Analog Ams Verification Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products! We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions! In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will own physical implementation and top-level integration of large digital designs in our NAND products. Drive blocks and full-chip partitions through synthesis handoff, floorplan, place-and-route, and timing/DRC/LVS closure. Perform hierarchical design planning and top-level assembly. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Leading all aspects of and managing the layout process including floor-planning, placement, and routing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, the DRAM Design organization develops industry-leading memory solutions that span technology development, advanced circuit design, product engineering, system validation, and manufacturing enablement. Teams collaborate globally to deliver innovative memory products that meet demanding requirements for performance, quality, reliability, and time-to-market. As an Intern DRAM Design Engineer, you will contribute to the design, analysis, verification, and optimization of digital, analog, and mixed-signal circuits used in next-generation memory products. You will work closely with design, verification, product engineering, test, process integration, assembly, and marketing teams to support new product development and manufacturability initiatives. This role also provides opportunities to apply Artificial Intelligence and AI Assisted methodologies to improve design workflows, automation, and design quality. Responsibilities Play a key role in the development of new memory products through circuit build, layout, optimization, and validation of Memory, Logic, and Analog circuits. Support physical design activities including parasitic modeling, floor-planning, placement, routing, reticle experiments, tape-out revisions, and design verification using industry-standard simulation tools. Collaborate with global design, verification, product engineering, test, process integration, assembly, and marketing teams to improve manufacturability, quality, and product performance. Proactiv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

What We’re Looking For: We’re looking for physical design engineers to help manage and execute the physical design process for the various dies that comprise our A-0 and A-1 systems. This will involve deciding what to do in-house and outsource, and then managing the outsourced process and integrating it with the in-house flow and effort. Ideal Candidates: Ideal candidates will have: Hands-on experience with the physical design process for at least one block in multiple advanced node tapeouts Ability to understand what PPA limiters are from RTL and coordinate with microarchitects to change the RTL to improve/fix them Experience both with in-house and outsourced physical design flows Nice to Have: Experience with physical design process for multi-die/multi-chiplet/MCM designs Experience with physical design process for reticle-max or near reticle max designs Experience with very high power density chips Experience with the physical design process for AI chips Experience with the physical design process of analog and mixed signal blocks and macros

About Anthropic Anthropic’s mission is to create reliable, interpretable, and steerable AI systems. We want AI to be safe and beneficial for our users and for society as a whole. Our team is a quickly growing group of committed researchers, engineers, policy experts, and business leaders working together to build beneficial AI systems. About the role Anthropic runs some of the largest AI training and inference workloads in the world, across multiple hardware platforms. We work from the chip level up with our silicon partners, and we are now deepening that investment by building a custom silicon team. You will be one of a small number of people covering a large surface. We are opening searches across the key domains below, and we are interested in candidates whose center of gravity sits in any of them: Front-end design Pre-silicon verification Physical design Design for test Analog and mixed-signal Technology and foundry CAD and design infrastructure Packaging, signal integrity, and power integrity This is a role for someone who has shipped silicon, has a realistic relationship with schedules, and is comfortable making consequential calls without a large organization behind them. Key responsibilities Take part in end to end activities for the program: strategy, specification, execution and the technical bar. Write the specifications and interface definitions that others design against and keep them coherent as the architecture converges Make and own directional calls: technology and IP selection, where we build versus buy versus license, and where we take design authority versus rely on partners Build and share AI-assisted approaches to the code-like parts of your domain, and help the team learn what Claude can genuinely accelerate Contribute to the architecture and micro-architecture discussion from your domain's perspective, including the tradeoffs your area imposes on the rest of the chip Partner with Anthropic's inference, performance, kernels, and infrastr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are passionate about advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing groundbreaking solutions that shape the future of memory products in a dynamic, learning-focused environment. As a Design Engineer, you will play a key role in developing next-generation memory technologies by designing, analyzing, and optimizing digital and analog circuits. You will collaborate with global cross-functional teams throughout the product lifecycle, helping deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Responsibilities: Contribute to the design, layout, verification, and optimization of memory, logic, and analog circuits for new product development Perform parasitic modeling and support design validation, reticle experiments, and tape-out revisions Lead layout activities including floor planning, placement, and routing Partner with Product Engineering, Test, Probe, Assembly, Process Integration, and Marketing teams to ensure manufacturable product designs Collaborate with CAD, modeling, standards, and verification teams to improve design quality and execution Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering Minimum 4 years o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities Lead and develop a Custom layout team for Micron’s global NAND layout needs. Lead the development of analog and custom layout to achieve project schedules and achievements. Offer leadership in developing the team's technical capabilities and fostering a positive, inclusive culture. Successfully collaborating with engineering teams across India, US, Japan, and Italy to ensure the layout project’s completion. Coordinate and prioritize logistics and resources across multiple projects. Coordinate with TD, Design, CAD, and layout teams to ensure timely, quality delivery. Drive innovation for future memory generations in a dynamic work environment. Lead all aspects of team performance and growth. Hiring and retention management. As part of Micron's core NAND leadership in India, help drive the success of NAND operations. Proficiency in Cadence VLE/VXL and Calibre DRC/LVS is required. Demonstrates strong motivation and enthusiasm, maintains attention to detail, and applies a systematic and methodical approach in IC layout design & planning. Prior experience with NAND or any other non-volatile memory is preferred, though it is not mandatory. Proven ability to leverage AI‑assisted (vibe) coding techniques to improve efficiency or automate design and analysis methodologies Leverage AI tools to automate the tools and workflow Applying Artificial Intellige

What you’ll do Act as the in-house electrical lead for Midjourney Medical: own the electrical architecture of the scanner and the technical direction for all board-level design. Own complex board design end-to-end: architecture, schematic capture, layout (high-speed digital, analog/mixed-signal, power), DFM/DFT, fabrication and assembly vendor management, bring-up, and revision control. Write firmware for embedded targets (MCU/SoC): drivers, real-time control loops, safety-relevant logic, bootloaders, and field update paths. Audit and update HDL (FPGA) code for high-throughput data acquisition, timing/synchronization, triggering, and pre-processing of ultrasound and sensor data streams. Define electrical interfaces and data contracts with software, recon/ML and mechanical teams: timing budgets, clocking/sync, signal integrity, connectors/harnessing, and failure modes. Establish electrical engineering rigor: design reviews, schematic/layout review checklists, bring-up procedures, test fixtures, and documentation suitable for a regulated medical device program (DHF, traceability, change control). Mentor and grow the electrical function; select and manage external design partners where leverage is high. What we’re looking for Deep experience designing complex boards from blank page to stable revision, including high-speed digital and analog/mixed-signal domains. Strong schematic and layout skills (Altium/KiCad or equivalent) with real signal integrity, power integrity, grounding, and EMI/EMC instincts. Solid embedded firmware background in C/C++ (and Python for tooling): peripherals, DMA, interrupts, real-time constraints, and debugging on hardware. Practical HDL experience (VHDL/Verilog/SystemVerilog) for data acquisition, timing, and streaming interfaces. Track record of owning bring-up and debug on real hardware: scopes, logic analyzers, and disciplined root-cause analysis. Technical leadership: clear trade-offs, strong written documentation, and the ability to set

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff/Principal Design Engineer in the NVE Design Engineering organization at Micron Technology, Inc., you will drive the transformation of NAND circuit development through design automation, agentic circuit-design enablement, and environment transition! Implementing core Xpath, Ypath and Array design during project execution and work with project teams integrating the Core schematics into the full chip schematics, validating design performance and functionalities by running block and chip level simulations using standard industry simulators! Implementing analog and mixed signal circuit design (charge pumps, op amps, DACs, ADCs, linear regulators, oscillators, bandgap, LDO, thermometers, page buffers, PDNs, level shifters, IO buffers, RTL, Verilog) to meet specifications, validating design performance and functionalities by running block and chip level simulations using standard industry simulators Serve as a technical authority across analog/core teams , solving sophisticated technical problems at the intersection of circuit behavior, modeling, simulation methodology, and automation reliability Develop and productize agentic enablement for circuit design , including AI/LLM-assisted flows that support: environment setup and self-healing configuration, guided simulation and debug, intelligent corner planning and coverage closure, automated schematic/layout checks and review assistance, documentation synthesis and knowledge retrieval from internal sources,<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall design, layout, and optimization of DRAM Memory array/Peripheral Logic/Analog circuits Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate schematic optimization and design‑space exploration Assist in parasitic analysis, sensitivity studies, and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Oversee and manage the layout process including floor-planning, placement, and routing Perform circuit-level verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Drive innovation into the future memory generations and design methodology within a dynamic work environment Minimum Qualifications Master’s degree in electrical or computer engineering with 4-8 years of experience in memory design. Strong fundamentals in CMOS circuit design, device physics and memory operation. Experience with SPICE-based simulation and parasitic extraction. </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The qualifications and skills for this position include, but are not limited to: Bachelor’s or master’s degree in Electrical Engineering or Computer Engineering with 7&#43; years of proven experience in Test Engineering role. Excellent programming skills for writing and debugging ATE test programs and test-related hardware development. Proficiency with Advantest V93K ATE platforms and/or other logic device ATE testers is preferred. Proficiency in programming with C/C&#43;&#43; and/or JAVA is required. Solid understanding of testing for CMOS SoCs. Prefer candidates with exceptional digital, analog, and MXS test programming and debug experience. Familiar with testing IP blocks such as PLL, efuse, DDR. Expertise in test strategy development, test plan definition, DFT pattern implementation (ATPG SCAN, TDF, MemBIST and repair, BSACAN, JTAG/IEEE1500, and Functional Patterns). Expertise in ATE architecture and test hardware design and debugging, schematic capture, and PCB layout. ATE test vector conversion tools like VTRAN and proficiency in debugging issues during development or high volume production. Knowledge of semiconductor manufacturing process. Knowledge of accurate and effective use of lab test equipment (i.e., oscilloscope, logic analyzer, etc.). Experience with data analysis software in support of c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a build Engineer at Micron Technology, Inc., you will be responsible for crafting and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve design quality and manufacturability. You will coordinate with multi-functional partners to support tape‑out readiness and future technology scaling. This role offers hands‑on impact across the full semiconductor design flow. Responsibilities Contribute to new product opportunities by supporting overall circuit design, layout, and optimization for memory and logic or analog circuits. Perform parasitic modeling and support design validation, including reticle experim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. You will contribute to innovative silicon-to-systems solutions, spanning technology development, advanced memory design, product development, systems design, and validation. This role requires collaboration with global multi-functional teams including invent, verification, product engineering, test, probe, process integration, assembly, and marketing. You will provide high-quality, efficient, and reliable memory solutions that optimize time-to-market and promote strong customer happiness. Responsibilities Contribute to new product development by supporting circuit design, layout, and optimization across memory, logic, and analog domains Assist with parasitic modeling, design validation, reticle experiments, and tape-out revisions Oversee layout activities including floor-planning, placement, and routing Perform circuit verification using modeling and simulation tools with industry-standard simulators Collaborate multi-functionally to support manufacturability, standardization, and overall product success Minimum Qualifications Bachelor’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or a related field Familiarity with digital and/or analog circuit design concepts Experience with circuit simulation and modeling tools Understanding of semic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior/Staff Engineer, NAND Product Development in Non-Volatile Engineering (NVE) group at Micron Technology, Inc., you will be responsible for test flow development and testing strategies with emphasis on Test Chips for Micron’s pioneering 3D NAND memory. You will be collaborating with multiple teams like Test Solutions Engineering on test code development, Design Engineering on testmode implementation, and validating and debugging testmodes and test results via simulation and post silicon validation of the tests. Provide critical test solutions that will be used to screen the quality and reliability failures on Micron’s NAND products. Responsibilities: NAND Testchip test flow development and validation Run pre si Verilog (Digital) and Analog design simulations to verify testmodes. Define and improve post si testing methods to address new experimental designs, process or debug issues on devices manufactured at Micron’s R&D and Fab10 Manufacturing facilities Perform device characterization and electrical failure analysis (EFA) Collaborate with Test Solutions Engineering on test code development. Collaborate with Design Engineering on testmode implementation, pre si verification and post si validation of testmodes. Collaborate with Process Integration, yield engineering to improve overall die yield and meet the critical turning points planned for the Testchip. Leverage AI tools to automate the tools and workflow</

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s DPG-IPDEV Team in Bangalore, India. DPG-IPDEV team is responsible for developing world-class analog and mixed signal IPs used in every cutting edge DRAM chip produced in Micron . As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high-performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. • Responsible for timely delivery of block-level layouts with acceptable quality. • Demonstrate leadership qualities in planning, area/time estimation, scheduling, and execution to meet project sche