Intel Foundry Ltd Product Yield Engineer in United States

Job Details: Job Description: Join an enthusiastic team of engineers in Intel's Networking Solutions Group (NSG) focused on enabling next generation of programmable Infrastructure Processing Units (IPUs) with our lead customers as part of the Customer Experience Support (CES) organization. Intel brings decades of leadership in networking, virtualization, packet processing, storage, and security to a new class of IPU products that accelerate host networking functions and support emerging use cases such as security, virtualization, storage, load balancing, and data path optimization. Working closely with major cloud service providers and Intel development teams, you will help deliver customized IPU based solutions that enhance isolation, security, performance, storage and system management for our customers. A big part of the day-to-day job is to help customers manage feature request processes, enable solutions, and debug issues. Projects and responsibilities include but are not limited to: • Gain our customers' trust, understand their needs, and build POCs to meet them. Work closely with internal and external partners to understand use cases and requirements. • Be the go-to technical resource for customers building complex Datacenters, AI infrastructure as well as helping them understand performance characteristics for solutions. • Prepare and deliver technical content to customers including presentations, workshops, etc. • Contribute across the full IPU lifecycle, including board and platform bring up, low-level device initialization, OS driver and kernel configuration, system management, feature enablement, use case testing, debugging, and verification. • Defines systems implementation and integration solutions and plans to ensure optimum performance and reliability across hardware, firmware and software w

Job Details: Job Description: The Intel Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel's product roadmap. We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work. As a Process Integration Development Engineer, you will play a pivotal role in advancing Intel's semiconductor process technologies within the Logic Technology Development (LTD) group. Your day-to-day involves designing, optimizing, and implementing integrated process solutions that drive Intel's next-generation technology. By leveraging your expertise in process integration, yield analysis, and data-driven problem solving, you will contribute directly to the seamless transition of emerging technologies from development to high-volume manufacturing, ensuring Intel remains at the forefront of semiconductor innovation. Job Responsibilities include but are not limited to: ​ LTD Semiconductor Senior Process Integration Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: Lead scientific research enabling the manufacture of innovative device architectures coupled with the realization of these architectures. <li

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: The Role and Impact As a Director, Global IT, you will play a critical role in driving complex, high-impact projects that underpin the success of Intel's technology solutions and services. You will manage end-to-end execution, overseeing project plans, resources, and timelines to deliver innovative outcomes. Your expertise will ensure seamless coordination across teams, fostering collaboration and enabling Intel to meet strategic objectives efficiently. Business Group You will join Intel's Global IT organization, a team committed to accelerating enterprise-wide innovation and operational excellence. This group is responsible for delivering technology solutions and services that empower Intel to achieve its business goals while driving efficiency and transformation across the company. Key Responsibilities - Lead large-scale technology projects and programs, ensuring alignment with business objectives, timelines, and resource allocations. - Develop detailed project plans, including scope, schedule, budget, and risk management strategies. - Manage implementation processes, including testing, documentation, training, and change control, to guarantee project success. - Collaborate across teams to assess dependencies, remove roadblocks, and address constraints impacting delivery. - Establish and drive program governance, including milestones, risk mitigation plans, and executive-level reporting. - Monitor program health metrics to ensure quality, timeliness, and adherence to project goals. - Conduct project closeout assessments and document lessons learned for continuous improvement. Qualifications: Minimum Qualifications - Bachelor's degree in Business, Engineer

Job Details: Job Description: The Thin Films Senior Process Engineer will support PVD, CVD, and ALD technologies for dielectric and metal thin-film deposition in a high-volume manufacturing environment. Key Responsibilities Apply advanced expertise in thin-film deposition processes to drive continuous improvement in process performance, sustainment, and technology development. Collaborate with upstream and downstream partners to deliver manufacturing improvements through strong cross-functional engagement and stakeholder management. Own manufacturing processes and/or equipment, ensuring achievement of key performance indicators (KPIs) including safety, quality, cost, productivity, defect reduction, and yield improvement. Develop and execute strategic plans for complex projects, coordinating timelines and dependencies across multiple teams and initiatives. Support manufacturing capacity expansion and technology transfer activities to enable successful ramp-to-volume production. Partner with equipment vendors and cross-functional stakeholders to troubleshoot technical challenges, improve tool performance, and enhance operational efficiency. Lead process development initiatives that support current and next-generation high-volume manufacturing technologies. Design and optimize excursion prevention and detection systems to strengthen process control and minimize manufacturing risk. Lead equipment installation, conversion, qualification, and readiness activities during factory ramps, ensuring all tools are deployed safely, on schedule, and in compliance with quality and manufacturing standards. Drive root cause analysis and implement corrective actions to resolve process and equipment-related issues while improving overall manufacturing stability and performance. <p st

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Responsible for managing the relationship between Intel Data Center and AI (DCAI) and Dell ISG with focus on driving sales strategy of existing Xeon and AI product offerings while expanding Intel design portfolio within Dell's future roadmap to ensure the acceleration of Xeon and AI adoption. Through the design-in process, demonstrate the skills to showcase a quantifiable preference to Intel technology and integrate key learnings into Intel and Dell marketing organizations. The role is critical to establish great relationships and trust with key individuals at Dell and Intel business units and help both companies understand each other's challenges, opportunities to work towards a solution(s) that allows both companies to succeed. The candidate will have enough technical depth to understand the Intel product roadmap, the customer roadmap needs and what the competition is offering and intelligently recommend how to sell the Intel value proposition. Key Responsibilities include: Serve as sales and technical lead for multiple Dell PowerEdge and AI server programs based on Intel Xeon processors and AI accelerators, and collaborate with marketing team to drive complete end-to-end execution. Partner closely with Intel and Dell engineering, product, marketing, and program teams worldwide to align on features, schedules, quality, and issue resolution, ensuring successful product execution. Drive strategic design-win engagements for future Intel Xeon and AI accelerator products, influencing both Intel and Dell roadmaps through deep customer insight, competitive analysis, and early requirements gathering. Act as the primary interface between Intel and Dell, rapidly resolving business and technical issues, managing escalations, and ensuring the highest levels of cus

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a SoC Power Thermal Performance Validation and Optimization Engineer, you will play an essential role in ensuring Intel's products achieve optimal power, thermal, and performance benchmarks at the system-on-chip (SoC) level. In this position, you will develop and execute validation methodologies, optimize hardware/software solutions, and perform SoC-level debugging to address power, thermal, and performance challenges. Your contribution will directly impact Intel's ability to deliver competitive, high-performing products to market. Business Group This role is part of Intel's Data Center Group (DCG), which focuses on designing innovative solutions to power the next generation of computing platforms for data centers. As a member of the PTP PreSi Correlation Solution team, you will contribute to shaping the development and validation processes for cutting-edge technologies, ensuring Intel meets and exceeds industry standards for performance and efficiency. Key Responsibilities: Develop and execute SoC-level power, thermal, and performance validation and

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Job Details: Job Description: As a Facilities Mechanical Engineer, you will play a pivotal role in ensuring the reliable operation and maintenance of Intel's advanced mechanical systems, supporting our cutting-edge manufacturing, cleanroom, and research and development activities. Your work will directly impact Intel's ability to innovate and deliver world-class technologies by maintaining the critical infrastructure that enables peak operational performance. This role offers a unique opportunity to drive engineering excellence, collaborate with cross-functional stakeholders, and shape the future of Intel's facilities globally. Key Responsibilities: Ensure the availability, reliability, and maintenance of mechanical systems such as oil-free air systems, HVAC systems, chilled water plants, boilers, environmental abatement systems, and compliance exhaust systems. Support daily tactical efforts to meet safety, reliability, and environmental targets for mechanical systems. Design and analyze mechanical systems and equipment, troubleshoot systematic issues, and provide evaluations, recommendations, and solutions to resolve problems. Develop engineering scopes of work for mechanical projects and conduct design reviews to ensure system integrity and performance. Conduct feasibility studies and testing on new and modified designs, while overseeing prototype fabrication and design testing. Partner with internal business units and operations teams to deliver engineering solutions tailored to their specific needs.