Micron’s DRAM Design Engineering Group (DDEG) – Technology is a global organization dedicated to advancing memory and storage innovation. The team collaborates across fields to solve complex semiconductor challenges and deliver world-class memory solutions through creativity,…
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職務内容 Micron Technology, Inc.のNVE設計エンジニアリング部門アナログ設計グループのシニア設計エンジニア/スタッフ設計エンジニアとして、専門知識とMicron独自の手法を活用し、メモリ製品の開発に用いられるコア回路およびミックスドシグナル回路の設計・解析を行い、業界最高水準のメモリ製品開発に貢献します。 主な責任 NAND回路ブロックの設計、シミュレーション、最適化、およびフロアプランニングを行う。 設計の実現可能性を評価し、さまざまなユースケースにおける回路機能を解析する。…
As a Principal SSD Systems Design Engineer within Micron’s Solid State Drive (SSD) Product Development Team (PDT), you will serve as a technical leader and strategic influencer across global teams. Using your extensive experience, you will drive SSD innovation from concept…
At Micron, we're not just designing chips. We're building the physical architecture that powers artificial intelligence, accelerates cloud computing, enables autonomous vehicles, and connects the world through mobile and edge devices. Every breakthrough in AI — from large…
We’re building the next generation of DRAM technology and pushing what’s possible at the intersection of device physics and circuit design. Our team thrives on solving deep technical challenges and turning innovative ideas into high-performance, manufacturable memory solutions.…
Responsibilities of your team will include, but are not limited to: 1. Contributing to the development of new DRAM, emerging memory products and IP’s by enabling the overall design, layout, and optimization of Memory/Logic/Analog circuits 2. Supporting design validation &…
The Memory Systems Engineering team develops the digital and mixed-signal foundation that enables Micron's High Bandwidth Memory (HBM) products. The team works across architecture, PHY, design verification, DFT, and silicon validation functions to deliver innovative memory…
Silicon-to-systems solutions that transform how the world uses information. With over 45 years of industry leadership, Micron’s teams work across technology development, product engineering, and systems design to deliver high-performance, high-reliability memory products. As a…
As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product…
Key Responsibilities: Develop, integrate, and optimize custom test circuit architectures for NAND flash memory designs, including transistor-level digital, analog, mixed-signal, monitoring, control, and memory-array interface circuits. Interpret product specifications and test…
Key Responsibilities: Take responsibility for designing digital IP blocks from initial microarchitecture to RTL creation, integration, and supporting physical hardware development. Define and review module interfaces and system-level architecture. Actively leverage AI‑based…
HBM SoC RTL Design Engineer at Micron in United States. Full-time · On-site.
Join Micron’s Memory Systems Engineering team and contribute to the development of premier digital and mixed-signal foundations for our high-bandwidth memory (HBM) products. This position offers an outstanding chance to work intimately with multiple engineering areas,…
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual…
Job Description: As a Mixed-Signal Design Engineer in Micron’s Pathfinding Design Team, you will play a key role in crafting next-generation memory technologies. This position involves contributing to defining, developing, and analyzing high-speed logics to operate the memory.…
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