Advanced Package Technology Development Iot Mts Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Chemical and Slurry Systems Engineer within Micron’s Global Facilities and Construction Team, you will deliver engineering expertise supporting the planning, design, construction, operation, and maintenance of facilities systems across Micron’s global manufacturing network. You will participate in capacity and scenario planning, evaluate impact to facilities infrastructure, and serve as a technical domain expert throughout all project phases. Your work ensures environmental, safety, regulatory, and code compliance while driving system reliability and operational excellence. Responsibilities Develop safe, reliable designs for Chemical and Slurry systems and ensure compatibility of materials of construction with all chemicals used. Create, review, and maintain corporate equipment specifications, engineering standards, and design guidelines. Advise sites on system capacity, load projections, and scenario‑driven impacts. Provide technical feedback on infrastructure additions or modifications to support manufacturing and technology roadmap changes. Supply Micron standards to design partners and conduct timely reviews of design packages, construction documents, and engineering work. Support project cost and schedule development and validate scope alignment with collaborator requirements. Coordinate with Facilities, Design, Construction, Procurement, and Manufacturing to ensure clear communication and project alignment. Provide technical guidance during construction,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Global Quality (GQ) Package Reliability Process Engineer, your responsibility will be to establish new product package reliability requirements and process standardization. This includes ensuring board level reliability that emulates customer PCB design. As a process engineer, you will be responsible for ensuring process control during package reliability and establishing procedures for the operation team's execution. You will also be required to identify process improvements to ensure cost and productivity gains. You will need to coordinate with various functional parties to ensure that the reliability process complies with industrial standards such as JEDEC and not just Micron specifications. Additionally, you will be required to respond to inquiries from internal and external customers as a subject matter expert for package reliability activities.board-levelindustry standards, Responsibilities and Tasks Package Reliability Process Development To work with engineering team for enablement of new product (NPI) Ensure hardware readiness for package reliability process like Temperature Cycling, HAST, HTS and etc. Modify and improve reliability process for existing products Evaluate and Improve Processes, Materials, and/or Equipment Identify, investigate, and document process deviations. Troubleshoot process deviations using systematic troubleshooting techniques. Perform risk assessment at all deci

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Compute and Memory Business Unit (CMBU), driving the innovation behind Micron's next generation DRAM solutions for AI, data center, and client computing platforms. Our team collaborates across product architecture, design, validation, and system engineering to solve complex challenges in bandwidth, power, reliability, and scalability. Together, we help shape the future of memory technology for the world's most demanding compute environments. As a Product Architecture Engineer focused on Signal Integrity (SI) and Power Integrity (PI), you will define the electrical architecture that enables next-generation DRAM products. This highly visible role combines deep technical expertise with system-level thinking to influence product roadmaps, guide design decisions, and partner with industry-leading ecosystem stakeholders. Your work will help deliver memory solutions that power tomorrow's AI and high-performance computing platforms. Responsibilities: Lead SI/PI architecture pathfinding for next-generation DRAM products across AI, data center, and client platforms Define channel, package, board, and module-level SI/PI requirements and design targets for product development Evaluate DDR and LPDDR electrical performance, including timing, jitter, signal margin, crosstalk, impedance, reflections, and power delivery behavior Develop and apply modeling, simulation, and correlation methodologies using industry-standard EDA tools and validation data Partner across design, validation, package,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design and plan systems and buildings. Provide system designs that ensure safe operations and maintenance. Develop, review, and maintain equipment and component specifications and corporate standards. Ensure material compatibility. Ensure all designs comply with applicable standards, codes, and regulations. Review capacity planning databases (Base Build capacities, POC assignments, and actual field conditions) to support current operations and future projects. Lead periodic system status presentations (system capacity, actual and projected loads, key accomplishments, and issues). Evaluate system and distribution capacity impacts based on requested scenario changes. Lead scope development for facilities infrastructure additions or modifications. Provide project support. Provide Micron specifications and standards to Design Firms and review detailed designs and specifications for new facilities infrastructure installations. Support cost and schedule estimates and provide justification for approval. Supervise and coordinate consultant resources as required. Communicate with Operations, Design, Construction, Procurement, and Manufacturing stakeholders to meet project objectives and deliverables. Review design packages and provide documented comments and feedback. Work with appropriate personnel to resolve issues or implement corrections. Ensure project scope meets requestor needs. Ensure change management procedures are followed. Monitor progress and provide engineering and design support during construction as required. Employer will accept a Master’

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve equipment condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify equipment management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leverage AI-enabled tools and data-driven insights to improve operational efficiency, accelerate problem-solving, and support continuous improvement initiatives. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​ • Preferred to have over 3-year of working experiences in production line.​ • Must have process maintain experience.​ • Bachelor degree or

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: ​ Accountable and sustain for Bond process. ​ Backup for Debond area process basic maintenance. ​ Establish and improve process condition and technology. ​ Upgrade tool capability and improve product quality. ​ Establish and modify process management projects. ​ Set up process parameters for a variety of semiconductor equipment. ​ Evaluation, promotion and planning of new equipment / materials. ​ Abnormal analysis and improvement. ​ Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement: ​ • Preferred to have over 3-year of working experiences in production line. ​ •

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. As a Senior Chiplet Physical Design Engineer at Tenstorrent, you will work on a high-profile, cutting-edge program designing and integrating multiple chiplets into a System-in-Package (SiP). You’ll collaborate closely with Tenstorrent experts and leaders across the USA, Japan, and other global sites, as well as external partners, to deliver world-class CPU and AI silicon. In this role, you will own critical aspects of synthesis and place-and-route for high-speed CPU core designs, contributing directly to performance, power, and area outcomes on advanced process nodes. This role is remote, based out of The United States. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An experienced physical design engineer with at least 10 years of relevant experience, who thrives in complex, multi-stakeholder projects. Detail-driven, with a strong sense of ownership from synthesis through design closure. Comfortable working at advanced nodes (3nm and below) and multi-GHz designs. A collaborative team player who enjoys mentoring others and influencing methodology. Clear communicator who can balance technical depth with schedule and resource constraints. &nbsp

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Job title Senior DFT Engineer Job description We are looking for a person ready to take up the challenge of working in a high-profile project where we design and integrate multiple chiplets into a System-in-package, in collaboration with external stakeholders. You will work with Tenstorrent worldwide experts and leaders in the USA, Japan and other countries, and help us make our IP even better. In this role, you will be responsible for DFT implementation using industry standard tools for high-speed CPU core design. Your responsibilities Integrate and verify test features in digital designs for effective manufacturing testing and silicon debug. Key responsibilities include: Building entire chip-level DFT strategies Inserting DFTs, including scan chains, memory BIST, and JTAG Collaborating with RTL, physical design, and verification teams for testability throughout the design flow Scripting and automating DFT flows using industry-standard EDA tools (e.g., Cadence, Synopsys, Siemens) Running and analyzing ATPG and fault coverage reports Supporting silicon bring-up and debug related to test features Knowledge of advanced silicon technologies and methodologies for test coverage optimization Experience with formal verification and signoff of inserted DFT logic Strong communication and collaboration skills for cross-functional teamwork Exp

About the job Own the manufacturing performance behind advanced AI compute systems in volume production. As, Senior Manufacturing Product Engineer you will connect product design, test, quality and supply chain with manufacturing execution. You will support volume production across PCB assembly with our build partners in Taiwan. Your work will improve yield, quality and manufacturability across complex products. You will link manufacturing process performance to the product metrics that matter most. You will manage partner engineering relationships, resolve manufacturing issues and drive continuous improvement. You will also shape DfM feedback, production data requirements and next generation manufacturing technologies. This role suits someone who combines practical manufacturing judgement with strong data thinking. You will work close to suppliers, product teams and the decisions that shape production outcomes. The team and culture You will join the Manufacturing and Technology Process team within Operations. The team works across Bristol, Cambridge and Taiwan, close to wafer foundry, package assembly and PCBA subcontractors. Work happens through direct ownership at partner sites and clear technical engagement with internal teams. You will move quickly on production issues, using data and engineering judgement to guide action. The team values people who speak up, take responsibility and build strong supplier relationships. Decisions are grounded in evidence, product impact and the need to keep manufacturing improving. What we're looking for · Strong fault diagnosis, problem solving and failure analysis skills, including ICT to SMT debug · Thorough understanding of automated SMT assembly processes and lean manufacturing methodologies · Working knowledge of L10 mechanical design and system build, ideally for HPC products · Experienced in statistical analysis tools (e.g JMP, SQL, Python) · Ability to connect silicon, package and PCB interactions into clear DfM

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: • Own and deliver critical HBM IO blocks and subsystems from architectural definition through circuit and RTL implementation, verification, tape-out, silicon bring-up, and post-silicon debug, including interfaces supporting future CPO systems. • Define HBM PHY, controller-to-PHY, die-to-die, clocking, training, calibration, power-management, error-handling, and test requirements for advanced heterogeneous systems. • Drive robust, high-performance builds by balancing bandwidth, latency, power, area, reliability, electrical signal quality, power stability, yield, and manufacturability trade-offs. • Lead architecture and design of analog, mixed-signal, and digital interface functions used in high-speed memory subsystems. • Partner with package, interposer, physical design, signal integrity, power integrity, and thermal teams to optimize interface implementation across 2.5D and 3D systems. • Lead root-cause analysis and resolution of complex pre-silicon and post-silicon issues across circuit design, RTL, architecture, process, package, interposer, and system interactions. • Serve as technical project lead for one or more advanced interface programs, coordinating execution across architecture, design, layout, verification, validation, packaging, test, and product engineering teams. • Define and communicate technical priorities, interface specifications, execution plans, risks, dependencies, and schedule impacts. • Work with internal teams, customers, IP pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further! This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end to end memory system architectures, to guide long term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron. Responsibilities: Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance. Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach Drive long‑term memory technology packaging strategy and influence industry standards Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Work on electrical and physical design of high-speed interfaces in packages. Work on electrical model extraction and validation of package interconnects with circuit design team and IP vendor to optimize silicon layout and package design. Electrical modeling, simulation and characterization of high-speed interfaces. Develop and execute test plans to validate package electrical models with measurements. Work with product engineering and system engineering for package correlation and validation in system environment. Driving innovation into the future Memory generations within a dynamic work environment. Translate engineering problems into scalable Artificial Intelligence and automation solutions Educational & Other Requirements: MTech in Electrical Engineering with strong emphasis in Electromagnetics, Microwave, Antenna Theory and RF Circuits. Required Familiarity with Ansys, Siemens or Cadence tools for frequency domain modeling, Frequency domain analysis and transient time domain analysis. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio