Semiconductor Equipment Applications Eng in Oregon

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv

Job Details: Job Description: oin Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not limited to Advanced Packaging Factories, New Wafer Fabrication factories (Fabs), Fab Conversions, Process Tools Install, Infrastructure, and Progressive Build. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding, fast-paced environment, this is the right place for you. Everywhere you go, you'll find an opportunity to make a difference. In any given workday, you will be given the responsibility to innovate and create an impact on our business. The Install Qualification Operation Sr Specialist is responsible for driving key milestones enabling tool installation, readiness, and qualification within Intel Foundry Construction and Sourcing (FCS). The role is responsible for equipment install execution from pre-design through design finish and set to SL2 signoff, ensuring safe delivery, accurate scope definition, efficient construction, and prompt vendor qualification. This position requires five days per week of onsite presence and close coordination with manufacturing, design, construction, OEMs, trade contractors, and supplier partners. Please consider that this is an Intel Contract position (3 years). Responsibilities will include but are not limited to: Safety and Compliance: Champion Intel's Culture of Caring and ensure safe behaviors across design and construction activities. Enforce cleanroom, IP protection, and site protocols to maintain compliance with all applicab

Job Details: Job Description: This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's leading-edge silicon manufacturing solutions. In this position, you will work on-site, in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated manufacturing processes and equipment. As IMO module Engineer the responsibilities may include but not limited to: Process equipment installation and development. Equipment maintenance, management of troubleshooting activities, regular monitoring of process performance, defect analysis and reduction. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics. Working with cross functional teams to solve technical process and defect issues. Plans and conducts experiments to fully characterize the process throughout the development cycle. Establishes control systems to optimize and sustain production performance. Develops strategies to resolve difficult problems and establishes systems to manage these problems in the future. An ideal candidate should exhibit the below behavioral traits: Experience with rapid analysis of complex process issues and identification of a solution path Willing to work Independently with minimal direction, to be self-directing and show initiative Communication skills and demonstrated ability to summarize complex d

Job Details: Job Description: Join Intel as a Module Development Engineer, where you will play a critical role in driving technology development and enabling advanced manufacturing solutions. In this position, you will lead the design and optimization of complex manufacturing processes, including material selection and equipment development, to enable innovative product designs and high-volume production. Your work will directly impact Intel's ability to maintain its leadership in cutting-edge semiconductor technologies. Business group As part of Intel Foundry, you will join a dynamic team focused on advancing semiconductor manufacturing technologies and capabilities. The group's mission includes enabling high-volume production through innovative process integration, equipment solutions, and technology advancements. Collaborating across Intel's global network, you will contribute to driving Intel's success in delivering transformative technologies to its customers. Key Responsibilities Lead the development of manufacturing processes that include MHS equipment development, parameter optimization, and equipment metrology. Perform pathfinding activities to enable emerging device architectures and support process and hardware development. Develop roadmaps for future technologies that align with Intel's leadership in semiconductor innovation. Collaborate with equipment and materials suppliers to implement solutions that meet manufacturing and technology needs. Recommend and execute modifications to equipment and processes to improve efficiency and optimize production output. Stay informed about industry trends in materials and manufacturing processes, identifying opportunities for innovation. Behavioral Traits Strong p

Advanced Facilities operations Maintenance and Repair Process Technician Description - At HP, we exist to amaze. Through the people we hire, the experiences we enable, the way we treat our customers and each other—and ultimately through the technology we create. HP’s Corvallis site is a hybrid development and manufacturing factory, supporting advanced R&D, prototype manufacturing, and low‑volume production in a semiconductor cleanroom environment. Our technicians work on cutting‑edge equipment and processes that directly enable next‑generation printing and manufacturing technologies. Responsibilities The primary function of this role is the day-to-day operations and maintenance of the facilities equipment that supports business needs. Knowledge of RODI/IWW systems, chemical handling and delivery systems, troubleshooting and repair and maintenance of systems. Knowledge of operations and repair for chemical dispense systems that support fab wafer manufacturing. Willingness to be on call and wear full face respirators while performing chemical duties. Streamlines activities under common initiatives, managing achievements and touchpoints to ensure alignment and unity. Executes design work that consistently meets defined quality standards within specified timelines. Identifies team needs regarding processes, tools, documentation, and asset management, and drives necessary changes to enhance efficiency. Conducts design reviews of blocks with peers and management to demonstrate that designs meet specification targets and requirements. Develops design systems and standards that can scale across organizations and can be deployed across various global businesses. Collaborates with platform architects and systems groups to define overall specifications based on system requirements. Acts as the

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's leading-edge silicon manufacturing solutions. In this position, you will work on-site, in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated manufacturing processes and equipment. As an IMO Module Development Engineer, the responsibilities may include but not limited to: Process equipment installation and development. Equipment maintenance, management of troubleshooting activities, regular monitoring of process performance, defect analysis and reduction. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics. Working with cross functional teams to solve technical process and defect issues. Plans and conducts experiments to fully characterize the process throughout the development cycle. Establishes control systems to optimize and sustain production performance. D

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Yield Development Engineer, you will be at the forefront of advancing Intel's cutting-edge process technologies within our Logic Technology Development (LTD) organization. This pivotal role involves identifying root cause yield limiters and driving solutions that enhance manufacturability and yield across technology nodes. You will work within a dynamic, fast-paced environment to ensure the successful introduction of new products, process improvements, and robust methodologies to meet manufacturing goals. Your expertise will directly contribute to Intel's ability to deliver world-class semiconductor solutions and advance the future of computing. About Intel Foundry At Intel, the Foundry Technology Development (TD) unit is the driving force behind Moore's Law, enabling us to create groundbreaking technology that enriches lives globally. With over 15,000 dedicated employees, Foundry TD spearheads innovative research, develops next-generation processes and packaging technologies, and manages high-volume manufacturing in state-of-the-art facilities. Within Intel Foundry TD, our Logic Technology Development (LTD) organization is at the forefront of creating and refining each process technology node, paving the way for tomorrow's computing solutions. Your responsibilities as a Product Yield Development Eng

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom

Job Details: Job Description: This position is in the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. You will design, execute, and analyze experiments to develop the process of the next technologies to come into the market. Come join us and help shape the future of the semiconductor process for decades to come. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products. Intel Corporation Core Values here. Benefits: We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work! Find more information about our Amazing Benefits here . What we do: <span styl

Job Details: Job Description: In this role, you will lead cross-functional collaboration to advance circuit simulation and modeling capabilities for advanced foundry technologies. Your responsibilities will include: Vendor collaboration: Partnering with EDA vendors to enhance and validate industry-standard simulation tools and design flows. Technology alignment: Working closely with technology leaders, VLSI physical design teams, and PDK teams to ensure simulation and modeling capabilities are aligned with roadmap needs. PDK readiness: Driving readiness of high quality simulation and modeling solutions so they are available in time for PDK delivery. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Bachelor’s degree in electrical engineering or computer engineering or related engineering discipline with 12&#43; years or master’s degree in electrical engineering or a related discipline and at least 10 years of industry experience in the semiconductor field; or Ph.D. in Electrical Engineering or a related discipline with a minimum of 8 years of industry experience in the semiconductor field. 5&#43; years supporting circuit simulation tools and working with circuit simulation vendors to develop solutions. 5&#43; years collaborating with EDA vendors on optimizing circuit simulation and modeling for advanced technology nodes. 3&#43; years of hands-on experience with BSIM or other compact models for transistor modeling at advanced nodes (e.g., FinFET, GAA).</