Advanced Package Technology Development Iot Mts Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design onl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Join us as a Staff Verification Architect and shape modular, scalable verification solutions for next-generation HBM DRAM products across multiple customer platforms! You will be part of a highly multi-functional team of technical domain experts. You will collaborate closely with Design Engineering, Product Engineering, Business Units, and external customer teams to ensure our future HBM roadmap is successful. You will apply your thorough understanding of testbench architecture, custom and SoC verification methodologies, and 2.5D & 3D package integration to analyze bottlenecks and propose innovative solutions targeting scalability, quality, and verification cycle time. Responsibilities: Deliver high-quality, on-time verification plans and architecture collateral across IP-level and SoC-level verification, and develop turnkey solutions for future designs based on look-ahead information from customers and the architecture team Drive co-verification through direct customer interactions, and mentor early-career engineers to strengthen team capability and tech

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 Tool Install Engineerは、Micron広島工場における半導体製造装置の新規導入、増設、移設、改造および撤去プロジェクトを担当します。設備オーナー、プロセスエンジニア、Facilities各部署、建設業者および装置メーカーと連携し、Tool InstallationおよびHookup工事を安全・高品質・納期遵守で実行します。 また、プロジェクトマネジメントを通じてScope、Budget、Scheduleを管理し、設備立上げまでの工程を主導します。さらに、データ分析やAI技術を活用して業務改善を推進するとともに、安全性、生産性およびコスト効率の向上に貢献します。 業務内容 ・半導体製造装置の新規導入・増設・移設・改造・撤去プロジェクトの実行 ・Tool Install Projectの計画立案および実行管理 ・Scope、Budget、Scheduleの管理 ・Tool Owner、Process Engineer、Facilities Engineer、Vendorとの調整 ・Tool Service Requirement（TSR）および設計資料のレビュー ・Hookup Drawing Packageの確認および工事内容の精査 ・Utility供給能力確認および設備改造計画の立案 ・Hookup工事、建設工事、設備搬入工程の管理 ・安全・品質・工程管理および施工検査の実施 ・Design Reviewおよびリスクアセスメントの実施 ・FMEA等を用いたリスク分析と予防策の立案 ・設備立上げ、Utility Release、Tool Qualification支援 ・トラブル発生時の原因分析および恒久対策の推進 ・工事コスト最適化および省エネルギー活動の推進 ・設備導入プロセスの標準化および継続的改善 ・Tableau、Power BI等を活用したデータ分析および可視化 ・AIおよびデジタルツールを活用した業務改善活動 ・関係者向け技術資料およびトレーニング資料の作成 ・グローバルチームとの連携および技術情報共有 必要な知識・能力・経験など Must（必須条件） ・ビジネスレベルの日本語能力 ・学士号（工学系歓迎）または同等の実務経験 ・半導体工場または製造業における設備導入・建設・Facilities関連業務経験 ・プロジェクトマネジメント経験 ・安全管理およびリスクアセスメントに関する知識 ・Tool InstallまたはHookup工事に関する知識 ・図面（P&ID、Layout、Utility Drawing等）の読解能力 ・複数プロジェクトを同時に管理できる能力 ・問題解決能力および関係者調整能力 ・Microsoft Office（Excel、Power

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 Tool Install Engineerは、Micron広島工場における半導体製造装置の新規導入、増設、移設、改造および撤去プロジェクトを担当します。設備オーナー、プロセスエンジニア、Facilities各部署、建設業者および装置メーカーと連携し、Tool InstallationおよびHookup工事を安全・高品質・納期遵守で実行します。 また、プロジェクトマネジメントを通じてScope、Budget、Scheduleを管理し、設備立上げまでの工程を主導します。さらに、データ分析やAI技術を活用して業務改善を推進するとともに、安全性、生産性およびコスト効率の向上に貢献します。 業務内容 ・半導体製造装置の新規導入・増設・移設・改造・撤去プロジェクトの実行 ・Tool Install Projectの計画立案および実行管理 ・Scope、Budget、Scheduleの管理 ・Tool Owner、Process Engineer、Facilities Engineer、Vendorとの調整 ・Tool Service Requirement（TSR）および設計資料のレビュー ・Hookup Drawing Packageの確認および工事内容の精査 ・Utility供給能力確認および設備改造計画の立案 ・Hookup工事、建設工事、設備搬入工程の管理 ・安全・品質・工程管理および施工検査の実施 ・Design Reviewおよびリスクアセスメントの実施 ・FMEA等を用いたリスク分析と予防策の立案 ・設備立上げ、Utility Release、Tool Qualification支援 ・トラブル発生時の原因分析および恒久対策の推進 ・工事コスト最適化および省エネルギー活動の推進 ・設備導入プロセスの標準化および継続的改善 ・Tableau、Power BI等を活用したデータ分析および可視化 ・AIおよびデジタルツールを活用した業務改善活動 ・関係者向け技術資料およびトレーニング資料の作成 ・グローバルチームとの連携および技術情報共有 必要な知識・能力・経験など Must（必須条件） ・ビジネスレベルの日本語能力 ・学士号（工学系歓迎）または同等の実務経験 ・半導体工場または製造業における設備導入・建設・Facilities関連業務経験 ・プロジェクトマネジメント経験 ・安全管理およびリスクアセスメントに関する知識 ・Tool InstallまたはHookup工事に関する知識 ・図面（P&ID、Layout、Utility Drawing等）の読解能力 ・複数プロジェクトを同時に管理できる能力 ・問題解決能力および関係者調整能力 ・Microsoft Office（Excel、Power

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and cov

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Systems Ownership Scope As the designated System Owner, the engineer holds end-to-end technical accountability for the following mechanical utility systems across their full lifecycle — build, construction, commissioning, and operation: Chilled Water – Medium-Temperature (MTCHW): centrifugal / screw chillers, primary-secondary or variable-primary pumping, cooling towers, and distribution to HVAC and process loads. Chilled Water – Low-Temperature (LTCHW): low-temperature chiller plant serving process and dehumidification loads with tighter temperature control. Process Cooling Water (PCW): closed-loop tool-cooling system — vertical/inline pumps, plate heat exchangers, filtration, chemical dosing, and detailed temperature/flow regulation according to tool specifications. Ethylene Glycol (EG) / Low-Temperature Loop: sub-zero glycol refrigeration package(s), pumps, filtration, and distribution for process temperature control. Associated cooling towers, water-treatment / chemical-dosing systems, expansion tanks, instrumentation, and BMS integration. Shows readiness and capability to incorporate AI-powered tools into everyday engineering tasks. These include predictive maintenance, energy management, and data-driven optimization of mechanical utility systems. This supports Micron's AI transformation and smart manufacturing objectives. Construction Phase — Build, Delivery & Commissioning Review the basis for the buil

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 Tool Install Engineerは、Micron広島工場における半導体製造装置の新規導入、増設、移設、改造および撤去プロジェクトを担当します。設備オーナー、プロセスエンジニア、Facilities各部署、建設業者および装置メーカーと連携し、Tool InstallationおよびHookup工事を安全・高品質・納期遵守で実行します。 また、プロジェクトマネジメントを通じてScope、Budget、Scheduleを管理し、設備立上げまでの工程を主導します。さらに、データ分析やAI技術を活用して業務改善を推進するとともに、安全性、生産性およびコスト効率の向上に貢献します。 業務内容 ・半導体製造装置の新規導入・増設・移設・改造・撤去プロジェクトの実行 ・Tool Install Projectの計画立案および実行管理 ・Scope、Budget、Scheduleの管理 ・Tool Owner、Process Engineer、Facilities Engineer、Vendorとの調整 ・Tool Service Requirement（TSR）および設計資料のレビュー ・Hookup Drawing Packageの確認および工事内容の精査 ・Utility供給能力確認および設備改造計画の立案 ・Hookup工事、建設工事、設備搬入工程の管理 ・安全・品質・工程管理および施工検査の実施 ・Design Reviewおよびリスクアセスメントの実施 ・FMEA等を用いたリスク分析と予防策の立案 ・設備立上げ、Utility Release、Tool Qualification支援 ・トラブル発生時の原因分析および恒久対策の推進 ・工事コスト最適化および省エネルギー活動の推進 ・設備導入プロセスの標準化および継続的改善 ・Tableau、Power BI等を活用したデータ分析および可視化 ・AIおよびデジタルツールを活用した業務改善活動 ・関係者向け技術資料およびトレーニング資料の作成 ・グローバルチームとの連携および技術情報共有 必要な知識・能力・経験など Must（必須条件） ・ビジネスレベルの日本語能力 ・学士号（工学系歓迎）または同等の実務経験 ・半導体工場または製造業における設備導入・建設・Facilities関連業務経験 ・プロジェクトマネジメント経験 ・安全管理およびリスクアセスメントに関する知識 ・Tool InstallまたはHookup工事に関する知識 ・図面（P&ID、Layout、Utility Drawing等）の読解能力 ・複数プロジェクトを同時に管理できる能力 ・問題解決能力および関係者調整能力 ・Microsoft Office（Excel、Power

