Manufacturing Operation Manager in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Quality Engineer (Associate or Experienced) Company: The Boeing Company Boeing Defense, Space & Security (BDS) has an exciting opportunity for a Quality Engineer to join our dynamic team in Berkeley, MO. Position Responsibilities: Represents Quality function on team activities to integrate contractual and Boeing Quality Management System requirements into all aspects of proposals and program processes and documentation Provides Quality interpretation of requirements Develops quality metrics, design and production certification plans for small programs to ensure compliance with contractual, Company and regulatory requirements Conducts capability assessments and process validations to support supplier selection activities Participates in various reviews to ensure quality attributes are incorporated into product designs Performs analysis, tests and process audits to ensure manufacturing and test readiness Provides material review dispositions for non-conformances Conducts RCCA and CAPA activities Analyzes non-conformance trends to evaluate effectiveness of corrective actions Recommends corrective actions to address non-conformances Performs benchmarking and other forms of analysis to ensure specified processes capability levels are achieved Supports Advanced Product Quality Planning (APQP) activities Works under general direction Basic Qualifications (Required Skills/Experience): Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer scien

Distinguished Technologist - Principal Architect, Platform Security and Firmware Systems Description - HP is seeking a senior technical leader to serve as a lead architect for hardware rooted Platform Root of Trust for HP's commercial PC platform. In this role, you will be responsible for envisioning, defining, and driving the architecture of hardware, firmware, software, and cloud-integrated security capabilities that protect HP commercial PCs from current and emerging threats. You will also work across the hardware and security architecture teams, collaborate with HP's Security Research Labs, Firmware (BIOS) team, our security business that creates and deploys industry leading enterprise security and manageability solutions, product management, manufacturing, supply chain, customer enablement, and field organizations to create cohesive system solutions that deliver unique customer value. This position requires deep expertise in embedded systems, platform firmware, hardware, security, device manageability, and PC system architecture. The role also requires the ability to translate complex technical capabilities into customer-relevant value propositions and to influence internal and external stakeholders without relying solely on formal authority. Responsibilities Serve as principal architect for HP Endpoint Security Controller roadmap, associated hardware and firmware based capabilities, cryptographic identity, attestation, secure communication, event logging, and future controller generations. Define and evolve HP Sure Start architecture and related firmware resilience capabilities, including hardware-enforced firmware authenticity, recovery, update, and protection mechanisms. Drive secure BIOS and firmware configuration management strategies, including HP Sure Admin ecosystem capabilities, key management, zero-touch provision

NVIDIA’s Silicon Co-Design Group is the team that gets every GPU, SoC, and CPU silicon program from first power-on to high-volume production. We are hiring a Senior Manager to lead our Test, Manufacturability, Reliability & Quality (TMRQ) organization. This is not a coordination role . Your work decides if a product can be built at scale and trusted in the field. These include production test development (SLT, BLT), control run flow, system reliability stress (HTOL), platform- and board-level manufacturing issue closure, and field diagnostic test development. You lead a team of individual contributors and a first-line manager at the layer where silicon, platform, and software collide with manufacturing reality. Decisions you make show up in yield curves, production ramp , and customer escapes. You are the leader the program turns to when a build is stuck, a control run is fallout-heavy, or a field return points back at silicon . The exceptional hire also uses AI deliberately — with demonstrated workflow impact and the judgment to know where it compresses real work and where it introduces risk. What you will be doing: Keep programs moving. Own the technical execution and velocity of SLT, BLT, Board/Chip/Rack CR, and system reliability stress (HTOL) across every GPU, SoC, and CPU silicon program. Close the hardest multi-functional failures. Resolve Vmin and binning escapes, performance shortfalls, and power anomalies by driving root-cause across design, methodology, DFT, ATE, package, software/firmware, and manufacturing — and own the WARs and productized fixes through to confirmation. Give leadership the clarity to act. Convert raw integration signals — CR fallout, BLT/SLT yield, SHTOL/CHTOL data, RMA trends, customer escalations — into decision-ready options that enable executive leadership to act with confidence on POR, QS/PS gates, a

