Band6 Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout . • Interpret product specifications and design circuits to meet the required functionality. • Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators, DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory (HBM) products • Integration of modules with Power delivery network and propose design solution for optimum performance • Deep understanding of Array and its peripheral circuits. • Driving innovation into the future Memory generations within a dynamic work environment • Validate & optimize design for reliability (Device stress, Aging effect) • EM/IR simulation, optimize layout to achieve best circuit performance • Custom digital circuit design & validation • Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions • Overseeing and managing the layout process including floor-planning, placement, and routing • Performing verification processes with modeling and simulation using industry standard simulators • Contributing to cross group communication to work towards standardization and group success • Working wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post- fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Physical Design team is responsible for implementing advanced High Bandwidth Memory (HBM) SoC and base die designs that enable next-generation AI, high-performance computing, and data center solutions. The team collaborates across architecture, RTL, verification, DFT, and signoff engineering to deliver high-performance, power-efficient silicon while developing innovative design methodologies and automation solutions. As an SoC Physical Design Intern on the HBM team, you will work alongside experienced engineers to support the implementation of advanced HBM SoC designs. You will gain hands-on experience with physical design methodologies, timing analysis, signoff flows, and automation while contributing to the development of next-generation memory products that power AI and high-performance computing applications. Responsibilities Support the physical implementation of SoC design blocks, including floorplanning, placement, clock tree synthesis, routing, and physical optimization activities. Analyze timing, power, area, congestion, and physical verification results to find opportunities for design improvement and optimization. Assist with static timing analysis, timing closure, and debugging across multiple operating modes and process corners. Develop and enhance automation tools, scripts, reports, and workflows using Python, Tcl, shell scripting, and AI-assisted solutions. Collaborate with multi-functional engineering teams to document r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Interconnect Modeling — Generating an

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Probe Integration Engineer at Micron Technology, Inc. within Test Solutions Engineering Department Key Equipment Group (KEG); you will have responsibilities for developing, deploying, and supporting Wafer Probe Equipment and Processes used in our manufacturing global locations with an emphasis on HBM (High Bandwidth Memory). The successful candidate will spend much of their time working on company-wide initiatives promoting greater quality, efficiency, and standardization of Probe operations together with enabling Probe roadmap technologies. A typical day in this position allows candidates to be creative and innovative in the deployment of first-of-a-kind solutions that solve complex problems. Responsibilities and Tasks: Responsibilities for this role will include, but are not limited to, the following: Deploy first-of-a-kind equipment and process capabilities through evaluations of Wafer Probers, Testers & Probe Cards Collaborate with global teams to establish and implement the best-known method probe processes globally. Engage equipment suppliers & vendors to address issues of quality, performance, and change management. Establish manufacturing metrics to drive continuous improvement of equip

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities Responsible for Design and development of critical Design and Co-optimization objectives, mixed-signal, custom digital block and full chip level integration support. Build and tapeout PWF Reticles Design Engage with Scribe Design team to capture Advanced Packaging requirements and Review TSV design engagement with HIG-HBM DTPCO teams (electrical , thermal and mechanical performance) Creation and Maintenance of DFMEA related to advanced packaging process steps like PWF, die stacking etc Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the d esign and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Senior Analog Design Engineer to join our High Bandwidth Memory (HBM) team. This role is responsible for the architecture, design, simulation, and silicon bring ‑ up of high ‑ performance analog and mixed ‑ signal circuits used in HBM PHYs and supporting infrastructure. The ideal candidate has deep expertise in high ‑ speed I/O, clocking, power management, and advanced ‑ node analog design, and has successfully delivered silicon to production. Responsibilities will include, but are not limited to: Design and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JOB DESCRIPTION As a High Bandwidth Memory Test Engineer at Micron, you will develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Micron Test Engineers support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. In this position, you will constantly learn new device specifications and operations in order to develop efficient and innovative solutions of production test flows thru test algo optimization. Additionally, you will take responsibility to gain a firm understanding of the functionality of advanced memory devices as defined in product data sheets. RESPONSIBILITIES AND TASKS: Independency of development of new tests and test algorithms for HBM, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Experienced on test programs development for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area. Be a lead to new product introduction (NPI) as well as pre/post silicon tasks management. Develop test Automation solutions as electrical validation and qualification of new test equipment and tools. Independently debug and identify root causes on test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The PDE API Process Integration (PI) Engineer is responsible for driving process integration excellence for Advanced Packaging products, including High Bandwidth Memory (HBM) products across sites during New Product Introduction (NPI) . This role ensures robust process readiness, yield ramp, and cross‑module integration across Front-end to Assembly interactions , PWF, Assembly, and Test , enabling successful execution of HBM technology roadmaps. The PI Engineer works cross‑functionally with different cross-functional teams including Fab, Assembly, Test, Yield, Quality, and central engineering teams to identify risks early, resolve complex integration issues, and deliver NPI milestones on time. Job Responsibilities Technical Leadership Serve as the Process Integration Subject Matter Expert, owning end‑to‑end integration across PWF, assembly, and test from NPI through sustained HVM Define PI technical direction, integration frameworks, and success criteria for HBM programs Lead process characterization strategy, window definition, and systemic yield improvement Resolve complex yield, reliability, and performance issues through deep technical analysis and integration expertise Drive resolution of high‑impact, ambiguous, cross‑site integration challenges affecting ramp, quality, or business commitments Anticipate risks early and define mitigation strategies across programs and sites

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JOB DESCRIPTION As a High Bandwidth Memory Test Engineer at Micron, you will develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Micron Test Engineers support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. In this position, you will constantly learn new device specifications and operations in order to develop efficient and innovative solutions of production test flows thru test algo optimization. Additionally, you will take responsibility to gain a firm understanding of the functionality of advanced memory devices as defined in product data sheets. RESPONSIBILITIES AND TASKS: Independency of development of new tests and test algorithms for HBM, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Experienced on test programs development for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area. Be a lead to new product introduction (NPI) as well as pre/post silicon tasks management. Develop test Automation solutions as electrical validation and qualification of new test equipment and tools. Independently debug and identify root causes on test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a Principal HBM Design Engineer , you will lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products . You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of design, silicon, and system behavior , providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability. Technical Leadership: Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts. Silicon & System Debug: Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple doma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits. Design, implementation, and improvement of Complex Analog Power Management IPs such as Bandgap reference, Voltage/Current reference, Regulators, Charge-pumps, CMOS Amplifiers, Comparators in advanced semiconductor process nodes for advanced DRAM products. Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions. Being responsible for and managing the layout process including floor-planning, placement, and routing. Performing verification processes with modeling and simulation using industry standard simulators. Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Driving innovation into the future Memory generations within a dynamic work environment. Leveraging AI About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description About the Position We are seeking a recent graduate with a strong foundation in electronics and a passion for technology to join our Design Verification team. In this role, you will contribute to the verification of advanced pre-silicon memory solutions, including High Bandwidth Memory (HBM) and emerging memory technologies. You will collaborate with experienced engineers while developing technical expertise in semiconductor design and verification. Responsibilities Provide verification support for circuit designs by simulating, analyzing, and debugging pre-silicon full-chip designs. Develop and maintain test benches and test cases to improve verification coverage of HBM and emerging memory architectures and features. Participate in the development of verification methodologies and test plans for advanced HBM and emerging memory products. Collaborate with engineering teams to identify and resolve design and verification issues. Support automation initiatives and contribute to process improvements through the application of AI technologies. Minimum Qualifications Bachelor’s, Master’s, or PhD degree in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or a related field. Graduated within the last two years from a Bachelor’s, Master’s, or PhD program.</sp