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Power Delivery Network (PDN) Engineer , you will be part of the Heterogeneous Integration Group (HIG), responsible for the design, analysis, and optimization of power delivery networks for next-generation HBM products. You will work closely with architecture, design, physical design, packaging, and product engineering teams to ensure robust, efficient, and manufacturable power delivery solutions that meet aggressive performance, power integrity, and reliability targets. This is a hands-on technical role focused on PDN design, EM/IR analysis, and cross-domain optimization across technology, design, and layout. Key Responsibilities Design and develop SoC-level and HBM-cube-level power delivery networks for HBM designs, including power grid architecture, routing strategies, and decoupling schemes. Perform EM/IR analysis and optimization using industry-standard tools (e.g., Cadence RedHawk, Ansys Totem) to ensure power integrity across dynamic workloads. Collaborate with physical design teams on floorplanning, placement, and routing strategies to enable efficient PDN implementation. Drive power integrity closure across multi-mode/multi-corner scenarios, identifying and mitigating droop, noise, and electromigration risks. Work with package and system teams to co-optimize die-package-system PDN interactions, including bump/pad assignment and current distribution. Develop and validate power models, including activity-based current profiles and transient analysis for realistic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Join us as a Senior Verification Engineer and contribute to modular, scalable verification solutions for next-generation HBM DRAM products! You will work independently within a multi-functional team of technical domain experts, spanning both IP-level and SoC-level verification. You will collaborate with Design Engineering, Product Engineering, and Business Units to complete the HBM verification roadmap. You will apply your solid understanding of testbench architecture, custom or SoC verification methodologies, and 2.5D & 3D package integration to evaluate issues, define solutions, and broaden your expertise. Responsibilities: Develop and implement verification plans and architecture collateral across IP-level and SoC-level verification for current and future HBM designs Support co-verification of the overall system and participate in customer interactions to gather feedback and provide recommendations for future HBM solutions Build and improve verification methodology components and GenAI applications aligned to HBM design cycles, broadening cross-disc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of memory systems. Our DRAM Architecture organization works at the intersection of silicon, packaging, systems, and customers to build technologies that power next-generation platforms. If you enjoy solving ambiguous problems that matter at industry scale, this is the place. This role is a senior technical leadership position with broad architectural ownership. You will develop complete DRAM system architectures, impact industry direction, and engage directly with customers and executives to convert complex ideas into scalable products. Responsibilities: Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry Lead cross-stack co-optimization spanning silicon, package, module, board, and system Architect sophisticated RAS and telemetry features and translate system needs into silicon Drive long-range memory technology strategy and influence industry standards Act as a senior technical liaison to customers, executives, and partners Minimum Qualifications: Bachelor’s degree or relevant equivalent experience in EE, CE, CS, or a related field Extensive hands-on experience in DRAM or memory systems architecture Deep understanding of DRAM timing, signaling, power, and reliability mechanisms Proven ability to translate system requirements into silicon architecture Preferred Qualifications: Master’s degree or PhD, or equivalent experience, in a related technical field Recognized techn

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization

Everpure (NYSE: P) has evolved from storage pioneer to data platform, closing fiscal 2026 with $3.7 billion in revenue, its first billion-dollar quarter, and accelerating growth into FY27. Our strategic agenda spans the companies defining the next era of technology - hyperscalers, AI labs, the AI hardware supply chain, data platform providers, and the broader AI ecosystem. This type of work—work that changes the world—is what the tech industry was founded on. So, if you're ready to seize the endless opportunities and leave your mark, come join us. As a Principal Services Solution Architect, you will spearhead the strategy and evolution of Advanced Services across our cloud-native and container domain, with focus on Portworx® by Everpure™, Kubernetes, and modern virtualization. You will act as the ultimate technical authority for this domain, bridging market gaps and converting emerging customer challenges into scalable, high-impact offerings. Partnering closely with Product, Engineering, Sales, and Delivery teams, your goal is to shape how enterprise clients modernize their infrastructure on the Everpure™ Platform. This role defines market-defining services, driving transformative architecture adoption at global scale. WHAT YOU’LL DO Drive Domain Strategy & Roadmap: Establish and own the global Advanced Services strategy for Kubernetes, cloud-native storage, modern virtualization, and Portworx® by Everpure™, aligning service innovations directly with enterprise product priorities and market expansion. Architect & Validate MVPs: Design, pilot, and validate groundbreaking solution services through strategic customer engagements, rapidly transforming complex customer challenges into market-tested consulting frameworks. Build Scalable Consulting Offerings: Mature successful customer pilots into standardized, repeatable Professional Services packages by defining service scopes, delivery methodologies, success criteria, and technical enablement assets. Provide Tec

A BOUT TIDE At Tide, we help SMEs save time and money in the running of their businesses by not only offering business accounts and related banking services, but also a comprehensive set of highly usable and connected administrative solutions, from invoicing to accounting. Tide is transforming the small business banking market and now supports over 2 million members globally across the UK, India, Germany and France. Using advanced technology, all solutions are designed with SMEs in mind. With quick onboarding, low fees and innovative features, we thrive on making data driven decisions to serve our mission: to help SMEs save time and money so they can get back to doing what they love. Tide facts: Tide is available for UK, Indian, German and French SMEs Over 2 million members globally and rapidly growing Over $300 million raised in funding 3,000 Tideans globally Recognised with Great Place to Work certification three years in a row, and among India’s Top 50 Best Workplaces in Banking, Financial Services, and Insurance in 2026 We have offices in Central London, with a member support and technology centre in Sofia, Bulgaria, technology centres in Serbia, Romania, Lithuania and Hyderabad and offices in Gurugram, New Delhi, Berlin, Paris and Luxembourg About the team The Admin Services commercial team are responsible for driving adoption and usage of essential products for Small Business Owners. This includes Tide’s range of accounting packages, as well as invoicing, expense management, payroll and Company Formations / Company Secretariat services. Most of these are sold on a subscription basis, providing consistent value to members and a consistent revenue stream to Tide. The team works closely with Product, Finance, Business Insights, CRM and Operations teams to translate member and commercial insights into appealing product enhancements, effective positioning, and strategies that enhance engagement and retention. About the role We’r