Advanced Development Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our Team Micron’s Engineering Tool Development (ETD) group develops advanced software solutions that enable innovation across Micron’s technology development and manufacturing organizations. The team works at the intersection of software engineering, computer vision, and semiconductor technology to deliver tools that improve efficiency, yield, and insight across a broad range of engineering disciplines. Job Summary As a Computer Vision Engineer, you will apply computer vision, image processing, and machine learning techniques to solve complex software problems. You will work with multiple programming languages, frameworks, and disciplines, and you will be encouraged to experiment with new technologies while continuously developing your skills in a fast‑evolving technical environment. As an engineer in the Engineering Tool Development group, you will have the opportunity to work on a broad set of technologies and solutions that enable Micron’s innovation across technology development and manufacturing. Key Responsibilities Design and develop advanced image processing and analysis solutions to extract measurements, perform calculations, and analyze image data. Apply computer vision, image p

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Overview This internship project is designed to provide students with hands‑on learning exposure to data analytics, machine learning, and statistical modeling applied within Process Integration (PI) for advanced NAND technology development. The intern will work on a defined project focused on exploring how data‑driven approaches can support process learning, experimentation, and engineering decision‑making. Through this project, the intern will gain exposure to process, inline, and electrical datasets, and learn how analytical insights can be translated into prototypes, analyses, and documented learnings relevant to PI engineers. Key Responsibilities Build and evaluate data ‑driven models to support PI outcomes such as cycle‑time reduction, faster learning loops, and process optimization. Perform statistical analysis of split experiments (e.g., DOE‑related analysis), including data preparation, feature engineering, and model interpretation. Conduct split-DOE and conversion analytics , including datamining and statistical evaluation of split outcomes (e.g., ANOVA‑style learning). Identify opportunities to accelerate process learning</

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your role at Baxter: The CAD Specialist supports mechanical product development through advanced SOLIDWORKS modeling, drawing creation, CAD standards, and administration of the SOLIDWORKS PDM Professional environment. This role establishes and promotes CAD best practices, maintains accurate and controlled engineering data, supports CAD users, and helps ensure product design information complies with applicable quality, document control, and change management requirements. The successful candidate will combine strong CAD expertise, practical PDM administration experience, attention to detail, and effective problem-solving and communication skills. What you will be doing : · Creates and modifies complex 3D parts, assemblies, configurations, and production drawings using SOLIDWORKS. · Applies sound CAD practices, including stable design intent, appropriate feature structure, controlled external references, reusable design methods, and maintainable assembly architecture. · Produces and reviews engineering drawings for c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, the Process Pathfinding organization develops next-generation semiconductor memory technologies and innovative device architectures. The team focuses on advancing process technologies that enable future memory products through fundamental research, process integration, and collaboration across engineering fields. This is an outstanding opportunity to contribute to innovative semiconductor development in a fast-paced, knowledge-focused environment. As a DRAM Dry Etch Process Pathfinding Intern, you will support the development of advanced plasma etch processes for emerging memory technologies. Working alongside experienced engineers and multi-functional partners, you will gain hands-on experience with dry etch equipment, semiconductor process development, materials characterization, and data-driven problem solving. This role provides exposure to advanced manufacturing environments while contributing to process solutions that improve device performance and reliability. Responsibilities Conduct experiments and fundamental research to develop innovative dry etch solutions for next-generation memory technologies. Partner with the Pathfinding team to develop and optimize dry etch processes that meet physical and electrical performance requirements. Apply analytical, statistical, and problem-solving methods to evaluate process performance, hardware capability, and process capability, and aid in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal HBM RTL Designer, you will serve as a technical leader driving the front‑end digital design of next‑generation High Bandwidth Memory (HBM) products. This role requires deep expertise in RTL architecture, build methodology, and multi-functional technical leadership. You will own complex design blocks end‑to‑end—from architectural definition through production‑quality implementation—while mentoring engineers, influencing design strategy, and ensuring world‑class design execution. Responsibilities: Define, architect, and lead the development of advanced RTL blocks for HBM subsystems, ensuring alignment with product requirements and architectural goals. Own end‑to‑end front‑end design, including micro‑architecture, RTL development, simulation strategy, and design quality. Drive technical decisions across circuit development, synthesis, constraints, and physical‑design integration, ensuring timing, power, and area compliance. Champion design methodologies, develop reusable frameworks, and improve RTL design flows, validation strategies, and sign‑off processes. Collaborate closely with physical design, verification, architecture, and product engineering to integrate subsystems and deliver high‑quality silicon. Lead root‑cause analysis and corrective actions for complex design issues, ensuring long‑term design robustness. Communicate effectively at all levels, contributing to technical planning, project execution, and cross‑organizational alignment. Minimum Qu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Team Join Micron's SMAI Engineering Tool Development group — a cross-disciplinary team dedicated to developing cutting edge software solutions that power the next generation of semiconductor manufacturing. Our mission is to build intelligent, scalable tools that enable precision automation, image based process control, and analytics for advanced manufacturing technologies. This team partners closely with process engineers, data scientists, and manufacturing technology experts to solve some of the most challenging problems at the intersection of semiconductors, imaging, and software engineering. Key Responsibilities Lead, mentor, and grow a team of fullstack software engineers, fostering a culture of technical excellence, collaboration, and continuous improvement. Own hiring, onboarding, performance management, and career development for team members. Drive technical strategy and architecture decisions for applications that enable image processing, inspection automation, and data driven decision making for advanced manufacturing. Partner with process engineering, equipment teams, and SMAI stakeholders to align development priorities with business objectives and translate requirements into robust software solutions. Manage project planning, capacity allocation, and delivery timelines across concurrent workstreams. Establish and champion engineering best practices including code quality, testing standards, CI/CD processes, and d

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies. Responsibilities and Tasks Lab Management, Compliance & Audits Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards. Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency. Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime. Evaluate and introduce new FA tool models and capabilities in partnershi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview The Principal Engineer in Process Development – Advance Thin film plays a critical leadership role in the strategic advancement and implementation of sophisticated structural and electrical film processes for NAND memory technology. This position is responsible for defining technical direction, fostering innovation, and ensuring the successful integration of new processes into manufacturing. The Principal Engineer works collaboratively across multiple teams, contributes to the establishment of technology roadmaps, and deliv

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Main Responsibilities: Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications. Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products. Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect out

Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND — Fab 10N/X, Singapore. Apply via Workday.

This position is responsible for advancing the development of new golf club head designs, materials, manufacturing technologies, and engineering processes to support the next generation of breakthrough products. As a key member of the Asia Advanced Design team, this role supports advanced design projects aligned with TaylorMade's long-term technology and product development roadmap. Working closely with suppliers across Asia and global R&D teams, the position provides technical leadership through project management, innovation, problem solving, research, testing, and product validation. Travel within Asia, including Vietnam and China, may be required to support project execution and maintain strong collaboration with suppliers and cross-functional partners. This position requires proficiency in leading suppliers, planning, design studies and evaluation, process studies, materials (including metals, polymers, carbon composites), analysis, prototyping, testing, and manufacturing processes relevant to golf club heads. Experience in one or more manufacturing processes is required, with preference given to candidates who have exposure to multiple manufacturing technologies, including casting, forging, machining, forming, welding, heat treatment, surface finishing and coating processes, molding, joining technologies, additive manufacturing, and automation. To drive successful results, this role also requires aptitude in project management, time management, critical thinking, detailed problem solving, efficient, accurate and complete communication, collaboration, reporting and documentation in a fast-paced environment. Essential Functions and Key Responsibilities: Provide technical leadership, mentorship, and knowledge sharing to support team growth, collaboration, and engineering excellence. <span style="c

About the Role You will contribute to and own aspects of the Volantis A-0 and A-1 package. We are interested in both people with package design as well as package process development backgrounds Our end goal has challenges to overcome in warpage, CTE mismatch, thermomechanical aspects, assembly speed and more. We're building a wafer-scale package with both silicon and compound semiconductor dies sitting together at very high TDP. This creates both unique challenges and opportunities. The end result is breaking the memory wall, enabling a new era of AI, and a platform that scales another 1-3 orders of magnitude. What We Look For Ability to think from first principles about novel problems- not just applying existing solutions outside of their range of application. What works for 5x reticle platforms may not work for 56x reticle platforms Design or process development of complex packages Nice to Have: Experience with heterogeneous material assemblies Experience with high-TDP packages Experience with compound semiconductor assemblies Experience with co-packaged optics Ability to work with architects to co-design system architecture and package design Experience with interposer platforms such as CoWoS, CoWoS-L, CoWoS-R, EMIB, FoCoS, FoCoS-Bridge, etc Experience with flip-chip integration, especially mass reflow, TCB & LAB Experience with large scale (>50x50mm) substrates Compensation Package: Competitive Base salary + Significant Equity Stake. You'll be well compensated while also owning a piece of the outcome. California Pay Range: $250K-$400K

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Job Title Senior/Advanced Mechanical Engineer Job Description In this role, you have the opportunity to Play a critical role in the development of Medical System. The right candidate will have a unique opportunity to create innovative designs. Work with global experts at Best Netherland and Suzhou China on MRI product development for multi platforms. undefined Drive the development activities on MRI major components such as MRI RF receive coils and Patient table. Provide innovative solutions for better user experience and workflow. You are responsible for Lead the end-to-end mechanical design of MRI RF receive coils and Patient Table including concept design, industrial design solution evaluation, design transfer and post-market maintenance. Lead technical feasibility assessments and design discussions with cross-functional team members during the concept stage and provide technical design solutions. Own the detailed design delivery for mechanical components, design specifications, BOM, DFMEA, design review, verification & validation, etc. during PDLM execution. Lead trouble shooting and root cause analysis on issues from customer or production line, as well as design verification and product validation, ensure deliverables have no risk in quality, safety and reliability. Partner with technical leadership to ensure that the technical deliverables are consistent with the goals of programs, projects, or initiatives. You are a part of A progressive and energetic team that contributes directly to the growth of the business. You have a direct reporting line to the Director, Patient Environment Team. To succeed in this role, you should have the following skills and experience Bachelor’s degree or higher in Mechanical Engineering or rela