Job Title Material Handler 2 Job Description The Material Handler 2 will assist group leads prepare the line for production; they will ensure the correct components have been issued for the work order based on the BOM. The Material Handler will keep the line supplied with components and remove waste from the line as needed. Your role: Assist the group lead manage the workflow within the assigned manufacturing cell to achieve the daily production objective. Supervise workflow, move full pallets of finished goods to the proper location and monitor inventory of components to insure the line has enough components to complete the order. Interface with warehouse personnel to ensure all components are correct and staged in the appropriate area to avoid delays in production. Maintain the all the materials needed to complete the work order and take appropriate action when it's not. You're the right fit if: You have a high school diploma, GED or equivalent. No experience required, preferably knowledgeable on any of the following manufacturing production e

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. Drive continuous improvement initiatives to minimize defects and optimize process reliability. Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. C

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Intel's Foundry Automation (IFA) team is hiring a Software Application Development Engineer. As part of our team, you will partner with end users in Fab Manufacturing and Engineering to deliver innovative solutions specially crafted for the ever-changing needs of our highly automated factories. To integrate these solutions, you will work closely with our Software Development teams and execute testing, implementation, troubleshooting and documentation of business processes. You will work at the intersection of software engineering and advanced manufacturing, collaborating with cross-functional teams to analyze business processes, gather requirements, implement software releases, and drive continuous improvement. This is a unique opportunity to make a direct and meaningful impact on Intel's 24/7 manufacturing capabilities while growing your technical expertise in a dynamic, fast-paced environment. Key Responsibilities: Collaborate with internal customers and partners to identify emerging data and business needs, and translate those needs into effective software solutions Analyze existing manufacturing processes and procedures to identify opportunities for optimization and improvement Gather and document business and technical requirements from stakeholders across Fab Manufacturing and Engineering Execute the im

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron currently has an opening for a Staff or Principal level EUV Equipment Engineer for our Boise, Idaho location. Our Advanced Lithography and Equipment Engineering team enables the technologies that power the future of semiconductor innovation. We work at the leading edge of EUV and High-NA EUV development, partnering across process, manufacturing, facilities, and supplier organizations to deliver world-class equipment performance and support Micron’s technology roadmap. This EUV Equipment Engineer is a technical leadership role focused on maximizing the performance, reliability, and capability of EUV lithography systems. This position plays a critical role in advancing next-generation semiconductor technologies through equipment optimization, problem solving, supplier engagement, and collaboration across engineering disciplines. Responsibilities: Own the performance, reliability, availability, and productivity of assigned EUV lithography equipment Lead equipment installations, upgrades, qualifications, maintenance strategies, and continuous improvement initiatives Drive improvements in scanner performance, tool matching, imaging stability, defectivity reduction, contamination control, and recipe optimization Analyze equipment data and establish monitoring systems to improve overlay, focus, source performance, automation, and overall equipment health Provide technical leadership through supplier management, cross-functional collaboration, mentoring, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and

Air Proprietary Tooling Engineer (Entry-Level or Associate) Company: The Boeing Company The Boeing Defense, Space & Security (BDS) team is seeking motivated Tooling Engineers located in Berkeley, MO . This role will support design, development, installation, and sustainment of production tooling and assembly aids used across manufacturing and maintenance programs. The role partners with manufacturing, quality, suppliers, and design engineering to deliver safe, compliant, and cost-effective tooling solutions that enable efficient production. At The Boeing Company, our mission is to connect, protect, and explore our world and beyond. Position Responsibilities Develop and qualify production tooling, jigs, fixtures, and assembly aids from concept through production release Translate manufacturing and design requirements into tooling specifications, drawings, 3D CAD models, and bill of materials Perform tolerance stack-up, fit checks, and tooling validation through analysis, prototyping, and hands-on trials Support tooling fabrication and inspection, including supplier management, fabrication oversight, and acceptance criteria verification Lead root-cause analyses for tooling-related manufacturing issues and implement corrective actions and continuous improvement Create and maintain tooling documentation: process plans, safety assessments, work instructions, inspection plans, and change records Collaborate with multidisciplinary teams—manufacturing, quality, stress, systems, and supply chain—to ensure tooling meets program schedule, safety, and quality goals Ensure compliance with company and regulatory standards, maintain configuration control and toolin

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5&#43; years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP