Advanced Package Technology Development Iot Mts Jobs

JOB TITLE Software Engineer – Cloud Infrastructure A CAREER WITH POINT72’S TECHNOLOGY TEAM As Point72 reimagines the future of investing, our Technology team is constantly evolving our firm’s IT infrastructure and engineering capabilities, positioning us at the forefront of a rapidly evolving technology landscape. We’re a team of experts who experiment and work to discover new ways to harness open-source solutions, modern cloud architectures, and sophisticated Artificial Intelligence (AI) solutions, while embracing enterprise agile methodologies. Our commitment to building and innovating in the AI space provides the framework intended to drive smarter decision making and enhance how we build and operate our platforms and applications. As a member of Point72’s Technology team, we encourage and support your professional development from day one—helping you advance your technical skills, contribute innovative ideas, and satisfy your own intellectual curiosity—all while delivering real business impact for our multi-billion-dollar global business. WHAT YOU'LL DO • Design, operate, and continuously improve our Kubernetes infrastructure on Amazon EKS, including Karpenter-based autoscaling, workload scheduling, and cluster lifecycle management • Administer and tune PostgreSQL databases (on RDS) that back platform applications such as Airflow — handling configuration, parameter tuning, maintenance, and reliability, not query optimization • Own our Infrastructure as Code using Terraform — provisioning, modifying, and auditing AWS resources including S3, EC2, RDS, EKS, and IAM • Manage IAM roles, policies, and access patterns across our AWS environment with a security-first mindset • Maintain our artifact registries (ECR, Artifactory) — enforcing retention policies, image versioning standards, and responding to infosec requests around package vulnerabilities and container image remediation • Own and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration. Key Responsibilities Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance. Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements. Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance. Drive cross-functional technical investigations and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within the larger SI R&D group, as a Principal Signal Integrity Engineer at Micron, you will be responsible for: Leading the development and analysis of high speed (HS or similar expertise) memory interfaces and power distribution networks (PDN) . Applying AI/ML and data-driven techniques to accelerate Signal Integrity / Power Integrity analysis, build optimization , and engineering decision-making. Applying automation, scripting, and AI-assisted engineering workflows to improve simulation efficiency and coverage. Representing the Signal Integrity R&D team in technical cross-functional collaborative groups , integrating with package build, silicon develop, system invent, product engineering, and marketing departments to ensure overall product performance. Driving and developing SI/PI aspects of future standards (including but not limited to JEDEC, ONFI, and IBIS) through system and product electrical capability exploration. Supporting external customers as needed. Formulating techniques and protocols for SI/PI analysis. Supporting and driving path-finding activities for IO and channel innovation to enable the next generation of memory technologies at higher speeds and densities. Minimum Qualifications PhD or MSEE, or equivalent experience, with at least 5 years of industry experience. Deep experience in Signal and Power Integrity, particularly in areas affecting I/O circui

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Static Timing Analysis (STA) Engineer — you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, DFT, verification, and product teams to ensure timing integrity and drive timing closure across all modes and corners from initial design through tape-out. This is a hands-on senior technical role focused on chip-level STA ownership, constraint authoring, timing closure, methodology development, and pre-/post-silicon timing correlation. Key Responsibilities Responsibilities will include, but are not limited to: Own end-to-end chip-level static timing analysis and sign-off across all checks, modes, corners, and voltage and temperature conditions. Develop, maintain, and validate sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, high-bandwidth memory (HBM) interfaces, design for test (DFT), and configuration logic. Drive timing closure at block, sub

