Simulation And Modeling Lead in United States

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will develop and evolve the tooling ecosystem that hardware engineers rely on every day — from hardware compilers and IR transformations to simulation, debugging, and automation infrastructure. The work spans software engineering, compiler concepts, and practical hardware workflows, with direct impact on how quickly and effectively we design next-generation AI systems. You’ll collaborate closely with architects, RTL designers, and verification engineers to translate real engineering friction into durable, scalable tooling solutions. In this role you will: Build and improve the software tooling that makes hardware teams faster: compilation, IR transforms, RTL generation, simulation, debug, and automation. Extend and integrate hardware compiler stacks (frontends, IR passes, lowering, scheduling, codegen to Verilog/SystemVerilog) and connect them to real design workflows. Improve developer experience and reliability: reproducible builds, better error messages, faster iteration loops, and dependable CI and regression infrastructure. Work closely with designers and verification engineers to turn real pain points into durable tools. Dive into RTL when needed: read and reason about Verilog/SystemVerilog to debug issues, validate tool output, and improve debuggability. Be willing to go all the way down the stack when necessary, including gate-level views, synthesis results, and implementation artifacts. Help enable PPA optimization loops by building analysis and au

NVIDIA is seeking elite ASIC Verification Engineers to verify the design and implementation of the world’s leading SoC's and GPU's. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of extraordinary people stretching around the globe, whose mission is to push the frontiers of what is possible today and define the platform for the future of computing. In this position, you will help to build the high-performance processor elements that implement programmable compute and graphics functionality. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of the industry's leading GPUs You will be responsible for verification of the ASIC design, architecture, golden models and micro-architecture using advanced verification methodologies such as UVM Understand the design and implementation of your unit, define the verification scope, develop the verification infrastructure and verify the correctness of the design Collaborate with architects, designers, and pre and post silicon verification teams to accomplish your tasks What we need to see: Bachelors Degree in EE, CS or CE or equivalent experience 2+ years of relevant experience Experience in verification using random stimulus along with functional coverage and assertion-based verification methodologies Background with design and verification tools (VCS or equivalent simulation tools, debug tools like Verdi, GDB) Experience crafting test bench environments for unit and system level verification Strong background in System Verilog or similar HVL Expertise with C/C++ programmin

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams. This role is based in San Francisco and requires in-person presence four days per week. In this role, you will: Own PCB layout, component placement, routing, and fabrication release for complex robotic systems. Collaborate with SI/PI engineers to refine layouts based on simulation results. Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements. Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release. Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes. Inspect newly received PCBAs and participate in board-level manufacturing failure analysis. Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models. You might thrive in this role if you: Have 6+ years of experience designing complex, multilayer PCBs. Are fluent in Cadence Allegro PCB Designer and Constraint Manager. Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will build the low-level device runtime that turns compiled programs into efficient, functional and performant execution on OpenAI’s custom AI accelerator. This software will schedule kernel launches, manage device memory and address spaces, coordinate synchronization, and expose reliable abstractions to higher-level runtimes and frameworks. You will work at the boundary of software and hardware, partnering with compiler, kernel, architecture, verification, and silicon teams to define interfaces and validate behavior. You will also use and improve event-based, cycle-accurate simulation to develop runtime capabilities before silicon is available, diagnose performance and correctness issues, and guide hardware-software co-design. In this role, you will: Design and implement the low-level device runtime for OpenAI custom silicon. Build kernel-launch scheduling, command submission, queueing, dependency tracking, and completion handling. Manage device memory spaces, allocation, virtual-to-physical mappings, data movement, and lifetime across concurrent workloads. Implement synchronization primitives, events, barriers, streams, and ordering guarantees that are correct and efficient. Define clean interfaces between the runtime, drivers, firmware, compiler-generated code, kernels, and higher-level execution systems. Use event-based, cycle-accurate simulators to develop, validate, debug, and performance-tune runtime behavior before and after silicon availability. Di

