NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As a NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Silicon Co-Design Group (SCG) is a wide-ranging, multi-functional, integral team at NVIDIA. We sit at the crossroads of design, architecture, marketing, operations, and productization. Our contributions span from the arch stage and extend to defining final products. We architect innovative solutions for Datacenter, Server, Gaming, Robotics, Automotive, and Embedded markets. We are fast-paced, dynamic, share a sense of humor, and collaborate extensively to push the boundaries of what is possible. We do all of this with an eye on making groundbreaking, impactful market disruptions! We are seeking an experienced Senior Manager to lead Product Co-Design and Verification in areas of Speed, Reliability and Power Compliance. You will oversee speed/timing/reliability system design, Simulation-to-Silicon power/speed verification, features for product compliance and test chip development crating future product roadmaps. The ideal candidate will have deep technical expertise in semiconductor/VLSI design and a background in translating product requirements into design and vice versa. This is a highly visible, multi-functional role to produce outstanding products that ship at SOL and meet the high NVIDIA quality we demand and customers expect. <p
Jobs in United States
Semiconductor Manufacturing Engineer in United States
173 active opportunities · Updated October 2026
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Explore current semiconductor manufacturing engineer jobs across United States. Filter by work mode, employment type, experience, department, date posted and distance.
Job Details: Job Description: This position is in the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. You will design, execute, and analyze experiments to develop the process of the next technologies to come into the market. Come join us and help shape the future of the semiconductor process for decades to come. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products. Intel Corporation Core Values here. Benefits: We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work! Find more information about our Amazing Benefits here . What we do: <span styl
Job Details: Job Description: In this role, you will lead cross-functional collaboration to advance circuit simulation and modeling capabilities for advanced foundry technologies. Your responsibilities will include: Vendor collaboration: Partnering with EDA vendors to enhance and validate industry-standard simulation tools and design flows. Technology alignment: Working closely with technology leaders, VLSI physical design teams, and PDK teams to ensure simulation and modeling capabilities are aligned with roadmap needs. PDK readiness: Driving readiness of high quality simulation and modeling solutions so they are available in time for PDK delivery. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Bachelor’s degree in electrical engineering or computer engineering or related engineering discipline with 12+ years or master’s degree in electrical engineering or a related discipline and at least 10 years of industry experience in the semiconductor field; or Ph.D. in Electrical Engineering or a related discipline with a minimum of 8 years of industry experience in the semiconductor field. 5+ years supporting circuit simulation tools and working with circuit simulation vendors to develop solutions. 5+ years collaborating with EDA vendors on optimizing circuit simulation and modeling for advanced technology nodes. 3+ years of hands-on experience with BSIM or other compact models for transistor modeling at advanced nodes (e.g., FinFET, GAA).</
About the Team OpenAI develops models that can reason through complex problems and hardware designed for the demands of advanced AI. AI for Chips connects these efforts: applying increasingly capable AI systems to the work of semiconductor engineering. Our goal is to help engineers develop better chips and shorten design cycles. This work brings research, model training, and hardware expertise together to build tools that engineers can use on real designs, with correctness and measurable performance at the center. About the Role We’re hiring a Research Engineer to help OpenAI models solve chip-design problems through reinforcement learning, tool use, and evaluation. You’ll own experiments from the initial idea through implementation and analysis. That means building environments and evaluations, running training, investigating failures, and using the results to decide what to try next. You’ll also build the software needed to make those experiments reliable and reproducible. We value strong coding fundamentals, careful experimental judgment, and the ability to make progress independently. Prior chip-design experience is helpful, but you can learn the domain alongside the team’s hardware specialists. In this role, you will: Build RL environments and evaluations for tasks such as RTL generation, design verification, and physical design optimization. Develop and test approaches that help models use chip-design tools and improve power, performance, and area while preserving correctness. Design experiments, establish baselines, and measure whether improvements hold up on new tasks and designs. Investigate failures across model behavior, rewards, evaluation tools, and experiment infrastructure. Improve iteration speed through better tooling, faster evaluations, and proxy rewards that reflect the outcomes we care about. Turn successful experiments into reusable research code and training workflows, working closely with researchers and engineers. You might thrive in this ro
About the Team OpenAI develops models that can reason through complex problems and hardware designed for the demands of advanced AI. AI for Chips connects these efforts: applying increasingly capable AI systems to the work of semiconductor engineering. Our goal is to help engineers develop better chips and shorten design cycles. This work brings research, model training, and hardware expertise together to build tools that engineers can use on real designs, with correctness and measurable performance at the center. About the Role We’re hiring a Software Engineer to build the research infrastructure and tooling that help OpenAI models design silicon. You’ll turn chip-design workflows into reliable environments for reinforcement learning and evaluation, and make it easier for researchers to run experiments and iterate on new ideas. You’ll move between software engineering, tool integration, and open research problems. We value strong coding fundamentals, clear technical judgment, and independent execution. Prior chip-design experience is helpful, but you can learn the domain alongside the team’s hardware specialists. In this role, you will: Build and maintain infrastructure for reinforcement learning environments, evaluations, and long-running experiments. Integrate electronic design automation (EDA) tools into workflows for RTL generation, verification, and physical design optimization. Improve experiment reliability, reproducibility, observability, and performance; debug failures across tools, services, and infrastructure. Develop tooling and model harnesses that let researchers test ideas quickly and measure correctness and power, performance, and area (PPA). Collaborate with researchers and engineers to turn successful experiments into reusable systems and training workflows. Own ambiguous projects end to end, communicate progress, and use results to guide the next iteration. You might thrive in this role if you: Have strong software engineering fundamentals, with
Job Details: Job Description: The Role and Impact As a SoC Design Verification Engineer, you will play a pivotal role in ensuring that Intel's complex System-on-Chip (SoC) designs meet functional specifications and deliver high-quality performance. You will design scalable and reusable verification plans, develop test environments, and execute tests to uncover issues and improve functionality. Your contributions will directly enhance Intel's product quality and ensure optimal performance in presilicon development. Business Group You will be joining Intel's cutting-edge product development group, a team focused on designing and verifying advanced semiconductor solutions. This group is at the forefront of innovation, delivering high-quality, scalable products that drive Intel's leadership in technology and performance. By contributing your skills here, you will help shape the future of computing and enable groundbreaking advancements in the industry. Key Responsibilities - Define and develop scalable and reusable block, subsystem, and SoC verification plans. - Create test benches and verification environments that align with microarchitecture specifications. - Execute verification plans, including emulation and system simulation models, to ensure design functionality and uncover bugs. - Debug and root cause issues in presilicon environments, implementing corrective measures to address failures. - Collaborate with architects, RTL developers, postsilicon teams, and physical design teams to improve verification of complex architectural features. - Document and maintain test plans, driving technical reviews with design and architecture teams. - Integrate security coverage activities within test plans, including regression and debug tests. - Maintain and improve
Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations
$100K – $500K/yr
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a highly skilled and experienced Engineer to lead post-silicon power characterization and correlation activities for cutting-edge semiconductor products. In this role, you will be responsible for developing and executing detailed power measurement strategies on silicon, correlating results with pre-silicon models, and driving improvements across power architecture, design, and modeling methodologies. You will serve as a key technical leader, interfacing across design, architecture, validation, and systems teams to ensure silicon meets power and performance specifications under all operating conditions. This role is hybrid, based out of Toronto, ON or Austin, TX or Santa Clara, CA. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are A Principal-level engineer with 8+ years in silicon power analysis and characterization, and a Master’s or PhD in EE, CE, or related field. Deep understanding of digital and mixed-signal power domains, including DVFS, leakage vs. dynamic power, and power gating. Highly proficient in lab-based power measurement using oscilloscopes, current probes, power analyzers, and SMUs, plus Python/Perl/MATLAB
$210K – $230K/yr
Overview: The Insights product is an offering for Guidepoint's institutional investment and corporate clients, now in its 9 th year, that offers teleconferences, surveys, in-person events, and AI-facilitated data and content. The teleconferences live in an online library portal, which covers a wide of industries/topics that enables our clients to make informed decisions. All content features experts from Guidepoint’s proprietary global network and is conceptualized and hosted by former investment professionals (i.e. hedge fund analysts), sell-side equity research analysts, and industry professionals. This is a hybrid position based in our New York City office. What you'll do: Monitor a coverage universe of public companies within the global hardware and semiconductor sector by tracking earnings releases, investor presentations, SEC filings, sell-side research and industry news. Create and moderate teleconferences on timely topics featuring an expert from Guidepoint’s network with the goal of producing actionable insights for clients. Attend industry conferences to host client panels What you have: Bachelor’s degree or Master’s degree Minimum 10 years of sell-side or buy-side analyst experience Must follow bottoms-up, fundamental approach to investment research focusing on individual companies Has covered the Hardware and Semiconductor sector; candidates must be current on company/industry knowledge Ability to work in a fast-paced entrepreneurial environment Outgoing personality with the ability to speak with people at all professional levels Intellectual curiosity and desire to learn Effective time management and organizational skills Demonstrated ability to work both individually and as part of a team What We Offer: The annual salary range for this position is $210,000-$230,000. Additionally, this position is eligible for an annual discretionary bonus based on performance. You will also be eligible for the following benefits: 15
About the Team OpenAI’s mission is to ensure that artificial general intelligence benefits all of humanity. Our Go-to-Market team helps organizations understand, adopt, and deploy OpenAI’s technology to solve meaningful business challenges and create lasting value. The Technology team works with leading software, internet, cloud, infrastructure, cybersecurity, semiconductor, and digital-native companies as they build new AI-powered products, transform internal operations, and rethink how they serve their customers. We partner with executives, product leaders, engineers, and go-to-market teams to help organizations integrate OpenAI’s capabilities into their products and businesses responsibly and at scale. The team collaborates closely with Solutions Engineering, Customer Success, Product, Research, Partnerships, Marketing, and Operations to turn customer priorities into successful, durable deployments. About the Role We are looking for an experienced Account Director, Tech to help build and grow OpenAI’s business across the technology industry. You will own relationships with a portfolio of strategic technology companies, helping executive, product, and technical leaders understand how OpenAI’s products can accelerate innovation, improve productivity, and create differentiated customer experiences. You will be responsible for developing account strategies, creating qualified pipeline, navigating complex enterprise sales cycles, and expanding adoption across products, teams, and use cases. This role requires a combination of enterprise sales leadership, technical fluency, commercial judgment, and the ability to operate credibly with both business and engineering stakeholders. You should be comfortable engaging with customers that have sophisticated technical environments, rapidly evolving AI strategies, and high expectations for product performance, security, reliability, and scale. Success in this role will be measured by revenue growth, depth of customer adoption,
NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life’s work, to amplify human creativity and intelligence. Make the choice to join us today. Design-for-Test Engineering at NVIDIA works on groundbreaking innovations involving crafting creative solutions for DFT architecture, verification and post-silicon validation on some of the industry's most complex semiconductor chips. What you'll be doing: As a senior member in our team, you will work with pre-silicon and post-silicon data analytics - visualization, insights and modeling. Design and uphold sturdy data pipelines and ETL processes for the ingestion and processing of DFX Engineering data from various origins Lead engineering efforts by collaborating with cross-functional teams (execution, analytics, data science, product) to define data requirements and ensure data quality and consistency You will work on hard-to-solve problems in the Design For Test space which will involve application of algorithm design, using statistical tools to analyze and interpret complex datasets and explorations using Applied AI methods. In addition, you will help develop and deploy DFT methodologies for our next generation products using Gen AI solutions. You will also help mentor junior engineers on test designs and trade-offs including cost and quality. What we need to see: BSEE (or equivalent experience) with 5+, MSEE with 3+, or PhD wi
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