Advanced Development Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Summary: As a Design Verification Engineer Intern at Micron, you will collaborate with highly innovative design and verification teams to support the development of advanced DRAM and emerging memory technologies. This role offers hands-on exposure to high-density memory products, complex verification methodologies, automation tools, and industry-leading semiconductor design practices. You will work within a global engineering environment while learning from experienced engineers and contributing to world-class memory solutions. Responsibilities Support verification activities while developing an understanding of chip-level and block-level functionality for advanced memory products. Assist in developing and maintaining digital and analog verification environments for DRAM technologies. Create test patterns, execute regressions, and help improve functional coverage of memory features and architectures. Analyze verification failures, support debugging efforts, and collaborate with engineers to identify root causes. Participate in automation, scripting, AI-assisted engineering solutions, and verification flow improvements while collaborating with global teams. Minimum Qualifications Currently pursuing the final year of a Bachelor's degree or a Master's degree in Electronics Engineering, Electrical Engineering, or a related field, with enrollment in an accredited university program. Basic understanding of digital logic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,

Lead RF Engineer - Aperture Architect Company: The Boeing Company Boeing Defense, Space & Security is seeking a Lead RF Engineer – Aperture Architect to serve as the engineering lead for the antennas and apertures on a major air proprietary program. As the Lead RF Engineer – Aperture Architect, you will provide technical leadership and drive technical execution in the development of advanced RF antennas that balance performance across sensing, structural, and low observable requirements. You will be the technical lead for a team of engineers designing and integrating modern RF apertures and antennas. You will work with the IPT leader and IPT Chief Engineer to ensure the team produces a compliant system design. Position Responsibilities: Drives technical excellence throughout all aperture design activities Provides technical leadership and ensures use of best practices across programs Provides oversight and approval of technical approaches, products, and processes. Works closely with program managers, program chief engineers, and other Boeing teams to ensure mission success and prompt resolution of anomalies Provides mentoring and coaching to other aperture design engineers Captures lessons learned and best practices for implementation on future programs Resolves complex problems impacting completion of program milestones Basic Qualifications (Required Skills and Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for designing and analyzing digital and analog circuits used in the development of memory products. Engage in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. Collaborate with various internal design and verification teams all over the world and support the efforts of groups, including Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsible for power delivery network evaluation and optimization of DRAM designs, as well as design and optimization block level power generators. Utilize both analog and digital CMOS design skills to work on the analog circuits. Responsible for working with Product Engineering to verify silicon performance vs simulation performance of circuits you design. Work with Process integration and transistor modeling personnel in designing the circuits to be used on Micron's next groundbreaking process node. Review product requirements and logic diagrams for device definition. Responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor devices and components. Employer will accept a Bachelor's degree in Computer Engineering, Electrical Engineering, Electronics Engineering, or related field, followed by fi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Responsibilities: Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods Identify, diagnose, and resolve assembly process related problems Coordinate and complete process, equipment, and material evaluati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Realtime Defect Analysis (RDA) Technology Development Engineer in APTD, you will learn how to use pioneering defect detection equipment and processes to solve issues and drive improvement. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development (TD). We're seeking an engineer who is passionate about creative problem solving and finding innovative solutions. This position will provide the opportunity for you to collaborate with engineers in process integration, process development, data science, and yield analysis within and outside of TD. Your ideas will impact the team globally! We need someone who will investigate process anomalies through root-cause analysis, data manipulation, and correlations. You will be expected to support experimentation, data analysis, baseline health metrics, and systema

