Advanced Development Engineering Student Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a highly experienced Staff Engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description: Responsibilities will include, but are not limited to: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 5+ years of experience in semiconductor industry in areas such as Process Integration, Yiel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking an engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description Key Responsibilities: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 2+ years of experience in semiconductor industry in areas such as Process Integration, Yield Enhancement, Product Engineering, Design, Test Structure Development

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role: Lead the Advanced NAND Process Integration team responsible for defining and enabling Micron's next-generation NAND technology roadmap. This role drives technology pathfinding, advanced architecture development, and cross-functional execution while building and leading a high-performing global engineering organization. Key Responsibilities: Drive the NAND technology roadmap, pathfinding strategy, and advanced architecture development by identifying critical technology gaps and leading cross-functional innovation to enable future product requirements. Lead technology development from concept through delivery, including process architecture definition, CSPEC/FMEA development, test vehicle execution, manufacturable solution development, and workflow optimization to accelerate learning and execution. Lead global NAND pathfinding projects in partnership with Device, Design, Probe, Test, Reliability, Yield, Operations, and Process teams to deliver key technology milestones and drive successful execution. Build, develop, and mentor a high-performing engineering team while fostering a culture of technical excellence, collaboration, accountability,

Job Details: Job Description: Shape the Future of Semiconductor Manufacturing at Intel Join Intel's newest and most innovative organization—Manufacturing Development Customer Engineering (MDCE)—where you'll bridge the critical gap between breakthrough technology development and high-volume manufacturing. As a Senior Wet Etch Manufacturing Development Engineer, you'll be at the forefront of advancing next-generation semiconductor technologies that power the world's most sophisticated devices. Organization Impact MDCE represents Intel's strategic evolution within Intel Foundry Technology Manufacturing (FTM). We're the vital link that transforms cutting-edge research into manufacturable reality, advancing technology nodes from initial qualification to high-yield production while delivering enhanced solutions for foundry customers worldwide. Your Role in Technology Leadership Drive technology innovation that defines Intel's future roadmap while enabling advanced manufacturing processes that set industry standards. You'll develop next-generation device architectures, support high-volume production scaling, and collaborate with world-class suppliers to deliver breakthrough solutions that maintain Intel's semiconductor leadership. Direct Impact Your innovations will power billions of devices globally, ensuring Intel's continued dominance in delivering world-class silicon solutions that push the boundaries of what's technologically possible. Core Responsibilities Advanced Process Development Lead design, development, and optimization of sophisticated manufacturing processes Drive parameter optimization, material selection, and system design to exceed functional requirements

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Senior Conceptual Design Engineer, Advanced Concepts to lead conceptual design of hypersonic and high-speed atmospheric vehicles from mission requirements through preliminary design. You will drive vehicle architecture recommendations, develop configuration baselines, perform first-order sizing, and guide multidisciplinary trades where aerodynamic heating, thermal protection, and propulsion integration fundamentally shape the design space. You will work closely with Aerodynamics and Aerothermal engineers, who own the detailed CFD and aerothermal analysis, and decide how their results reshape the concept. You will also define requirements and validation needs for conceptual sizing and MDAO models in partnership with the MDAO team. This is a new capability at Mach Industries; you will guide early technical direction and shape how the company approaches advanced concept development from first sketch through hardware. This role is part of Conceptual Design within Mach's Vehicle Design and Performance organization, alongside MDAO and Operational Performance. Conceptual Design creates, MDAO enables, and Operational Performance assesses. You will interact with every relevant engineering department across the organization, a

Zoox is developing the first ground-up, fully autonomous vehicle fleet and the supporting ecosystem required to bring this technology to market. Sitting at the intersection of artificial intelligence, robotics, and design, Zoox aims to provide the next generation of mobility-as-a-service in urban environments. We're looking for top talent that shares our passion and wants to be part of a fast-moving and highly execution-oriented team. As a Staff Compute & Controls Systems Engineer in Advanced Hardware Engineering (AHE), you will be responsible for developing and documenting requirements for compute and control system modules, while also driving key functional safety analyses for our compute platforms. You will work across departments at Zoox to build a system-level understanding of how AHE hardware enables critical operational functions, and you will lead the Compute Safety Analysis (FMEDA) that ensures those functions fail safely. You will work closely with hardware and software architects, and with design, safety, manufacturing, and test engineers, to ensure requirements are verified throughout the engineering development process. Your assessments will be critical to meeting milestones as we develop new generations of hardware. In this role, you will: Apply compute, controls, and systems engineering principles to define traceable computing requirements from product goals Engage with product, HW/SW engineering, production, safety, and business teams to author detailed requirements for compute and control modules. Analyze tradeoffs and drive consensus with product, hardware, and software teams to converge on compute architecture for current and new vehicle platforms. Gather and analyze critical data to define metrics, qualify systems for release, and influence system design decisions based on evidence-based insights. Create and maintain clear, precise documentation to support system designs, architectural decisions, an

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today, SpaceX is actively developing the technologies to make this possible, with the ultimate goal of making life multiplanetary and expanding consciousness to the stars. SpaceXSI is building Super Intelligence to help humanity understand the universe. Our teams are building the full Super Intelligence stack: from our Colossus supercomputers, to Grok models, to our suite of applications, including Grok Bot, Grok Build, Grok Imagine, Grok Voice, and X. We're creating a powerful flywheel where more compute trains better models, better models power more useful products, and what we learn from people using those products shapes what we build next. ABOUT THE ROLE: We’re seeking exceptional Applied engineers to join a high-priority project that approximately 600 million monthly users use. This is an exciting opportunity for individuals with a engineer or scientist background to apply their skills to recommendation systems, ranking algorithms, search technologies, and many other systems. You’ll work at the intersection of advanced AI development and real-world impact, enhancing the ability to connect users with relevant content, accounts, and experiences. RESPONSIBILITIES: Designing and architecting recommendation algorithms across various product surfaces Leverage all of SpaceXSI's infra and AI stacks to dramatically enhance the user experience Write data pipelines and training jobs that continuously learn from product data. Iterate and improve the algorithm by gathering user feedback in real time through experimentation Ensuring scalability and efficiency of machine learning systems BASIC QUALIFICATIONS: Knowledge of data infrastructure like Kafka, Clickhouse, and Spark Experienced in implementing recommender systems and/or deep learning applications at industrial scale Skilled in one or more DL software frameworks such as

About the team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the role: We are seeking an experienced Optical Network Engineer to lead Laser related work within our optical interconnect efforts for large-scale compute systems. The role also requires broad, hands-on optical validation experience across IM/DD-based interconnects, working from lab characterization through production readiness and scaled deployment. In this role you will: Drive laser-focused requirements and technical direction within the broader optical interconnect roadmap. Lead evaluation and validation of optical components and subsystems, including laser-based elements, in lab and production-representative environments. Support end-to-end optical testing for IM/DD interconnects (e.g., module/system bring-up, characterization, debug, and readiness for scale). Work with external partners to align on development milestones, performance targets, and quality expectations. Own technical issue triage and resolution across performance, reliability, and manufacturability topics. Collaborate across internal teams to support integration, rollout, and operational success at scale. You might thrive in this role if you have: Strong experience in laser-focused optical engineering (development, validation, manufacturing readiness, or field support). Broad hands-on background with IM/DD optical technologies and optical test/debug workflows. Experience working with external suppliers/manufacturing partners and production-oriented execution. Demonstrated ability to debug complex t

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

We anticipate the application window for this opening will close on - 31 Oct 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life Medtronic Neuroscience is transforming care for patients with neurological, spinal, chronic pain, bladder, and bowel conditions. Through meaningful innovation, advanced neuromodulation technologies, and strong clinical partnerships, we empower clinicians to deliver targeted therapies that restore function, relieve symptoms, improve quality of life, and help patients regain confidence, independence, and greater control over their health. Within Advanced Manufacturing Engineering, this role supports early-stage manufacturing development for next-generation implantable medical devices, partnering closely with research and development teams to evaluate manufacturability, establish scalable process concepts, and accelerate the transition from product concept to manufacturing readiness. This position is based at the Rice Creek facility in Fridley, Minnesota and requires a minimum of four days onsite each week in a laboratory and engineering development environment. The role includes collaboration with internal product development teams, manufacturing sites, contract manufacturers, tooling suppliers, and external development partners. Check

