Advanced Development Engineering Student Jobs

About the Team The Consumer Products team at OpenAI builds the hardware that brings advanced AI technology directly into people’s hands. We design, engineer, and manufacture next-generation consumer devices that combine elegant design, robust engineering, and cutting-edge AI. Our team spans mechanical, electrical, and systems engineering — partnering closely with industrial design, operations, and software to create seamless, high-quality experiences that make AI more accessible and useful. About the Role As a Hardware Engineer on the Consumer Products team, you’ll contribute to the design, development, and integration of complex hardware systems for new AI-driven devices. You’ll work across disciplines to translate early product concepts into reliable, scalable, and beautifully crafted products ready for mass production. This role is based in Singapore. We follow a hybrid model (four days per week in the office) and offer relocation support for new employees. Occasional travel to manufacturing partners may be required. In this role, you will: Design, prototype, and validate mechanical and electrical subsystems from early development through mass production. Collaborate closely with design, operations, and manufacturing teams to ensure quality, reliability, and scalability. Drive DFM/DFA reviews, design iterations, and bring-up of prototype and pilot builds. Debug complex system-level issues and lead root-cause investigations and resolutions. Partner with global suppliers and cross-functional teams to ensure flawless execution from concept to launch. You might thrive in this role if you: Have 6+ years of experience in consumer hardware, consumer electronics, or advanced product development. Bring deep technical fluency in mechanical, electrical, or systems engineering (cross-disciplinary experience a plus). Have taken at least one consumer product from concept to mass production. Are energized by hands-on problem solving, iteration, and building in fast-paced enviro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s vision is to transfer how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next generation DRAM in the manufacturing Fab, ramp up production yield and deliver high quality DRAM products to customers. You will be offered hands-on experience in semiconductor process integration, electrical data analysis, with exposure to advanced technology development, yield improvement, and cross-functional collaboration. Responsibilities Support integration of process modules across various DRAM module loops. Analyze electrical and inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement. Document findings and present updates to engineering and leadership teams. Leveraging AI tool to improve problem solving efficiency and productivity Requirements: Strong knowledge of semiconductor devices is required. Advanced CMOS or capacitor knowledge is preferred. Basic Knowledge of mainstream memory such as DRAM, NAND, NOR et al. Knowledge of sta

Job Details: Job Description: Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. About This Role: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements. Your Mission: Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes. Key Responsibilities Process Innovation and Excellence Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules Drive defectivity reduction and uniformity improvements through systematic process enhancement Lead technical problem resolution and deliver solutions that meet aggressive technology node targets Optimize equipment performance working with internal teams and key suppliers Strateg

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Technology Development (TD) organization delivers critical manufacturing systems and software solutions that enable innovation, operational excellence, and future high-volume manufacturing capabilities. The team partners closely with engineering, manufacturing, infrastructure, and IT organizations to ensure reliable, scalable, and high-performing technology solutions that support advanced semiconductor development and production. As an IT Software Support Engineer, you will develop, maintain, and support software applications, databases, and data analysis solutions that are essential to manufacturing operations. This role requires strong solving, analytical, and technical skills, along with the ability to collaborate across global teams to resolve issues, improve system reliability, and drive continuous improvement. You will leverage modern development practices, automation, and AI-enabled technologies to enhance operational effectiveness and customer experience. Responsibilities Support, develop, and maintain manufacturing software solutions, databases, and data analysis systems to ensure high availability and operational performance. Fix and resolve critical system issues, minimize downtime, and implement sustainable software solutions that improve reliability and supportability. Design and develop utilities, monitoring solutions, metrics, and automation tools that improve support efficiency and operational visibility.</spa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab-technology co-optimization , and advance Micron's leadership in data-driven semiconductor memory innovation. Qualifications: Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Solid experience with Plasma, FPM, HAR etching, and MC modeling Experience with Wet Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Experienced Electrical & Test Engineer Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks an Experienced Electrical and Test Engineer to serve as an Automated Test Equipment Engineer to join our Patriot Advanced Capability-3 (PAC-3) Electrical Engineering Capability Team in Huntsville, AL . We design, sustain, and upgrade next generation electronics concepts and support production and special test equipment design for increasing capacity requirements. Position Responsibilities: Support design of automated test equipment, development of engineering documentation, and hardware fabrication, integration, and validation testing Develop, document, and maintain electronic and electrical system requirements according to customer desires and contract requirements Create and implement overall Test Equipment Design strategies Review and apply real-time test anomaly troubleshooting and resolution of issues encountered during hardware validation and verification testing Support fielded test equipment hardware and software over the entire product lifecycle Research emerging technologies for potential applications to meet projected requirements Perform Root Cause Corrective Action (RCCA) investigations, troubleshooting, and resolutions This position requires the ability to get a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Sc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. OMT Metro Application M1 Job Description Summary OMT Metro Applications M1 leads the team to drive yield improvement and metrology tool path expansion to support scaling needs and improve process window margin through advanced application development, cross-fab standardization, and team capability build-up. This is an outstanding opportunity to be part of a world-class engineering team that is dedicated to pushing the boundaries of technology and innovation. Responsibilities Drive metrology application strategy to improve yield, detection capability, and cost efficiency Develop and optimize metrology recipes and methodologies to improve sensitivity, accuracy, and robustness Enable shift-left defect detection and accelerate yield learning Align with suppliers on technology roadmaps, capability gaps, and new solution development Establish and standardize BKMs and guidelines across fabs Lead cross-functional execution to close technical gaps and deliver key initiatives Build and develop team capability, including a clear ownership structure and strong technical depth Requirements GJS: E3 with two years of expe

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s vision is to transfer how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next generation DRAM in the manufacturing Fab, ramp up production yield and deliver high quality DRAM products to customers. You will be offered hands-on experience in semiconductor process integration, electrical data analysis, with exposure to advanced technology development, yield improvement, and cross-functional collaboration. Responsibilities Support integration of process modules across various CMOS module loops. Analyze inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement. Document findings and present updates to engineering and leadership teams. Leveraging AI tool to improve problem solving efficiency and productivity Requirements: Knowledge of semiconductor process flow. Knowledge of DRAM process flow is a plus. Basic Knowledge of mainstream memory such as DRAM, NAND, NOR et al. Some knowledge of individual processes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Summary As an APTD MTS (Member of Technical Staff) based in Taiwan, you will lead and develop the IoT engineering team delivering Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will set technical direction and priorities, drive execution from proof-of-concept through deployment, and build scalable, secure solutions that improve quality, productivity, and early risk detection. You will partner cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while building a culture of safety, accountability, and continuous learning. Key Responsibilities Lead, coach, and develop the IoT engineering team; set clear expectations, provide regular feedback, and build growth plans aligned to APTD needs. Own team execution: define goals/KPIs, prioritize the IoT roadmap, assign ownership, and ensure high-quality, on-time delivery from concept to factory deployment. Drive end-to-end IIoT solution development: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Drive machine vision solutions: guide hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm approach, performance validation, and deployment readiness. Partner with process, equipment, automation, quality, and IT/data platform stakeholders to tra

Job Details: Job Description: Shape the Atomic Frontier of Semiconductor Innovation At Intel Foundry Technology and Development (TD), we don't just participate in technology development; we engineer physical reality at the angstrom scale. We are seeking visionary, research-driven Ph.D. graduates in Chemical Engineering, Chemistry, Materials Science, Electrochemistry, and Engineering to spearhead the next breakthrough in semiconductor manufacturing. As a Wet Etch Module Development Engineer, you will operate at the intersection of fundamental chemical kinetics, interfacial surface science, and high-volume manufacturing engineering. You will pioneer atomic-layer selective etching, nanoscale surface cleans, supercritical and surface-tension-engineered drying, wet chemical formulations, and advanced single-wafer wet tool architectures to define the future of global computing. What You Will Do: Pioneer Next-Gen Process Architectures: Formulate and execute rigorous Design of Experiments (DOE) to invent, characterize, and validate novel wet etch, selective removal, and advanced chemical clean processes that power world-class transistor architectures (RibbonFET/GAA), backside power delivery networks (PowerVia), and high-density interconnect scaling Lead Hardware and Module Co-Optimization: Collaborate with premier global semiconductor equipment suppliers and specialty chemical vendors to push single-wafer and batch wet processing capabilities beyond conventional fluid-dynamic and surface-tension limits, co-engineering custom dispense, megasonic, and chamber hardware solutions Harness AI and Scientific Computing: Integrate computational fluid dynamics (CFD), chemical kinetics modeling, statistical physics, and data science (Python, MATLAB, JMP, ML frameworks) to accelerate chemical formulation screening, surfac

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. Position Summary Designs, develops, and implements AI solutions and systems by applying advanced technical expertise to architect and code software applications, conduct system testing and debugging, collaborate with cross-functional teams, and contribute to the overall technical direction and innovation of AI engineering projects. Required Qualifications 5-7 years of professional experience in software engineering and application development. 2&#43; years of hands-on experience on LLMs & Generative AI (LLM) techniques. Expert proficiency in programming skills especially Python, Google Cloud platform and system architecture. Experience in leading engineering teams and driving technical roadmaps. Preferred Qualifications Define and implement AI safety frameworks Strong problem-solving skills and the ability to think strategically. Excellent communication skills for effective collaboration. Cross-functional collaboration Education Bachelor's degree or equivalent work experience in Mathematics, Statistics, Computer Science, Analytics, Engineering, or related discipline. Master's degree preferred <p style="text-align:in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer in Packaging Technology Management at Micron, you will have an outstanding chance to influence and lead the development of world-class packaging technologies. You will work in a collaborative and innovative environment. This role allows you to operate at the forefront of technology in Taiwan, contributing to Micron's strategic goals and helping build the future of the semiconductor industry. AI Proficiency and AI-Enabled Ways of Working Micron is committed to building an AI-enabled workforce. Successful candidates are encouraged to bring to bear approved AI technologies and analytics to improve engineering efficiency, accelerate innovation, improve technical decision making, and streamline collaboration. This includes applying AI-assisted tools for data analysis, technical research, knowledge discovery, workflow automation, competitive intelligence, and technical communication while adhering to Micron policies for responsible AI use, information security, and data governance. Responsibilities and Duties include, but not limited to: Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure flawless technology integration. Consult and influence technical and strategic decisions at senior management levels. Lead multi-disciplinary technical teams and task forc