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, subsystem, and full‑chip levels while partnering closely with register‑transfer level (RTL) d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Signal Integrity (SI) Research & Development team enables the electrical performance of Micron's industry-leading memory and storage products, including DRAM, LPDRAM, NAND, HBM, SSDs, and emerging memory technologies. The team works across silicon, package, PCB, and system-level designs to develop high-speed signaling and power delivery solutions that support next-generation computing, AI, networking, automotive, mobile, and data center applications. As a Signal Integrity Engineer, you will support the design, analysis, and validation of high-speed memory interfaces and power distribution networks across Micron's product portfolio. Working alongside experienced engineers, you will use modeling, simulation, measurements, and AI-enabled workflows to evaluate signal and power integrity performance, support product development, and contribute to future technology and industry standards initiatives. Responsibilities Support signal integrity and power integrity analysis for high-speed memory interfaces and power distribution networks through modeling, simulation, measurement, and correlation activities. Collaborate with silicon, package, product, validation, and system engineering teams to ensure product electrical performance across all stages of development. Develop and evaluate die, package, PCB, and system-level models to identify performance risks and optimization opportunities. Apply AI-enabled tools and agentic workflows to improve engineering efficiency, automate analysis, improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Static Timing Analysis (STA) Engineer — you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, DFT, verification, and product teams to ensure timing integrity and drive timing closure across all modes and corners from initial design through tape-out. This is a hands-on senior technical role focused on chip-level STA ownership, constraint authoring, timing closure, methodology development, and pre-/post-silicon timing correlation. Key Responsibilities Responsibilities will include, but are not limited to: Own end-to-end chip-level static timing analysis and sign-off across all checks, modes, corners, and voltage and temperature conditions. Develop, maintain, and validate sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, high-bandwidth memory (HBM) interfaces, design for test (DFT), and configuration logic.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design and conduct laboratory experiments for SI and PI characterization of Micron components (wafer-, package-, and board-level), providing feedback and guidance to simulation and design teams Provide EMI/EMC measurements, analysis, and mitigation guidance for Micron products and customer systems Improvement and development of internal measurement platforms and methodologies Communicate technical insights to application engineers, designers, other team members, and Micron customers Provide guidance on EMC procedures, techniques, and analysis to Micron Global Quality team members performing compliance measurements Use circuit and electromagnetic simulation tools for analysis and post processing Minimum Qualifications: · BS in EE or similar field with at least 3 years of relevant experience · Strong background in one or more areas of signal integrity, power integrity, EMI/EMC, RF engineering, antenna design, or other fields within applied electromagnetics · Experience with measurements utilizing spectrum analyzers, network analyzers, Time Domain Reflectometer (TDR), near field probes, RF wafer probes, TEM/GTEM cells, and anechoic chambers Preferred Qualifications: · Experience with programming (e.g. Python, Matlab) and scripting lan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Broad knowledge and experience in: Expertise in the field of Data Engineering, Business Intelligence, and Advanced Analytics. Supporting, and maintaining ETL/ELT processes using SSIS, Snowflake, and cloud-native data integration technologies. Proficient in writing advanced SQL queries in both SQLServer and Snowflake. Proficient in debugging ETL packages. Good knowledge of databases, data warehousing, dimensional data modeling, and data governance practices. Familiarity with cloud-based systems for data engineering, especially Google Cloud Platform (GCP) and BigQuery. Experience with workload automation, job scheduling, and monitoring tools such as Active Batch & RMJ. Supporting Business enterprise data pipelines and ensuring data availability, reliability, and performance. Experience in production support, handling incidents, identifying root causes, and resolving problems. Knowledge of building APIs and integrating data across multiple applications and platforms. Experience with Agile development methodologies and DevOps practices. Resolving transformation requirements and developing processes to bring structured and unstructured data from source systems into target data models. Working with Data Engineers, Data Scientists, and Business teams to support data quality, data preparation, and analytical workloads. <li

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Propulsion Engineer to support the calibration and testing of advanced small engine systems for the next generation of airborne defense platforms. As a Propulsion Test Engineer, you will play a pivotal role in ensuring the performance, reliability, and manufacturability of our propulsion systems, helping to maintain the United States’ strategic edge in modern warfare. Your expertise will drive the development and validation of high-performance engines that power autonomous defense platforms. Mach Propulsion is redefining the small turbine engine—designing for high-rate production, scalability, modularity, and adaptability to help the United States maintain its edge in a rapidly evolving defense landscape. This is a chance to shape a new kind of propulsion company, one built around modern, automated manufacturing to deliver capable engines at meaningful volumes. In this role, you will collaborate with a multidisciplinary engineering team to create high-performance, manufacturable systems that meet demanding mission requirements. Key Responsibilities Create test systems and infrastructure including test cells and instrumentation packages. Develop control systems for test cells maintaining high accuracy and quality of d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Global Facilities team composes, constructs, and sustains world-class semiconductor manufacturing environments. We provide innovative, safe, and balanced infrastructure solutions that support Micron’s advanced technology roadmap and global operations. As a Design Manager in Global Facilities Construction at Micron, you will be at the forefront of crafting groundbreaking solutions for our innovative manufacturing projects. This role offers an outstanding opportunity to build and empower a team of highly skilled engineering specialists, ensuring flawless execution and outstanding results! Responsibilities Lead Build Development for major manufacturing and cleanroom projects across U.S. sites, ensuring alignment with operational goals and technical requirements. Assemble and guide multidisciplinary teams, including engineering subject matter experts, to initiate and carry out new projects. Act as Owner’s Build Representative during design development and construction phases, resolving technical issues and ensuring design intent is maintained. Develop and validate build criteria, scope justification, and concept packages across MEP (Mechanical, Electrical, Process) and CSA (Civil, Structural, Architectural) fields. Ensure compliance with safety codes, building regulations, and internal standards through rigorous build review and change control processes. Review and evaluate design-related bids, contracts, and cost estimates, and inspect con