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Technology Development (TD) department at Micron Technology leads innovation. It drives the advancement of data retention and storage systems that change how the world uses information. The team develops next-generation semiconductor processes and technologies and works closely with global R&D and manufacturing teams to bring innovative solutions from concept to production. Join a collaborative environment where you will help shape the future of semiconductor technology while working alongside experienced engineers and technical leaders. Position Overview As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), your role includes developing advanced packaging approaches and linking technologies. You will contribute to their integration in future semiconductor products. Working in a highly collaborative R&D environment, you will support process development, technology evaluation, and qualification activities while gaining hands-on experience with modern semiconductor technologies. This role provides an excellent opportunity for engineers who are passionate about innovation, problem-solving, and continuous learning. Responsibilities Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products. Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance. Participate in e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Create optimi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Description: As a technical member of Micron’s ASIC Verification team, you will have a key role in development of advanced verification components for complex IP designs, while ensuring on time delivery with best-in-class quality. Typical tasks include: development of new simulation environments, execution of verification plans while interfacing with design teams, and debugging complex problems. You must be familiar with constrained random verification and functional coverage closure. Additionally, you will be a self-starter, possess excellent analytical and problem solving/debugging skills, and have excellent verbal and written communication skills. Responsibilities include, but not limited to: ASIC/FPGA design verification experience with UVM methodologies Developing UVM-based SystemVerilog test-benches. Defining block, sub-system level verification plans. Understanding and knowledge of verification methodologies, flows and quality metrics. Excellent problem-solving skills. This role is expected to utilize Micron-approved AI tools and AI-enabled workflows to improve engineering productivity Team player with great interpersonal communication skills. Minimum Qualifications: Strong leadership and communication skills, with the ability to convey complex technical concepts to other peers in verbal and written form Experience with python programming language A proven ability to achieve result

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an Engineering Project Management Engineer in Advanced Packaging Technology Development at Micron Technology, Inc., you will be responsible for leading and managing Micron’s Advanced Packaging Technology Development projects. Your role will focus on overseeing technology development operations across various TD and pre-NPI projects, ensuring that results are delivered on time and in line with APTD’s technology roadmap and commitments. This position requires a customer-obsessed leader who will play a key role in the planning and implementation of APTD builds. You will engage with internal customers and both internal and external stakeholders, working collaboratively to ensure successful and timely project handovers. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project/Program Management: Lead technology development programs and projects to deliver against defined go-to-market timelines. Align program- and project-level plans, dependencies, and deliverables to ensure timely, c

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s Singapore Process Development (PD) group in Technology Development (TD) is looking for Plasma-CVD / Diffusion PD engineer to support Plasma-CVD/DIFF process development of advanced technology nodes. You will design and optimize Plasma-CVD or Diffusion for Micron’s innovative NAND Flash products. As a PD Engineer, you will take ideas from conception through process development then implementation in our manufacturing facilities. In addition to your technical responsibilities, you will also run the projects of highly technical nature. This role is essential to the success of Micron’s products and may require business-related travel. Primary areas of responsibility include Plasma-CVD or Thermal Diffusion process and film characterization, optimization, design, troubleshooting, process transfer and fundamental research. Advanced Thin Films PD Engineer will interact with groups such as Process Integration, Metrology, Surface characterization labs, Electrical Failure Analysis, Yield Enhancement, Manufacturing and Equipment vendors/suppliers, to ensure robust thin film processes that meet the precise physical and electrical requirements for Micron Products. As an Advanced Thin Films PD Engineer at Micron, you will be required to travel for brief business purposes. This position requ

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s Singapore Process Development (PD) group in Technology Development (TD) is looking for Plasma-CVD / Diffusion PD engineer to support Plasma-CVD/DIFF process development of advanced technology nodes. You will design and optimize Plasma-CVD or Diffusion for Micron’s innovative NAND Flash products. As a PD Engineer, you will take ideas from conception through process development then implementation in our manufacturing facilities. In addition to your technical responsibilities, you will also run the projects of highly technical nature. This role is essential to the success of Micron’s products and may require business-related travel. Primary areas of responsibility include Plasma-CVD or Thermal Diffusion process and film characterization, optimization, design, troubleshooting, process transfer and fundamental research. Advanced Thin Films PD Engineer will interact with groups such as Process Integration, Metrology, Surface characterization labs, Electrical Failure Analysis, Yield Enhancement, Manufacturing and Equipment vendors/suppliers, to ensure robust thin film processes that meet the precise physical and electrical requirements for Micron Products. As an Advanced Thin Films PD Engineer at Micron, you will be required to travel for brief business purposes. This p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions! In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction! Job Description As a Staff DRAM Design Engineer, you’ll play a critical role in shaping memory architectures and circuit innovations that directly impact product performance, power, and reliability. This is a hands-on design role where your expertise will drive key decisions from concept through silicon validation, while collaborating with cross-functional teams to deliver meaningful results. Responsibilities: Lead design and optimization of DRAM circuits including memory array, control logic, datapath, and test logic Perform and analyze circuit simulations using tools such as SPICE and Verilog Evaluate architectural trade-offs impacting power, performance, and die size Integrate layout parasi