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a senior Actuator Electromagnetic Design Engineer to lead the development of custom electromechanical actuators for advanced robotic systems. You will own actuator development from early architecture and concept generation through prototype validation and system integration, partnering closely with mechanical, electrical, controls, firmware, reliability, and manufacturing teams. This role focuses on the design, integration, and validation of precision electromechanical systems, including motors, transmissions, sensing, structural components, and thermal architectures. You will help drive actuator development across the full engineering lifecycle while establishing scalable design, test, and integration practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will: Lead the architecture, design, and integration of custom robotic actuators, including the design, simulation, integration and sourcing of custom electromagnetic components. Define actuator requirements and system-level trade studies around torque density, bandwidth, efficiency, thermal performance, inertia, reliability, manufacturability, and cost. Design precision electromechanical assemblies with strong attention to tolerances, alignment, load paths, thermal expansion, sealing, wear, and serviceability. Drive actuator integration into robotic systems, partnering closely with controls, firmware, electrical, and robotics software teams to optimize closed-loop performance. Devel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As a NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Silicon Co-Design Group (SCG) is a wide-ranging, multi-functional, integral team at NVIDIA. We sit at the crossroads of design, architecture, marketing, operations, and productization. Our contributions span from the arch stage and extend to defining final products. We architect innovative solutions for Datacenter, Server, Gaming, Robotics, Automotive, and Embedded markets. We are fast-paced, dynamic, share a sense of humor, and collaborate extensively to push the boundaries of what is possible. We do all of this with an eye on making groundbreaking, impactful market disruptions! We are seeking an experienced Senior Manager to lead Product Co-Design and Verification in areas of Speed, Reliability and Power Compliance. You will oversee speed/timing/reliability system design, Simulation-to-Silicon power/speed verification, features for product compliance and test chip development crating future product roadmaps. The ideal candidate will have deep technical expertise in semiconductor/VLSI design and a background in translating product requirements into design and vice versa. This is a highly visible, multi-functional role to produce outstanding products that ship at SOL and meet the high NVIDIA quality we demand and customers expect. <p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Senior Analog Design Engineer to join our High Bandwidth Memory (HBM) team. This role is responsible for the architecture, design, simulation, and silicon bring ‑ up of high ‑ performance analog and mixed ‑ signal circuits used in HBM PHYs and supporting infrastructure. The ideal candidate has deep expertise in high ‑ speed I/O, clocking, power management, and advanced ‑ node analog design, and has successfully delivered silicon to production. Responsibilities will include, but are not limited to: Design and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Firmware & Product Test (FPT) team plays a critical role in delivering high-quality enterprise SSD solutions by ensuring firmware functionality, reliability, and compliance. We work across simulation, FPGA, and hardware environments to validate modern storage technologies, build scalable automation, and drive continuous improvement in validation methodologies. Our team values technical excellence, collaboration, and innovation, including the use of AI-enabled tools to enhance engineering productivity and quality. As a Principal Test Development Engineer, you will serve as a technical leader for firmware validation, defining verification strategies, advancing automation frameworks, and driving complex failure analysis efforts. This role offers the opportunity to influence product quality across multiple SSD programs while mentoring engineers and partnering closely with firmware architects to improve testability and validation effectiveness. Responsibilities: Lead verification strategy, test planning, automation, and coverage closure for NVMe front-end firmware features across multiple product lines Architect and enhance scalable Python-based test automation frameworks, CI/CD integration, regression infrastructure, and reporting capabilities Drive root-cause analysis and failure triage using firmware traces, protocol analyzers, system logs, and structured debug methodologies Define validation standards, review test code, mentor engineers, and promote standard methodologies in automation and qua

Senior Structural Analysis Engineer – Interiors Stress Company: The Boeing Company 787 Airframe in Boeing Commercial Airplanes is hiring for a Senior (Level 4) Structural Analysis Engineer for our Interiors Stress team to work at our North Charleston, SC location. At Boeing, our engineers share a passion to redefine what’s possible. To turn dreams into reality. To bring cutting edge technology to market. If you are seeking a dynamic, innovative environment, this opportunity is for you! This is a great opportunity to work in the Commercial Airplanes South Carolina Design Center, as a Structural Analysis Engineer. Primary Responsibilities: Performs lead level “advise/assist/check” stress analysis responsibilities on Boeing 787 Aircraft Interiors products. Performs stress analysis using classical hand analysis methods, Finite Element tools/methods, and/or Dynamic Simulation tools/methods. Reviews and provides lead signature for Boeing technical oversight of supplier documents including engineering drawings, analysis, test plans, procedures, and reports. Leads development, integration and documentation of structural requirements to establish the Interior Commodity designs. Coordinates with other engineering groups to establish the product's environment such as load cases, interface architecture, and interface loads. Guides product design and verifies structural integrity throughout the product lifecycle to develop the structural environment, characteristics and performance. Leads development of test plans and configurations, supports test execution and analyzes/reports test results to validate and verify systems an