Manufacturing Operation Manager in United States

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Senior Manager, Additive Fleet is responsible for the day-to-day performance of Hyliion's laser powder bed fusion (LPBF) printer fleet in Austin, which produces the complex, high-density metal heat exchanger hardware in the KARNO Core. This hardware can only be produced through metal additive manufacturing, so Hyliion's ability to build KARNO at scale depends directly on the health, uptime, and throughput of the fleet. The role leads the technicians and operators who run and maintain the machines, and owns preventive maintenance strategy, machine health monitoring, and decisions on hardware and software upgrades. The fleet runs the full range of Colibrium Additive LPBF platforms, including new machine technology being adopted in real time, and a primary focus is reducing machine-to-machine variation and building repeatable processes across machine models. This is a hands-on leadership role with regular time on the shop floor, and its scope will grow as Hyliion's print capacity scales. AI at Hyliion At Hyliion, AI is core to how we work. We equip every team member with leading AI tools and count on you to use them — to move faster, solve harder problems, and help us realize the full potential of KARNO technology for the world. Duties and Responsibilities Own fleet uptime and drive continuous improvement in machine-to-machine consistency across Hyliion's LPBF printer fleet. Build and maintain a preventive maintenance program across all machines to identify failure modes before they cause downtime. Lead, schedule, and develop the team of technicians and operators who run and maintain the fleet. Develop machine health monitoring us

Job Details: Job Description: Join Intel and Build a Better Tomorrow What We Do The Intel Foundry Manufacturing Development and Customer Engineering (MDCE) and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel's product roadmap. What We Offer • We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth • As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results • We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation) • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work Benefits We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work. Find more information about our amazing benefits here: Intel Benefits Key Responsibilities MDCE/LTD Semiconductor Senior Process Integration Development Engineers are responsible for leading scientific research enabling the manufacture

About us Graphcore is one of the world’s leading innovators in Artificial Intelligence compute. It is developing hardware, software and systems infrastructure that will unlock the next generation of AI breakthroughs and power the widespread adoption of AI solutions across every industry. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Together, they share a bold vision: to enable Artificial Super Intelligence and ensure its benefits are accessible to everyone. Graphcore’s teams are drawn from diverse backgrounds and bring a broad range of skills and perspectives. A melting pot of AI research specialists, silicon designers, software engineers and systems architects, Graphcore enjoys a culture of continuous learning and constant innovation. Job Summary We are looking for an experienced System Level Test Engineer to join our Product Test and Diagnosis Department (PTD). In this role, you will contribute to the development and deployment of System Level Test (SLT) solutions for next-generation AI processors. Working closely with hardware, software, validation, and manufacturing teams, you will develop test content, automation, diagnostics, and characterization capabilities that support silicon bring-up, yield learning, and manufacturing deployment. The ideal candidate will have strong technical foundations in semiconductor test and validation, excellent debug skills, and a passion for improving product quality and manufacturability. The Team The Product Test and Diagnostics team’s role is to detect and manage hardware defects that arise from the manufacture and use of our products. This covers chips, boards and finished systems and takes place both in the manufacturing sites and in the field. Responsibilities and Duties Develop and maintain SLT test content, automation, d

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

NVIDIA has transformed computer graphics, PC gaming, and accelerated computing for more than 25 years through exceptional technology and the people who build it. In semiconductor manufacturing, our role is to enable the ecosystem, not compete within it. We partner with fabs, equipment manufacturers, and software providers to make inspection, metrology, and manufacturing intelligence dramatically faster on the NVIDIA platform. Our team builds the software that makes this possible: models, adaptation and evaluation workflows, and deployable inference capabilities that partners integrate into their own tools. We work in environments where labeled data is limited and proprietary, distributions shift across tools and fabs, production budgets are tight, and software must operate inside air-gapped facilities. We’re seeking a Principal Systems Software Engineer for Semiconductor Inspection in Santa Clara. This is a hands-on architect role: you will define the approach, build it, evaluate it, and demonstrate the results. You will work across computer vision, time-series modeling, multimodal AI, anomaly detection, model adaptation, evaluation, and production inference. Success means technology that a fab or equipment vendor can integrate, operate, and trust—not only a successful internal demonstration. What you’ll be doing: Define and prototype AI system architectures spanning optical and e-beam inspection, wafer and mask inspection, metrology, defect review, equipment signals, and process data. Advance world foundation model capabilities for semiconductor manufacturing, including vision, time-series and multimodal representation learning, model adaptation, domain transfer, and data-scarce defect understanding. Develop workflows for defect detection, classification, localization, segmentation, nuisance filtering, ADC, AD

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We're seeking a System Software Engineer to join our First-Party Hardware team. In this role, you will design, build, integrate, and validate low-level system software for the manageability and health of OpenAI's first-party AI hardware systems. You will work across BMC, Linux, firmware interfaces, automation infra, boot and recovery, hardware diagnostics, telemetry, host and platform drivers, network software interfaces, and manufacturing and fleet readiness. A major part of this role is owning the acceptance path for partner-delivered system software: defining requirements, reviewing code and artifacts, reproducing builds, building tests, pushing fixes, and producing the evidence needed for launch decisions. This role is hands-on and high-ownership. You will write and review low-level software, debug issues across hardware and software boundaries, build infra and automation to test and manage devices in lab, guide partner deliverables, build validation evidence, and help carry platforms from bring-up through production deployment. Location: San Francisco, CA (Hybrid: 3 days/week onsite) Relocation assistance available. In this role, you will: Design, develop, and maintain low-level firmware and system software for first-party AI hardware manageability, including BMC software, Redfish services, gNMI telemetry, firmware update and recovery flows, BIOS/UEFI interactions, platform drivers, and hardware diagnostics. Own integration and acceptance of partner and ve

TaylorMade Golf is seeking a highly creative Graphic Designer to visualize original graphic design work across golf accessories, packaging, and soft and hard goods products, then execute the technical files needed for vendor development. This role demands a high level of detail and technical precision, delivered in a fast-paced environment. Essential Functions and Key Responsibilities: Visualize and design original graphic concepts for golf accessories, packaging, and soft and hard goods products. Design and develop original logos, brand marks, and identity guidelines. Concept and create graphic designs for golf ball packaging. Execute detailed, production-ready technical files and tech packs for vendor development. Partner with hard goods, soft goods, and accessories teams to ensure design intent translates accurately to manufacturing. Research and ideate creative concepts for Ecommerce and accessories projects. Performs other related duties and assignments as required. Knowledge and Skills Requirements: Advanced skills in Adobe Illustrator, Photoshop, InDesign, and Acrobat, with the ability to learn new industry-standard software. Strong illustrative ability with a keen sense of color, visual layout, and typography. Ability to translate creative concepts into precise, production-ready technical files and tech packs. Understanding of materials, fabrics, and textures as they apply to soft goods execution. Clear communicator who collaborates effectively with peers and cross-functional teams, and is receptive to constructive feedback. Highly organized with strong attention to detail and a consistent ability to meet deadlines. Comfortable managing multiple projects at once in a fast-paced, global environment. Passion for and knowledge of golf pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Chief Engineer - Patriot Advanced Capability (PAC-3) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is searching for an inspiring and visionary Chief Engineer to lead groundbreaking engineering transformation for the PAC-3 Acceleration Efforts in Huntsville, AL . This pivotal role offers a unique opportunity to be at the forefront of accelerating production rates by driving innovative design for manufacturability and testability, optimizing production systems, and pioneering advanced engineering solutions that empower high-rate manufacturing success. As production demands soar, you will be the catalyst transforming engineering processes and production capabilities—ensuring we not only meet ambitious acceleration targets but also uphold Boeing’s renowned standards of quality and technical excellence. The Chief Engineer will serve as a strategic technical leader, spearheading engineering changes essential to unlocking higher production rates. You will collaborate seamlessly with engineering, manufacturing, quality, supply chain, and production teams to enhance product designs and processes geared toward efficiency, scalability, and continuous improvement. Position Responsibilities: Lead and champion engineering transformation initiatives to significantly accelerate PAC-3 production rates Drive and embed design for manufacturability (DFM), design for testability (DFT), and design for assembly (DFA) practices that enable smooth, high-rate production Partner closely with manufacturing and production teams to innovate and implement enhancements in production systems, tooling,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Yield Development Engineer, you will be at the forefront of advancing Intel's cutting-edge process technologies within our Logic Technology Development (LTD) organization. This pivotal role involves identifying root cause yield limiters and driving solutions that enhance manufacturability and yield across technology nodes. You will work within a dynamic, fast-paced environment to ensure the successful introduction of new products, process improvements, and robust methodologies to meet manufacturing goals. Your expertise will directly contribute to Intel's ability to deliver world-class semiconductor solutions and advance the future of computing. About Intel Foundry At Intel, the Foundry Technology Development (TD) unit is the driving force behind Moore's Law, enabling us to create groundbreaking technology that enriches lives globally. With over 15,000 dedicated employees, Foundry TD spearheads innovative research, develops next-generation processes and packaging technologies, and manages high-volume manufacturing in state-of-the-art facilities. Within Intel Foundry TD, our Logic Technology Development (LTD) organization is at the forefront of creating and refining each process technology node, paving the way for tomorrow's computing solutions. Your responsibilities as a Product Yield Development Eng

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Construction Engineering department is responsible for the design and construction efforts for high-tech, large-scale projects for Micron in the US. Current high-profile projects include the design and construction of two high-volume manufacturing fabs in Boise, ID1 and ID2, and a third fab in Clay, New York. We are seeking an experienced Chemical Systems Engineer to oversee the third-party design of chemical delivery and handling systems for high-tech large-scale construction projects. The Chemical Systems Engineer will manage external design firms, ensuring that chemical systems meet stringent project specifications, safety standards, and regulatory requirements. This role requires deep technical expertise in chemical systems, strong project management skills, and effective collaboration with multidisciplinary teams to deliver safe, efficient, and compliant systems for semiconductor manufacturing. Job Responsibilities: Manage third-party design firms in developing chemical delivery and handling systems, including storage, distribution, and hazardous waste management. Coordinate with external and internal stakeholders—including contractors, vendors, procurement, finance, construction and design teams—to ensure alignment with facility needs and project schedules. Ensure seamless integration of third-party designs with facility systems using Building Information Modeling (BIM) tools like Revit and Navisworks. Review capacity plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi