Aptd Manufacturing Development Engineering Senior Manager Jobs

Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.

Director – Package Materials Integration, APTD — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies. Responsibilities and Tasks Lab Management, Compliance & Audits Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards. Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency. Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime. Evaluate and introduce new FA tool models and capabilities in partnershi

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Engineer, APTD CEM - Advanced Packaging Equipment Engineering — Fab 10A, Singapore. Apply via Workday.

Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.

Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Staff Engineer, APTD Photolithography — Boise, ID - Main Site. Apply via Workday.

Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer — Fab 10A, Singapore. Apply via Workday.

STAFF ENGINEER, APTD MRDA — Taichung - Fab 16, Taiwan. Apply via Workday.

ENGINEER, APTD Wafer Thinning / CMP process — Taichung - Fab 16, Taiwan. Apply via Workday.