Advanced Technology Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify , diagnose, and propose y

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. By collaborating closely with our global R&D teams, materials suppliers, and manufacturing teams, we ensure the efficient development, transfer, and implementation of new technology nodes to maintain Micron's leadership in the industry. As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management. You will also be required to resolve assembly process-related problems by applying failure analysis, FMEA, 8D, or SPC/FDC methodology. Additional responsibilities include leading and participating in yield improvement and cost reduction activities and handling new process baseline qualifications. You may conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes. We are seeking experienced engineers for Principal and MTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications. Role Responsibilities: Identify, diagnose, and resolve assembly p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology - Advanced Modeling and AI Solutions (AMAIS) Group in Hyderabad, you will work in a multi-functional team of engineers highly skilled in the modeling of process, equipment, structures, and materials. This team’s primary responsibility is to support and enable solutions to Micron’s most significant challenges in Memory development and manufacturing. Your role will be to work on a project that directly supports one of our group’s critical programs. This project will involve materials or structure or process modeling. You will be responsible for developing and validating process/structure models using machine learning and statistical techniques, to build state-of-the-art products/solutions that helps in predictive analytics, prescriptive solutions, decision support, and decision automation data systems for our technology development and manufacturing teams. You are expected to work in a dynamic and fast-paced team environment developing models and reporting results to the AMAIS team and collaborating with them on next steps. This position seeks individuals that can code, implement, and utilize numerical models. Qualifications: Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Experience with computational materials science methodologies Familiarity with machine learning and deep learning concepts and applications</spa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking an engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description Key Responsibilities: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 2&#43; years of experience in semiconductor industry in areas such as Process Integration, Yield Enhancement, Product Engineering, Design, Test Structure Development

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related brea

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal/MTS Process Development Engineer with a focus on Vapor/Thermal etching, you will be part of a revolutionary Advanced DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration, equipment development engineers, hardware vendors and other process areas including Dry Etch, Metals, CVD, Diffusion, Lithography and CMP. You will work on state of the art and best in class tooling and own the process roadmap to meet program and yield goals! Responsibilities: Develop and integrate advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM technologies Lead feasibility studies, technical investigations, and root-cause analysis to resolve complex process challenges Drive process roadmaps, technical readiness, and yield improvements to meet program objectives Collaborate with Process Integration, equipment development, hardware vendors, and cross-functional engineering teams to deliver innovative solutio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology - Advanced Modeling and AI Solutions (AMAIS) Group in Hyderabad, you will work in a multi-functional team of engineers highly skilled in the modeling of process, equipment, structures, and materials. This team’s primary responsibility is to support and enable solutions to Micron’s most significant challenges in Memory development and manufacturing. Your role will be to work on a project that directly supports one of our group’s critical programs. This project will involve materials or structure or process modeling. You are expected to work in a dynamic and fast-paced team environment developing models and reporting results to the AMAIS team and collaborating with them on next steps. This position seeks individuals that can code, implement, and utilize numerical models. You will interact with process engineers and development teams to identify questions and issues hindering the node development milestones. Additionally, you will create software programs, algorithms, and computational modeling tools to extract concrete insights from modeling and data. You will interpret and convey these insights and findings from models and experiments to engineering teams and leaders. You will be responsible for predictive structure modeling across multiple DRAM and NAND nodes. The modeling engineer will collaborate extensively with product design and process teams for structure model development, deployment, and providing solutions to be implemented on Silicon. Qualifica

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description & Requirements Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology. Responsibilities Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. Integrate and solve processes as part of multi-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for th

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept throug

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Our Team as a STAFF ENGINEER, TDT PD CMP At Micron, we are driven by the pursuit of excellence and innovation. As a Chemical Mechanical Planarization (CMP) Process Development Engineer, you will play a key role on our Technology Development Taiwan (TDT) CMP team. You will contribute to the progress of our innovative DRAM technology. If you have a passion for semiconductor development and enjoy working in a dynamic and collaborative environment, we invite you to join us in defining the future of the semiconductor industry! Key Responsibilities Develop and refine CMP processes to support advanced DRAM technology acceleration. Collaborate with diverse teams to develop new outstanding semiconductor devices. Perform rigorous process characterization, develop new consumables, and evaluate new hardware. Conduct groundbreaking research and innovate to contribute to Micron’s extensive patent portfolio. Drive continuous process and efficiency improvements to meet yield, quality, and cycle time requirements. Direct and manage CMP consumables and equipment suppliers. Plan and complete well-designed experiments, presenting results in clear and concise reports. Minimum Qualifications Proficiency in both Chinese and English languages. Expertise in CMP process development. Hands-on experience with CMP polishing equipment, including familiarity with equipment operation, optical metrology, profilometry, common polishing

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. Drive continuous improvement initiatives to minimize defects and optimize process reliability. Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has been at the forefront of innovation, delivering the world’s most advanced memory and semiconductor technologies. Our distributed team of engineers, scientists, and visionaries is developing groundbreaking solutions that redefine how the world uses information to enrich life for all. We are seeking a Layout Design Engineering Led to join Micron's organization in Guadalajara, Mexico. In this leadership role, you will guide a distributed team focused on developing complex analog, mixed‑signal, and custom layouts powering next‑generation AI and high‑performance computing solutions. Responsibilities Lead a team designing and developing critical analog, mixed‑signal, and custom block layouts, including support for full‑chip-level integration. Oversee layout verification activities, including LVS, DRC, Antenna checks, documentation, and quality reviews. Ensure timely and high‑quality delivery of block‑level layouts that meet all project requirements. Coordinate planning, area/time estimation, scheduling, task delegation, and execution for multiple concurrent projects. Mentor and guide layout engineers of all levels. Perform detailed reviews of sub‑block‑level layouts. Collaborate with global engineering teams to drive successful project execution and alignment across Micron’s worldwide footprint. Minimum Qualificatio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department overview The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting‑edge memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Job summary As a Principal Engineer within APTD, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased revenue, long‑term strategic success, and the development of leading‑edge packaging technologies. Responsibilities Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure seamless technology integ