Assembly Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

The mission of The New York Times is to seek the truth and help people understand the world. That means independent journalism is at the heart of all we do as a company. It’s why we have a world-renowned newsroom that sends journalists to report on the ground from nearly 160 countries. It’s why we focus deeply on how our readers will experience our journalism, from print to audio to a world-class digital and app destination. And it’s why our business strategy centers on making journalism so good that it’s worth paying for. Job Description The New York Times Advertising is hiring for an Art Director to join our T Brand Studio. As an Art Director, you will lead the visual execution of assigned projects. Art Directors do the following: they imagine ways to tell stories visually. They present visual ideas and recommendations internally and to our clients. They find visual reference, specifically relevant to each idea, project, and opportunity. They contribute to and oversee the creation of great mood boards, inspired type treatments, exceptional color palettes, and page layouts. About the Role You will oversee the design of presentations which enhance our work, the assembly of excellent paid posts in webflow, the design of impactful print ads, and work with developers internal and external on complex custom projects. You will mentor Designers and Senior Designers, and collaborate with external partners, building relationships and guiding them through insightful feedback to create their best work. This is a hybrid role, reporting to the Director, Design. You can typically expect to be in the office 3 days per week. Responsibilities: Contribute to and oversee excellent design work on client and internal projects, with guidance from Design Directors, and Creative Directors. Translate conceptual and strategic ideas into impactful visual solutions. Contribute creative concepts to client and internal projects, brainstorming with other teams. Design iteratively with an e

About Clutch: We’re on a mission to reinvent the way people buy, sell, and own cars. Are you game? Clutch is Canada’s largest online used car retailer, delivering a seamless, hassle-free car buying and selling experience to drivers everywhere. Customers can browse hundreds of cars from the comfort of their home, get the right one delivered to their door, and enjoy peace of mind with our 10-Day Money-Back Guarantee… and that’s just the beginning. Named multiple years in a row to the Globe & Mail’s list of the Top Growing Companies in Canada and awarded spots on Deloitte’s Technology Fast 50™ and Fast 500™ lists, we’re looking to add curious, hard-working, and driven individuals to our growing team. Headquartered in Toronto, Clutch was founded in 2017 and currently services Ontario, New Brunswick, Nova Scotia, and Prince Edward Island. Clutch is backed by a number of world-class investors, including D1 Capital, Canaan, Real Ventures, BrandProject, and Upper90. To learn more, visit clutch.ca. About the role: We are seeking a detail-oriented and organized entry-level Last Mile Associate at Clutch to oversee the final stage of our vehicle production process. In this role, you will be responsible for managing the movement of completed vehicles from the assembly line to staging areas, ensuring they are properly prepared for delivery to our clients. What you’ll do: Coordinate the movement of vehicles within the production facility, ensuring efficient flow from assembly to staging area Oversee final inspections and ensure vehicles are properly prepped for shipment, including any necessary adjustments or cleaning Complete any final detailing missed before sending vehicles to clients Collaborate with production and shipping teams to meet delivery schedules and customer deadlines What we’re looking for: Strong organizational skills and attention to detail Experience in vehicle detailing, inspection, quality control, or automotive production is a plus Ability to work efficie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As MSH PDE Yield Enhancement (YE) Lead Engineer within Package Development Engineering (PDE), you will lead a team of YE Engineers responsible for yield performance, excursion management, and yield stabilization across High Bandwidth Memory (HBM) New Product Introduction (NPI) . This role is accountable for ensuring predictable yield ramps , fast learning closure , and robust manufacturing readiness for advanced HBM technologies. You will provide people leadership, technical direction, and execution governance , partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing, Quality, and Program Leadership to protect schedule, yield, and customer commitments. Job Responsibilities People & Team Leadership Build, lead, and develop a high‑performing MSH PDE YE team Set clear expectations on yield ownership, execution discipline, and escalation behavior Coach engineers on technical rigor, structured problem solving, and stakeholder communication Drive individual development plans, succession planning, and technical depth within the YE team Ensure sustainable on‑call / coverage models for critical NPI and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are passionate about advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing groundbreaking solutions that shape the future of memory products in a dynamic, learning-focused environment. As a Design Engineer, you will play a key role in developing next-generation memory technologies by designing, analyzing, and optimizing digital and analog circuits. You will collaborate with global cross-functional teams throughout the product lifecycle, helping deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Responsibilities: Contribute to the design, layout, verification, and optimization of memory, logic, and analog circuits for new product development Perform parasitic modeling and support design validation, reticle experiments, and tape-out revisions Lead layout activities including floor planning, placement, and routing Partner with Product Engineering, Test, Probe, Assembly, Process Integration, and Marketing teams to ensure manufacturable product designs Collaborate with CAD, modeling, standards, and verification teams to improve design quality and execution Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering Minimum 4 years o

About Sentry Software runs the world and the pace is faster than ever. Sentry helps developers fix errors and performance issues before users notice, so teams can spend less time firefighting and more time building. Trusted by 200,000+ organizations, Sentry is today’s application monitoring standard and our team is building its AI-native future. About the role Sentry provides developer-first observability to over 4 million developers worldwide. The Events Analytics Platform (EAP) team is at the heart of that mission: it powers how all of Sentry's event data, such as errors, transactions, spans, profiles, replays, and metrics, is stored, queried, and analyzed. It also powers Sentry's latest AI push, Seer. The EAP team makes it possible for developers to efficiently search and debug across massive volumes of data, providing the context needed to understand and fix issues quickly. This team is also a cornerstone of Sentry's long-term strategy to become a context assembly and telemetry platform that unifies different signals so developers can see the complete picture. As an engineering manager on the EAP team, you will lead a group of engineers building and scaling one of Sentry's most critical data platforms. You will be responsible for driving architectural evolution, ensuring system stability, and mentoring a talented team. This is a highly visible leadership role with direct ties to Sentry's long-term product and platform strategy. What you'll do Grow and develop a team of engineers with high expectations for ownership and impact Set the technical and strategic direction for the team, balancing short-term stability with long-term architectural evolution Drive development of core EAP features, including support for complex analytical queries, dynamic routing logic across fidelity levels, storage and compute separation, and modern patterns for analytical storage Ensure EAP can support the workload demands of AI agents and MCP servers that unlock new AI capabilities fo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Also, strong AI proficiency, a solid understanding of agentic AI models, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Strong AI proficiency, a solid understanding of agentic AI model

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Strong AI proficiency, a solid understanding of agentic AI model

We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities Own end-to-end bump interconnect development for both ubump (micro-bump) and C4 processes, including bump formation, and reflow for use with mass reflow, TCB, and LAB chip attach for high-performance semiconductor packages. Define and own bump metallurgy stacks for ubump (e.g., Cu pillar/SnAg) and C4 (e.g., SAC alloys) interconnects, including UBM selection and pad finish specifications for both chip-side and interposer capture pads. Develop and own design rules for bump interconnects including pitch, bump diameter, standoff height, keep-outs, and land pad geometry for both the chip side and interposer or substrate capture pads. Lead RDL (redistribution layer) process development including electroplating of Cu RDL traces, via fills, and pad finishes; define RDL design rules for line/space, via diameter, and layer stack-up to meet electrical and reliability requirements. Collaborate with OSATs and bumping foundries to qualify ubump and C4 bumping processes, drive design rule alignment, and manage process transfers into production. Evaluate and mitigate bump interconnect assembly risks including non-wet opens, voiding, head- in-pillow, intermetallic growth, and joint fatigue failures across both ubump and C4 interconnect types. Perform root cause analysis of assembly and reliability failures using cross-sectioning, SEM, CSAM, and other failure analysis techniques. Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling. Work cross-functionally with design, reliability, thermal, and manu