Aptd Manufacturing Development Engineering Senior Manager Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Technology Development (TD) department at Micron Technology leads innovation. It drives the advancement of data retention and storage systems that change how the world uses information. The team develops next-generation semiconductor processes and technologies and works closely with global R&D and manufacturing teams to bring innovative solutions from concept to production. Join a collaborative environment where you will help shape the future of semiconductor technology while working alongside experienced engineers and technical leaders. Position Overview As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), your role includes developing advanced packaging approaches and linking technologies. You will contribute to their integration in future semiconductor products. Working in a highly collaborative R&D environment, you will support process development, technology evaluation, and qualification activities while gaining hands-on experience with modern semiconductor technologies. This role provides an excellent opportunity for engineers who are passionate about innovation, problem-solving, and continuous learning. Responsibilities Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products. Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance. Participate in e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. Drive continuous improvement initiatives to minimize defects and optimize process reliability. Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept throug

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and AI-enabled technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is molding the future of technology! Position Overview: As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing.</

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping, micro‑cracks, subsurface damage,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Responsibilities: Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods Identify, diagnose, and resolve assembly process related problems Coordinate and complete process, equipment, and material evaluati