Semiconductor Principal Design Engineer in United States

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is building high-performance AI systems and the supply chain required to deliver them at scale. We are looking for a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment. This role is based in Santa Clara, CA; Austin, TX, or Toronto, ON, with regular travel to Taiwan and other Asia-based partner sites, approximately 25-30%. Candidates should be located near one of these hubs and able to work effectively across North American and Asia-Pacific time zones. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor’s degree in Supply Chain, Engineering, or a related discipline. Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners. Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues. Are a clear, direct, a

About the Team OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core platform development, embedding deeply with customers to translate frontier model capabilities into systems that materially improve engineering workflows and accelerate innovation. Our work turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem. About the Role We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time. In the near term, you will serve as the team’s physical design SME across semiconductor deployments: helping FDEs, Product, and Research understand backend implementation workflows, pressure-test AI-assisted solution ideas against real physical design constraints, and raise the quality of our customer-facing technical work. You will help the broader team build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice. Over time, we expect this role to expand beyond SME support into broader FDE ownership: partnering directly with customers, shaping deployment strategy, building and iterating production-grade AI systems, driving technical workstreams, and helping turn high-touch semiconductor deployments into repeatable solutions. This is a strong fit for someone who brings deep physical design expertise today and is excited to grow into a customer-facing, syst

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: oin Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not limited to Advanced Packaging Factories, New Wafer Fabrication factories (Fabs), Fab Conversions, Process Tools Install, Infrastructure, and Progressive Build. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding, fast-paced environment, this is the right place for you. Everywhere you go, you'll find an opportunity to make a difference. In any given workday, you will be given the responsibility to innovate and create an impact on our business. The Install Qualification Operation Sr Specialist is responsible for driving key milestones enabling tool installation, readiness, and qualification within Intel Foundry Construction and Sourcing (FCS). The role is responsible for equipment install execution from pre-design through design finish and set to SL2 signoff, ensuring safe delivery, accurate scope definition, efficient construction, and prompt vendor qualification. This position requires five days per week of onsite presence and close coordination with manufacturing, design, construction, OEMs, trade contractors, and supplier partners. Please consider that this is an Intel Contract position (3 years). Responsibilities will include but are not limited to: Safety and Compliance: Champion Intel's Culture of Caring and ensure safe behaviors across design and construction activities. Enforce cleanroom, IP protection, and site protocols to maintain compliance with all applicab

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As a NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Silicon Co-Design Group (SCG) is a wide-ranging, multi-functional, integral team at NVIDIA. We sit at the crossroads of design, architecture, marketing, operations, and productization. Our contributions span from the arch stage and extend to defining final products. We architect innovative solutions for Datacenter, Server, Gaming, Robotics, Automotive, and Embedded markets. We are fast-paced, dynamic, share a sense of humor, and collaborate extensively to push the boundaries of what is possible. We do all of this with an eye on making groundbreaking, impactful market disruptions! We are seeking an experienced Senior Manager to lead Product Co-Design and Verification in areas of Speed, Reliability and Power Compliance. You will oversee speed/timing/reliability system design, Simulation-to-Silicon power/speed verification, features for product compliance and test chip development crating future product roadmaps. The ideal candidate will have deep technical expertise in semiconductor/VLSI design and a background in translating product requirements into design and vice versa. This is a highly visible, multi-functional role to produce outstanding products that ship at SOL and meet the high NVIDIA quality we demand and customers expect. <p

Job Details: Job Description: The Role and Impact As a Module Engineer, you will play a pivotal role in enabling Intel's cutting-edge manufacturing processes by ensuring the seamless operation and optimization of critical high-volume equipment. Your day-to-day responsibilities will focus on conducting tests, measurements, and maintenance activities to ensure the equipment meets stringent safety, quality, and efficiency standards. By driving process improvements and collaborating with global teams, you will contribute to the successful production of advanced integrated circuits and help shape technological innovation in the semiconductor industry. Business Group You will be part of Intel's Manufacturing and Operations organization, which is central to Intel's mission of creating world-changing technology. The group specializes in scaling advanced manufacturing techniques, ensuring high product quality, and delivering cost-effective solutions that support Intel's growth. Through its close collaboration with global teams, this organization fosters technological innovation and operational excellence across Intel's manufacturing sites worldwide. Key Responsibilities - Conduct equipment tests and measurements to ensure control over critical dimensions, registration and defectivity of the production line. - Recommend and implement modifications to improve production efficiency, manufacturing techniques, and output quality. - Own and execute maintenance and repair activities for manufacturing equipment, ensuring minimal downtime. - Lead continuous improvement initiatives for safety, quality, cost, productivity, defects, and yield metrics. - Collaborate with equipment suppliers to enhance manufacturing tools and processes. - Develop and optimize systems for preventing excursions and detecting process or equipment discrepancies. - Participate in technology transfers t

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom

Job Details: Job Description: Note: This role requires regular onsite presence to perform essential job responsibilities. This position drives technology development and enablement for both high-volume manufacturing and future process technologies. Responsibilities include providing process integration and equipment solutions, conducting feasibility studies to meet device performance requirements, and leading the design and development of advanced manufacturing processes. The role involves material selection, parameter optimization, metrology, equipment engineering, and system design to enable new product architectures and functional requirements. The successful candidate will lead pathfinding activities that support process and hardware development for next-generation manufacturing technologies and will contribute to technology roadmaps that enable future product innovation. The role also includes identifying and implementing equipment and process improvements to enhance manufacturing efficiency, optimize production output, and improve operational performance. Qualifications: Minimum Qualifications Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 6&#43; years of semiconductor industry experience , primarily in dry etch process development. Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 9&#43; years of semiconductor industry experience , primarily in dry etch process development. 3&#43; years of experience collaborating with equipment suppliers (e.g., Lam Research, TEL, Applied Materials, Hit

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv