Silicon Packaging Design Engineer in United States

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure. A hands-on problem solver who excels at debugging and driving signoff through complex verification flows. A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces. A mentor and technical leader passionate about building efficient, manufacturable silicon. What We Need BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verif

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

About the Team The Consumer Devices team at OpenAI builds end-to-end hardware and software systems that bring AI into the physical world. We work at the intersection of custom silicon, embedded systems, operating systems, cloud services, mechanical engineering, electrical engineering, and product design to deliver reliable, production-ready devices at scale. Within Consumer Devices, Hardware Engineering eXperience, or HEX, is a new bootstrapped team building the environments, applications, compute, product-data systems, and workflows that let hardware engineers do their work without needing to troubleshoot the machinery underneath. HEX owns virtual engineering environments, HPC/GPU compute, storage, networking, licensing, MCAD/ECAD/CAE applications, PLM, product data, automation, validation, and support as one connected system. About the Role As a Staff PLM & Engineering Applications Engineer, you will be one of the first technical builders of HEX and the primary counterpart to the HEX lead. You will own the engineering-application and product-data side of the hardware engineering experience, with an initial focus on NX, Teamcenter, licensing, parts import, integrations, packaging, validation, and user workflows. This is not a traditional Teamcenter administration role and not a Corporate IT application-support role. You will take complex, fragile workflows and turn them into reliable engineering systems. This role is highly hands-on and systems-oriented. You will not inherit a mature environment and support queue. You will help build a fresh one, replacing manual setup guides, tribal knowledge, repeated support issues, and team handoffs with tested automation and reliable workflows. In This Role, You Will Own the technical architecture, deployment, configuration, integration, validation, and long-term operation of NX and Teamcenter. Build reliable workflows for parts import, product-data migration, metadata quality, BOMs, revisions, lifecycle states, and releas

Job Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. What we do: Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy to exceed the aspirations of our global customers. We are seeking a visionary Principal Engineer to lead the charge in Intel's foundry revolution, serving as a strategic technical architect and executive partner in guiding our most critical customers through the entire product development lifecycle. In this leadership capacity, you will orchestrate multidisciplinary strategies spanning device engineering, product integration, and yield analysis to steer customers from critical design tape-out and pre-silicon evaluation through to NPI silicon qualification. Furthermore, you will define t

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

Job Details: Job Description: This is a high-visibility, commissioned sales leadership role within Intel's US Sales organization, specifically focused on our most disruptive AI-Native and Strategic CSP accounts. You will be the primary architect of Intel's relationship with industry titans who are redefining the boundaries of AI model training, AIaaS solutions and deployment at scale. This is not a traditional sales role. You will operate at the intersection of deep technical engineering and executive business strategy, ensuring Intel's silicon and software roadmap aligns with the world's most demanding AI-as-a-Service and SaaS platforms across on-prem, Tier1 CSP and NeoCloud environments. Key Responsibilities Executive Orchestration: Act as the One Intel lead, building deep-rooted partnerships with C-suite executives and Principal Engineers at world-class AI and SaaS firms. Technical Value Synthesis: Translate complex hardware architectures (CPU, GPU, Accelerator, Networking, and Packaging) into business outcomes for customers running massive-scale distributed training and inference workloads. Strategic Growth: Drive Intel's data-centric growth strategy by identifying and securing design wins within the core infrastructure of the world's leading AI models and solution providers. Cross-Functional Leadership: Partner closely with Cloud Solution Architects (CSAs), Intel Business Units, Cloud and OEM partners to influence future product roadmaps based on the unique needs of AI-native disruptors. Market Evangelism: Serve as a technical and business evangelist, articulating Intel's vision for the future of AI and compute infrastructure in a highly competitive landscape. <p style="text-align:inhe

The Silicon Co-Design Group (SCG) sits at the crossroads of architecture, design, marketing, operations, and productization. Our work spans early architecture through final product delivery across Datacenter, Gaming, Robotics, Automotive, and Embedded markets. We work closely across functions to deliver chips that change what is possible. NVIDIA’s Silicon Co-Design Group is hiring a Chip Lead to serve as the technical lead for one of our most consequential silicon programs! This is not project management, and it is not a senior IC role. You are the person the program partners with on its hardest technical questions — when the right answer is not obvious, and when leadership needs a single technical perspective to align on direction. You are accountable for the technical integrity of the chip end-to-end. You guide co-design feature integration, help resolve the toughest multi-functional bugs, and serve as the project-specific custodian of the qualification playbook. The program runs cleaner because you are on it! What you’ll be doing: You will partner across design, validation, software, and manufacturing to keep the program’s technical narrative clear and on track. Day to day, you will: Serve as the single technical point of contact for multi-functional decisions, issues, and trade-offs. Co-lead program-level feature integration from chip to system, surfacing inter-function dependencies and guiding them to resolution. Help resolve the program’s hardest multi-functional bugs by translating ambiguous, multi-team symptoms into root-cause closure on areas such as HBM, power and thermal, high-speed I/O, and packaging. Steward the qualification playbook. When the playbook does not fit a situation, guide the mitigations and capture the lessons as reusable methodology for other SSG programs. Shape the program’s technical narrative by surfacing key risks, trade

Define the physical limits of what a chip can do, then break them! NVIDIA's Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first principles thinking translates directly into product outcomes at scale. As GPU power density and thermal limits approach physical boundaries, the gap between system architecture needs and manufacturable, testable capabilities widens with every generation, and this role exists to close it. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely. The problems here don't have known answers yet: Every generation of NVIDIA silicon pushes closer to the limits of physics. The Co-Design Architect role isn't about optimizing within known bounds; it's about redrawing those bounds entirely. If you want your work to shape what's physically possible in the world's most demanding computing products, this is where that work happens. What you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards. Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting an