Advanced Packaging Technology Development Director Jobs

Job Responsibilities: Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based…

The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via)…

Front End Central Product Integration (FE cPIE) MTS (FE) at Micron in Taichung, Fab 16, Taiwan. Full-time · On-site.

The Frontend Central Product Integration Engineering (PIE) team drives leading-edge process capability, best-in-class yield (bits per wafer), high product quality, and rapid time to maturity through innovation and strong cross-functional collaboration. Supporting a global DRAM…

Job Responsibilities: Lead PI loop structural uniformity integration and cross loop integration projects for critical loops such as Capacitance loop to address yield and quality challenges, collaborating with cross module process/PI technical experts and suppliers to improve…

Job description We are seeking a Wafer Manufacturing Section Manager to lead high-volume semiconductor frontend production in a fast-paced, multinational environment. This role requires strong manufacturing execution, team leadership, and process understanding, with the ability…

Responsibilities and Tasks: Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Lead the PI Loop taskforce…

Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL,…

Responsibilities and Tasks: • Establish strategy, models and systems to improve wafer at risk reduction for RAM Defense line hardening. • Establish strategy, model and systems to improve RAM quality control and reduce defect OOC% variation. • Establish strategy, model and…

Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in…

Responsibilities and Tasks Join us at Micron and be a part of a team that is transforming how the world uses information to enrich life for all. As an IE Layout Senior Engineer, you will play a crucial role in our mission with responsibilities that build our world-class…

Project Title Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement Description Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection…

Staff Engineer - Design Verification at Micron in Hyderabad, Phoenix Aquila, India. Full-time · On-site.

FE CPIE PI MTS at Micron in Taichung - Fab 16, Taiwan. Full-time · On-site.

Equipment Engineer At Micron, we take pride in encouraging an environment where innovative minds can thrive. As an Equipment Engineer in our dynamic Taiwan team, you will play a pivotal role in driving the success of our world-class manufacturing operations. This is an…