Design Leader Jobs

The Non-Volatile Engineering (NVEG) NAND Flash design and verification team at Micron Technology develops advanced memory solutions that deliver leading die size, performance, reliability, and power efficiency. The team collaborates closely across functions to bring innovative…

Silicon-to-systems solutions that transform how the world uses information. With over 45 years of industry leadership, Micron’s teams work across technology development, product engineering, and systems design to deliver high-performance, high-reliability memory products. As a…

Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced…

As a Design Architecture Lead in Non-Volatile-Engineering NAND Flash design team at Micron Technology, Inc., your role will cover both pathfinding as well as execution of innovative non-volatile memory designs! You will work with and support the efforts of functional teams to…

Ready to join a growing team!!! Micron Technology’s vision is to transform how the world uses information to enrich life and our dedication to people, innovation, tenacity, teamwork, and customer focus allows us to fulfill our mission to be a global leader in memory and storage…

Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle…

The way products get built is changing. Agents write a growing share of shipped interfaces, designers work in code, and a design system's output is bigger than a component library. At Datadog we're redefining ours for that world, and evolving how the product looks and feels at…

About Anthropic Anthropic’s mission is to create reliable, interpretable, and steerable AI systems. We want AI to be safe and beneficial for our users and for society as a whole. Our team is a quickly growing group of committed researchers, engineers, policy experts, and…

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise…

Micron’s Interface Pathfinding team builds and validates innovative PHY solutions for high-speed chip-to-chip and memory interconnect. Our focus is on pushing the boundaries of what is possible in high-speed signaling and validating those boundaries with real hardware data. As a…

Our EDA and Design Enablement team sits at the heart of Micron’s memory development. We build and support the tools and flows that enable world-class CMOS design at scale. We work closely with design, layout, and process teams, and we thrive on solving hard technical problems…

The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell…

As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product…

Key Responsibilities Program Planning & Execution Own end‑to‑end program plans for chip design programs from concept → tape‑out → silicon bring‑up . Develop and maintain coordinated schedules, achievements, and critical paths across: Architecture RTL & DV Physical Design CAD /…

The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via)…