Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Lithography Pathfinding team is exploring the next generation of semiconductor patterning technologies that will shape future memory solutions. We work closely with technology development, manufacturing, suppliers, and industry partners to evaluate emerging lithography capabilities and prepare for successful implementation at scale. If you are excited by ground breaking innovation and collaborative problem solving, we would love to hear from you! As a Lithography Pathfinding Process Development Engineer, you will evaluate advanced patterning technologies including EUV and High NA EUV for next-generation memory products. You will play a key role in developing new lithography processes, influencing technology roadmaps, and enabling successful transitions from pathfinding to manufacturing. This position offers opportunities to collaborate across organizations and travel to support early High NA EUV development activities. Responsibilities: Lead and participate in pathfinding activities for advanced lithography technologies, including 193nm immersion, EUV, and High NA EUV Develop and optimize EUV lithography processes in a technology development environment to meet future manufacturing requirements Collaborate with process integration, manufacturing, defect inspection, and mask engineering teams to drive process readiness and transfer strategies Support development of inspection methodologies and defect reduction strategies for EUV mask technologies Travel as needed, a
Jobiba hiring network
Advanced Engineering And Manufacturing Internship Jobs
7,330 active opportunities · Updated for October 2026
Fresh results
15 shown
Explore current advanced engineering and manufacturing internship jobs. Use filters to narrow by work mode, employment type, experience and date posted.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Summary The DRAM Packaging organization is responsible for developing and delivering advanced memory packaging solutions that enable Micron’s next generation products. The team partners across design, technology development, manufacturing, quality, supply chain, and external ecosystem partners to drive innovation, accelerate product development, and deliver industry-leading packaging technologies that support markets including AI, cloud, mobile, automotive, high-performance computing, and data centers! Position Overview As the Director of DRAM Packaging, you will lead the strategy, development, and execution of advanced packaging solutions across Micron's memory portfolio. You will define technology roadmaps, drive innovation in next-generation packaging architectures, and build a high-performing global engineering organization. This executive leadership role combines technical expertise, business strategy, customer engagement, and digital transformation to accelerate innovation, improve organizational effectiveness, and strengthen Micron’s competitive position. Responsibilities Define and execute long-term DRAM packaging strategies that support future product, technology, and business objectives Lead development and deployment of advanced packaging technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and next-generation interconnect solutions Drive adoption of AI, machine learning, advanced analytics, and digital engineering
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology group at Micron Technology develops and validates advanced memory solutions that enable the transformation of information into intelligence. The team operates in a collaborative, inclusive, and globally distributed environment, partnering closely with design, product, test, process, manufacturing, and quality organizations to deliver industry‑leading DRAM technologies. The Design Validation Product Engineer supports the validation of new DRAM products by focusing on real‑silicon behavior through bring‑up, characterization, and debug. This role builds a strong technical foundation in DRAM architecture, semiconductor devices, and validation methodologies while working closely with multi-functional engineering teams. Responsibilities Support DRAM design validation through silicon bring‑up, characterization, and validation testing of new memory products Analyze electrical and functional data to identify trends, marginalities, and failure mechanisms Assist with debug of validation issues using simulations, test results, and laboratory measurements Use engineering lab equipment and testers to characterize device behavior and performance Document validation results, test coverage, and observed behaviors while collaborating with design, test, manufacturing, and quality teams Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field Strong fundamentals in digital logic,
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall layout, and optimization of Memory/Logic/Analog layouts Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Technology Development Manufacturing Development Engineering (MDE) Senior Manager , you will lead the MDE organization supporting DLT, MRDA, and WLT process development execution within APTD. The APTD MDE organization serves as the execution engine of technology development by enabling rapid learning cycles, maximizing development velocity, and providing scalable 24/7 execution support across advanced packaging technology development programs. In this role, you will provide organizational leadership, strategic direction, operational governance, and technical oversight to accelerate technology learning and ensure safe, predictable, and efficient development execution. You will establish and continuously improve the MDE operating model, workforce strategy, organizational capability, and execution systems required to support future technology roadmaps. In support of Micron's AI transformation strategy, this role is expected to champion AI-enabled ways of working, promote responsible adoption of AI and automation technologies, and build organizational capability in leveraging AI, data analytics, and digital solutions to improve decision quality, operational effectiveness, workforce productivity, and technology development execution. You will work closely with Technology Development, Manufacturing, Product Engineering, Equipment Development, Quality, and other cross-functional organizations to accelerate technology readiness and achieve business objectives.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Overview|職缺概述 Micron Taiwan is building a long‑term HBM talent pool to support the expansion of advanced memory manufacturing in Taichung. This evergreen posting is intended to attract talents across Engineering, Manufacturing, Quality, Automation, Facilities, and Operations Leadership functions. Micron 台灣持續擴展 HBM(High Bandwidth Memory)製造與營運團隊 ,此 evergreen 職缺用於建立長期人才庫,將依業務需求媒合合適職務。 Potential Roles|涵蓋職務方向(不限於) Manufacturing / Process 製造/製程工程師 Automation & Manufacturing Systems Engineer 自動化與製造系統工程師 Industrial Engineer 工業工程師 Product Quality Assurance / Quality Engineering (PQA / PQE) 產品品質保證/品質工程 HBM Manufacturing / Test Production Supervisor HBM 製造/測試產線主任 Assembly Equipment Engineer / Process Engineer 設備/製程工程師 Facilities Engineer 廠務工程師(水處理/HVAC/氣體系統/擴建工程專案/二次配) What You Will Do|工作內容摘要 Depending on role alignment, responsibilities may include: Support and improve HBM manufacturing, assembly, test, automation, or facility systems 支援並優化 HBM 製造、封裝、測試、自動化或廠務系統 Drive process optimization and yield improvement, enhance product quality, and support new product introduction and production ramp 負責分析與優化
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post- fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologi
Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. This is an onsite role only. Job Purpose and Overview Step into the world of metal additive manufacturing for the KARNO generator , where advanced laser powder-bed fusion meets real engineering challenge. Engineers in this group work across machine behavior, process optimization, material performance, data analytics, and hardware development to ensure high-quality, repeatable production using metal laser powder-bed fusion systems. If you’re the kind of engineer who enjoys digging into machine behavior, fine-tuning laser strategies, studying how materials evolve layer by layer, and pushing metal AM systems to run cleaner, faster, and more consistently, this team is built for you. The work is hands-on, data-driven, and central to scaling a first-of-its-kind distributed power technology. In this role, you’ll move across the entire additive manufacturing ecosystem. You’ll investigate how machine settings influence melt pools, porosity, and microstructure, and you’ll design controlled experiments to refine parameters and boost repeatability. A big part of the job involves troubleshooting machine quirks, interpreting sensor data, and making sense of real-time process feedback. You’ll also be working closely with design, materials, and hardware teams to bring complex AM components from early prototypes into reliable production. Along the way, you’ll help build the systems, standards, and workflows that turn metal AM into a high-trust, high-reliability manufacturing process for power-generation hardware. Duties and Responsibilities: Parameter Development Focus Identify and optimize critical-to-function (CTF) parameters that drive mechanical perfor
About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Propulsion Systems & Mechanical Integration Engineer to own the mechanical integration of propulsion systems across our next-generation defense platforms. In this hands-on role, you will work at the intersection of propulsion, structures, fluids, thermal management, avionics, and vehicle systems to turn propulsion concepts into reliable, testable, manufacturable hardware. You will integrate next-generation engines, fuel systems, valves, pumps, tanks, actuators, thermal protection, and associated support hardware in tightly constrained aerospace vehicles. You will drive the mechanical architecture and interfaces required to accomodate propulsion systems while balancing performance, mass, packaging, manufacturability, reliability, and cost. At Mach Industries, we are redefining the future of defense through advanced, scalable platforms. As a Mechanical Engineer, you will play a key role in prototyping and refining mechanical systems, and optimizing designs for performance and scalability. Collaborating with a multidisciplinary team, you’ll help shape the next wave of defense technologies, from concept to deployment. Key Responsibilities Own mechanical integration of propulsion systems from early architecture and co
Zoox is building the world's most advanced self-driving hardware and software solution, and nearly every part of it depends on moving data reliably. Sensor frames to perception, planner decisions to vehicle controls, telemetry to the cloud, and remote operator video back down again. All of it crosses process, host, and network boundaries under hard latency and reliability budgets, on a vehicle that has to keep working when a link degrades or a network gets congested. The Software Core Connectivity team owns that data path end to end: in-vehicle messaging (pub/sub, RPC, inter-process and inter-host transport), the vehicle's internal network, and vehicle-to-cloud connectivity. It also owns the transport and serialization abstractions the rest of the software organization builds on. Every one of those paths crosses a team boundary, so the work happens alongside firmware, product security, simulation, manufacturing, and IT, and those partners rely on this team for transport and networking depth to achieve their goals. As the team leader you will own the roadmap and the release commitments, and you will spend a real share of your time in those partnerships. In this role, you will: Own the roadmap, staffing, and release commitments across the team's messaging, in-vehicle network, and cloud connectivity work. Lead and grow a team of software engineers, run their performance and promotion cycles, and hire into the gaps. Represent the team in cross-functional programs across firmware, product security, simulation, fleet operations, and infrastructure, and build the relationships that keep shared work moving. Set the technical bar. Make the architecture calls stick, and make sure the abstractions the team ships are ones other teams want to build on. Balance interrupt-driven reliability work against long-horizon architecture, and be explicit with partners about the tradeoff. Qualificati
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Summary As an APTD MTS (Member of Technical Staff) based in Taiwan, you will lead and develop the IoT engineering team delivering Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will set technical direction and priorities, drive execution from proof-of-concept through deployment, and build scalable, secure solutions that improve quality, productivity, and early risk detection. You will partner cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while building a culture of safety, accountability, and continuous learning. Key Responsibilities Lead, coach, and develop the IoT engineering team; set clear expectations, provide regular feedback, and build growth plans aligned to APTD needs. Own team execution: define goals/KPIs, prioritize the IoT roadmap, assign ownership, and ensure high-quality, on-time delivery from concept to factory deployment. Drive end-to-end IIoT solution development: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Drive machine vision solutions: guide hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm approach, performance validation, and deployment readiness. Partner with process, equipment, automation, quality, and IT/data platform stakeholders to tra
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary We are seeking a technically strong Tool Install Engineer with expertise in instrumentation, controls, and electrical systems to support semiconductor tool installation projects. This role provides technical leadership throughout design review, installation planning, construction support, commissioning, and system integration activities within advanced manufacturing environments. The ideal candidate will have experience reviewing engineering documentation, coordinating cross-discipline teams, resolving field execution challenges, and ensuring instrumentation and electrical systems are installed, tested, and commissioned safely and efficiently. This position works closely with engineers, contractors, vendors, and project stakeholders to facilitate semiconductor tool installation activities, ensuring systems are integrated safely, efficiently, and in alignment with project requirements, quality standards, and operational objectives. Responsibilities: Lead technical review and coordination of instrumentation, controls, and electrical scopes supporting semiconductor tool installation projects. Review engineering work including control system architectures, single-line diagrams, loop drawings, wiring diagrams, panel schedules, specifications, and equipment layouts to ensure quality and compliance. Evaluate designs for constructability, maintainability, safety, installation readiness, and alignment with project requirements and industry standards. Coordinate with design firms, cont
About Hark Hark is an artificial intelligence company building advanced, personalized intelligence. One that is proactive, multimodal, and capable of interacting with the world through speech, text, vision, and persistent memory. We're pairing that intelligence with next-generation hardware to create a universal interface between humans and machines. While today's AI largely operates through chat boxes and decade-old devices, Hark is focused on what comes next: agentic systems that interact naturally with people and the real world. To get there, we're developing multimodal models and next-generation AI hardware together - designed from the ground up as a single, unified interface for a new era of intelligent systems. About the Role We're looking for a world-class Engineering Program Manager to lead system builds for our AI consumer products, from early local prototypes through Proto, xVT, ramp, and launch. You'll partner closely with every engineering discipline to architect and execute builds that cover all validation needs and run efficiently on the floor. Location is flexible, with up to 30% in-region travel to ensure every build runs as planned. Requirements 6+ years executing and shipping high technology consumer electronics systems at large OEMs BS in Electrical, Mechanical, or related engineering discipline Proven track record leading hardware builds end-to-end with contract manufacturers, and driving critical supply chain components Experience with high technology manufacturing processes, component lead times, PCB technologies Experience driving programs through prototype, xVT, ramp, and mass production Excellent interpersonal communication and information visualization skills Ability to travel in-region including extended stays during critical builds Responsibilities Lead build planning and execution from early local prototypes through Proto, xVT, ramp, and launch Collaborate closely with EE, ME, SI, RF, thermal, and reliability teams to strateg
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a highly experienced Staff Engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description: Responsibilities will include, but are not limited to: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 5+ years of experience in semiconductor industry in areas such as Process Integration, Yiel
Get new advanced engineering and manufacturing internship jobs by email
Daily job updates · Unsubscribe anytime