership, technical expertise, and strategic execution to deliver measurable business impact. Responsibilities Lead initiatives that support Front End cost reduction, productivity improvement, and factory output optimization goals Develop and execute multi-functional programs aligned with manufacturing and corporate business objectives Define project scope, objectives, timelines, deliverables, and resource requirements in collaboration with key stakeholders Establish program structures, manage dependencies, and track achievements to ensure successful execution Drive achievement of Integra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Would you like to work in one of the most complex Fab environments in the world? As an industrial engineering intern in our research and development factory you will work on projects that further optimize our very automated factory. This role will provide exposure to larger data sets than you have ever worked with and will challenge your data management skills. Not only will this role significantly grow your skills but will also provide exceptional value to the organization on a real issue in our factory! Responsibilities: Identify key performance indicators for R&D program success. Use large data sources to extract and analyze planning data. Build reporting in Tableau and other systems to convey data to program teams. Construct infographics that display key information in easy-to-understand formats. Leveraging AI tools and find new ways to apply AI in the workplace. Minimum Qualifications: Working towards completion of a Bachelor’s or Master’s degree in the following areas: industrial engineering, manufacturing engineering, supply chain, Operations or other related discipline with expected graduation after this internship timeframe Must be a current student, and cannot graduate prior to September 2027. Ability to code in SQL, Python or similar to execute data extraction. Effective with Excel, Tableau or other data management and visualization software. Preferred Qualifications: Skille

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Site Inventory Control (SIC) team is at the forefront of our ambitious expansion efforts. SIC plays a pivotal role in connecting wafer starts, inventory strategy, cycle time management, output delivery, and factory execution. As a Senior Engineer for Fab 4 HVM SIC, you will be the operational hub, driving alignment between Technology Development (TD), High Volume Manufacturing (HVM), Probe, Supply Chain, Planning, and Engineering organizations. This outstanding opportunity allows you to lead the charge in optimizing inventory and cycle time performance while ensuring flawless factory execution! We are looking for individuals who thrive on collaboration and tackling complex operational challenges. You'll have the chance to bring to bear data to drive decisions and implement AI-enabled solutions to improve speed, accuracy, and decision-making. Responsibilities: Lead multi-functional initiatives for wafer starts, inventory, cycle time, and output performance to support business commitments Develop and improve inventory control methodologies, business processes, and operational metrics and recommend corrective actions Develop and implement inventory, priority, and capacity strategies for New Product Introduction (NPI) programs Foster coordination between Technology Development, High Volume Manufacturing, Supply Chain, Planning, and Engineering teams to optimize inventory positions and factory flow Identify and mitigate constraints, risks, and op

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion TIQ Program Manager , you will own key projects within the US Expansion Tool Install and Qual (TIQ) Program for our new US based High-Volume Manufacturing (HVM) sites. Your areas of ownership will include multiple of the following: Fab Support (FS) and Main Tool Auxiliary (MTA) enablement. Root Cause Analysis, Corrective and Preventative Actions, and Schedule execution; enable systems and processes to drive delays to zero (D2Z). Resource Leveling, Modeling, and Validation. Support TIQ Change Control Board (CCB): Management of a high-volume of change requests, mitigate cost and schedule impacts. Risk-Build and Disruptive change avoidance and management. Process Qualification for Tool Releases to enable capacity scale and speed. Construction, Facilities, and Layout engagement. Tool Install SPMO champion support for multiple Fab Process Areas. The ideal candidate must be willing to work as a TIQ Program Manager on site in Boise, Idaho to initially support the ID1/ID2 Fab Startup for approximately 18 months before permanently transitioning to the New York SPMO organization at the Clay, New York US Expansion HVM Site. Responsibilities: Own assigned projects and programs, drive execution to plan, and enable successful outcomes. TIQ business process execution, project tracking that includes driving Performance-to-Plan (P2P), and reporting Key Performance Indicator (KPI) metric

Experienced Low Observables Mission Systems Integration Engineer Company: The Boeing Company We are seeking a Low Observables (LO) Design & Integration Engineer to support design and analysis activities for stealth/low-signature systems. The engineer will perform LO material and structure design, electromagnetic analysis, integration and test support, data processing, and technical reporting. The role requires practical experience with LO materials and technologies, solid electromagnetics knowledge, and hands-on expertise with computational electromagnetic (CEM) solvers used to design and optimize LO solutions. Key Responsibilities Perform design and analysis tasks for LO materials, coatings, treatments, and structural treatments to minimize radar, infrared, and other signatures. Develop and validate LO integration concepts for aircraft/vehicle structures and subsystems, including manufacturability and testability considerations. Use CEM solvers to model, simulate, and optimize LO components and systems (e.g., surface treatments, RAM, apertures, seams, RAM-structure interactions). Perform sensitivity studies and trade-offs across materials, geometry, and integration approaches to meet system-level LO requirements. Process and analyze measured test data from laboratory and flight/field tests; compare test results to simulation and iterate designs. Produce technical documentation: detailed analysis reports, integration guidance, test plans, and summaries suitable for engineering and program management audiences. Communicate technical results and recommendations to multidisciplinary teams and support design reviews. Support manufacturing and test engineering to ensure LO design intent is preserved through fab

ABOUT BASETEN Baseten powers mission-critical inference for the world's most dynamic AI companies, like Cursor, Notion, OpenEvidence, Abridge, Clay, Gamma and Writer. By uniting applied AI research, flexible infrastructure, and seamless developer tooling, we enable companies operating at the frontier of AI to bring cutting-edge models into production. We're growing quickly and recently raised our $1.5B Series F , led by Altimeter Capital, Conviction Partners, and Spark Capital. Join us and help build the platform engineers turn to to ship AI products. THE ROLE Baseten is building its own GPU infrastructure for large-scale inference. As we move into large scale, high-density NVIDIA systems, the hardest failures are intermittent, cross-layer, and difficult to prove: RoCE congestion, InfiniBand stalls, ECN/DCQCN mis-tuning, bad optics, RNIC issues, host kernel stalls, GPU driver problems, and workload symptoms that look like network problems, but are not. We are hiring a Lead Software Engineer to build a first-class observability and root-cause analysis system for GPU fabrics. This is a hard distributed systems problem, not a dashboarding problem. The system will collect high-volume signals from switches, hosts, active probes, and inference services; reduce and correlate them in real time; understand topology and service ownership; and produce actionable diagnosis while an incident is still unfolding. This role sits at the boundary between networking and inference software. RDMA data paths, GPUDirect transfers, prefill/decode disaggregation, KV cache movement, request routing, and workload backpressure can all create fabric symptoms or hide real fabric failures. The goal is to tell an operator, quickly and with evidence, whether an incident is caused by the fabric, host, NIC, GPU, RDMA path, scheduler, or serving layer — and what to do next. EXAMPLE INITIATIVES Real-time telemetry engine — Build the ingestion, reduction, storage, and query path for high-cardinality fab