Advanced Technology Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding Perform root‑cause and failure‑mode analysis a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an Engineering Project Management Engineer in Advanced Packaging Technology Development at Micron Technology, Inc., you will be responsible for leading and managing Micron’s Advanced Packaging Technology Development projects. Your role will focus on overseeing technology development operations across various TD and pre-NPI projects, ensuring that results are delivered on time and in line with APTD’s technology roadmap and commitments. This position requires a customer-obsessed leader who will play a key role in the planning and implementation of APTD builds. You will engage with internal customers and both internal and external stakeholders, working collaboratively to ensure successful and timely project handovers. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project/Program Management: Lead technology development programs and projects to deliver against defined go-to-market timelines. Align program- and project-level plans, dependencies, and deliverables to ensure timely, c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Introduction: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you eager to be a pioneer in AI and semiconductor breakthroughs? At Micron, we invite a passionate Staff Engineer, Collateral Integration Engineer to join our upbeat group. This opportunity offers the chance to work on innovative technology within a team-orie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Process Integration team plays a critical role in developing and manufacturing advanced DRAM technologies that power next-generation computing, data centers, mobile devices, and AI applications. Our team collaborates across Process Engineering, Device Engineering, Yield Engineering, and Technology Development to optimize semiconductor manufacturing processes, improve product performance, and accelerate the successful deployment of leading-edge memory solutions. Through data-driven decision making, innovation, and continuous improvement, we enable the development of technologies that support the future of artificial intelligence and advanced computing. Position Overview Micron is seeking a highly motivated Process Integration Engineer Intern for a 6-month internship supporting advanced DRAM technology development and manufacturing. This position provides hands-on experience in semiconductor process integration, electrical and inline data analysis, yield improvement, and cross-functional engineering collaboration. The intern will work closely with experienced engineers to analyze complex manufacturing data, identify process optimization opportunities, and support engineering solutions that enhance technology performance, manufacturing readiness, and AI-enabled innovation. Responsibilities Support the integration and optimization of semiconductor process modules across the DRAM manufacturing flow. Analyze electrical, inline, process, and yield data to identify performance gaps, yield detractors, and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology. The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners. Main Responsibilities Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets. Design and execute experiments, analyze data, and communicate results in appropriate technical forums. Perform film characterization using appropriate techniques (examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners. Main Responsibilities Develop, optimize , and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets. Design and execute experiments, analyze data, and communicate results in appropriate technical forums. Perform film characterization using appropriate techni

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. Role: The team member will typically work on processors, controller architectures or ASICs for Enterprise SSD Group. Should be proficient in block level low power aware floorplanning, placement, clock tree synthesis, routing, RC extraction, STA timing closure, IR/EM analysis, DRC/LVS/ERC and tape out activities. Requirements Minimum of 15 years of hands-on physical design implementation/IR/EM experience along with APR flow development and PPA analysis STA closure at block & Full Chip Experience in Advanced process technology nodes (5nm/3nm preferred) Experience with Ansys Redhawk-SC tool Experience with Cadence layout tools ( In

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented. Main Responsibilities: Conduct Electrical and PFA Characterization Perform electrical fault analysis to pin-point hot

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's leading-edge silicon manufacturing solutions. In this position, you will work on-site, in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated manufacturing processes and equipment. As an IMO Module Development Engineer, the responsibilities may include but not limited to: Process equipment installation and development. Equipment maintenance, management of troubleshooting activities, regular monitoring of process performance, defect analysis and reduction. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics. Working with cross functional teams to solve technical process and defect issues. Plans and conducts experiments to fully characterize the process throughout the development cycle. Establishes control systems to optimize and sustain production performance. D

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life. Join an inclusive team focused on one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solution we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while contributing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. Job Description: As a CAD Applications Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, improving EDA and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits. You will work closely with the Design and Layout teams to increase their productivity and work efficiency. Responsibilities and Tasks include, but not limited to: Develop place and route flows at advanced process technology nodes for DRAM designs. Implement advanced methodologies such as hierarchical flow, UPF, and process specific flow customizations to name a few Work with EDA vendors to deploy latest PnR tool or report/track tool issue to resolution. Customize EDA tools and create in house flows to improve the design team efficiency. Work closely with global design teams to support multiple aspects of PnR flow and associated methodolog

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global Defense Line (DL) matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment for DL signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Technology Development (TD) department at Micron Technology leads innovation. It drives the advancement of data retention and storage systems that change how the world uses information. The team develops next-generation semiconductor processes and technologies and works closely with global R&D and manufacturing teams to bring innovative solutions from concept to production. Join a collaborative environment where you will help shape the future of semiconductor technology while working alongside experienced engineers and technical leaders. Position Overview As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), your role includes developing advanced packaging approaches and linking technologies. You will contribute to their integration in future semiconductor products. Working in a highly collaborative R&D environment, you will support process development, technology evaluation, and qualification activities while gaining hands-on experience with modern semiconductor technologies. This role provides an excellent opportunity for engineers who are passionate about innovation, problem-solving, and continuous learning. Responsibilities Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products. Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance. Participate in e

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Position Summary As an IoT Engineer, Engineer based in Singapore, you will design, build, and deploy Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will implement hands-on engineering work from proof-of-concept through deployment and sustainment, contributing to scalable and secure solutions that improve quality, productivity, and early risk detection. You will collaborate cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while operating with a strong safety mentality and a bias for practical, reliable delivery. Key Responsibilities Develop and deploy IIoT solutions end-to-end: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Build machine vision solutions: support hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm development, performance validation, and deployment readiness. Work with process, equipment, automation, quality, and IT/data platfor