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology , our manufacturing and process engineering teams drive innovation in semiconductor fabrication through advanced process development, operational excellence, and continuous improvement. Engineers in this organization collaborate across process, equipment, quality, and manufacturing functions to deliver world-class memory solutions while improving yield, quality, cost, and reliability. As a Fab Engineer , you will be responsible for developing, optimizing, and sustaining semiconductor manufacturing processes to support high-volume production. You will work closely with cross-functional engineering teams to resolve process issues, improve process capability, enhance product performance, and implement new materials, equipment, and technologies. The role requires strong analytical skills, data-driven decision making, and the ability to leverage modern digital and AI-enabled tools to improve engineering productivity and manufacturing outcomes. Responsibilities Develop, optimize, and sustain semiconductor fabrication processes to improve yield, quality, reliability, productivity, and manufacturing cost performance. Analyze process excursions and manufacturing issues using methodologies such as SPC, FMEA, root cause analysis, and 8D problem-solving to drive corrective and preventive actions. Evaluate, qualify, and implement new equipment, materials, process recipes, and technology changes while ensuring compliance with performance and quality requirements. <

About the Team The Consumer Products team at OpenAI builds the hardware that brings advanced AI technology directly into people’s hands. We design, engineer, and manufacture next-generation consumer devices that combine elegant design, robust engineering, and cutting-edge AI. Our team spans mechanical, electrical, and systems engineering — partnering closely with industrial design, operations, and software to create seamless, high-quality experiences that make AI more accessible and useful. About the Role As a Hardware Engineer on the Consumer Products team, you’ll contribute to the design, development, and integration of complex hardware systems for new AI-driven devices. You’ll work across disciplines to translate early product concepts into reliable, scalable, and beautifully crafted products ready for mass production. This role is based in Singapore. We follow a hybrid model (four days per week in the office) and offer relocation support for new employees. Occasional travel to manufacturing partners may be required. In this role, you will: Design, prototype, and validate mechanical and electrical subsystems from early development through mass production. Collaborate closely with design, operations, and manufacturing teams to ensure quality, reliability, and scalability. Drive DFM/DFA reviews, design iterations, and bring-up of prototype and pilot builds. Debug complex system-level issues and lead root-cause investigations and resolutions. Partner with global suppliers and cross-functional teams to ensure flawless execution from concept to launch. You might thrive in this role if you: Have 6+ years of experience in consumer hardware, consumer electronics, or advanced product development. Bring deep technical fluency in mechanical, electrical, or systems engineering (cross-disciplinary experience a plus). Have taken at least one consumer product from concept to mass production. Are energized by hands-on problem solving, iteration, and building in fast-paced enviro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The DRAM IP Development (IPDEV) team develops critical digital IP solutions that enable next-generation AI, mobile, client, data center, and graphics memory products. Our team is responsible for delivering high-quality DRAM IPs that drive innovation, product performance, and development efficiency across Micron's memory portfolio. As a Senior or Graduate Engineering Intern in DRAM Circuit Design, you will work alongside experienced engineers to develop and validate digital IP circuits used in future DRAM products. This internship provides hands-on experience with RTL-to-GDS design methodologies, custom design and verification flows, silicon learning, and advanced semiconductor development processes. You will contribute to impactful engineering projects while gaining exposure to industry-standard EDA tools, multi-functional collaboration, and AI-enabled engineering workflows. Responsibilities Support the design, development, and verification of digital IP circuits for next-generation DRAM products using RTL-to-GDS methodologies. Perform circuit analysis across process, voltage, and temperature (PVT) corners to evaluate performance, quality, and reliability. Develop automation scripts and leverage Agentic AI, AI-Assisted tools, or Code Assist solutions to improve engineering productivity and design quality. Collaborate with multi-functional engineering teams on design implementation, verification,