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking an experienced Optical Interconnect Design Architect to define and drive next-generation optical connectivity solutions enabling future memory, AI accelerator, and high-performance computing platforms. This role will lead architecture development, technology pathfinding, feasibility analysis, and ecosystem engagement required to enable scalable optical interconnect solutions. The successful candidate will evaluate emerging photonic technologies, develop optical I/O architectures, guide proof-of-concept implementations, and collaborate with internal and external partners to identify solutions that meet future bandwidth, energy efficiency, thermal, reliability, and manufacturability requirements. The architect will influence Micron's long-term optical interconnect roadmap spanning photonic interposers, silicon photonics, optical memory interfaces, co-packaged optics, optical networking, and advanced heterogeneous integration technologies. Responsibilities will include, but are not limited to: Drive architecture explor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Engineer at Micron Technology, Inc., your primary responsibility will be establishing quality criteria and monitoring quality indices based on FE and BE signals from NPI to high-volume manufacturing (HVM). You will define, lead and drive key action to bring Micron product quality to be the best in class and to prevent quality and reliability related issues from repeat occurrence. Meanwhile, you will involve in developing and supporting qualification stress flows and characterization for HBM and other high performance memory solutions. You will be driving the following: Collaborate with collaborators to define, deploy and monitor outgoing quality and reliability (OQR) metrics based on FE and BE production signals as well as reliability test results Partner with package development engineer and product engineer on latest products and technologies to define quality and reliability fail modes Proactively work to evaluate, characterize, and mitigate Quality and Reliability risks and fail modes for BE new products and HVM Collaborate with MFG Quality Assurance and Quality Engineer teams to improve QR fail mode list for HVM products. Engage with key teams to set and validate OQR specifications and address recognized and potential Quality and Reliability issues Dispo deviation material based on production signals and reliability test results with quick turnaround ti

Employee Applicant Privacy Notice Who we are: Shape a brighter financial future with us. Together with our members, we’re changing the way people think about and interact with personal finance. We’re a next-generation financial services company and national bank using innovative, mobile-first technology to help our millions of members reach their goals. The industry is going through an unprecedented transformation, and we’re at the forefront. We’re proud to come to work every day knowing that what we do has a direct impact on people’s lives, with our core values guiding us every step of the way. Join us to invest in yourself, your career, and the financial world. SoFi Bank N.A. seeks Staff Data Scientist in San Francisco, CA: Job Duties: Identify opportunities and collaborate cross functionally to develop, implement, and continuously improve machine learning models and strategies that support credit underwriting. Identify opportunities to apply AI and advanced machine learning approaches to solve complex business problems. Evaluate alternative data sources and external vendor solutions by defining and driving proof of concept projects to demonstrate the solutions business values. Explore and leverage inhouse, external, and other opensource machine learning software/algorithms. Contribute in enhancing SoFi’s risk model development code base by developing customized Python scripts or packages. Collaborate with Model Risk Management team and Fair Lending team to demonstrate models are developed with high level rigor that satisfy Model Risk Management requirements, Fair Lending requirements, and other regulatory requirements. Spearhead model deployment by collaborating with cross functional teams including Credit, Product, Engineering, and Business Unit. Present model performance and insights to Credit, Risk, and Business Unit leaders. Full-time telecommuting is an option. Requirements: Master’s degree in Statistics, Data Science, or a related quantitative discipl