Dram Design Technology Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Do you love the interaction of cutting-edge hardware and innovative software solutions? In today's data economy, Micron's memory and storage products are essential to advancing state of the art computing technology. Continued scaling of memory technology presents challenges that require complex and creative testing solutions. As a Product Test Engineer, you will be responsible for the development, debug and maintenance of test programs that help deliver Micron's world-class DRAM portfolio to market. A product test engineer can be focused on the health and quality of the memory cells [DRAM features 16 billion cells in less than 80mm^2 of area] or focused on high-speed interface, AI proficiency, AI supported workflow automation, and system level application testing. Responsibilities Develop, debug and support test programs from new product introduction phase up through high volume manufacturing Write test programs and support scripts in C++, Python Contribute input and feedback to help define next generation 'design for test' capabilities Analyze device and test flow data to make informed test coverage decisions Balance test time objectives while maintaining optimal yield and quality

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The 3D DRAM Technology Development organization is responsible for advancing next-generation memory technologies that enable future computing innovations. Engineers within this team work in a brand new 300mm R&D facility, collaborating across process development, characterization, reliability, design, and simulation fields to drive memory scaling and manufacturability. As a 3D DRAM Process Integration Engineer Intern, you will support the development of next-generation DRAM technologies with a focus on device performance, reliability, and manufacturability. This role involves working on advanced memory structures, including charge storage devices and thin-film transistors, while partnering with multi-functional engineering teams to solve challenging integration and circuit-related issues. The ideal candidate will have a strong foundation in semiconductor device fabrication, materials science, and device physics, combined with data-driven problem-solving skills and a passion for technology innovation. Responsibilities Contribute to the development of next-generation DRAM technologies, including advanced memory device components such as charge storage structures and thin-film transistors. Design, complete, and analyze experiments within the R&D fabrication environment to support technology development objectives. Collaborate with process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within Micron’s Heterogeneous Integration Group (HIG), we are driving the next generation of High Bandwidth Memory (HBM) solutions that power advanced computing and AI applications. Our team brings together experts across design, product development, manufacturing, and ecosystem partnerships to solve complex technical challenges and deliver innovative memory technologies. The Design Development Technical Lead (DDTL) plays a critical role in enabling predictable, high-quality execution across the HBM design lifecycle. As the single-threaded technical program owner for HBM Build, you will coordinate cross-functional teams. You will manage technical dependencies and risks. You will provide clear leadership across build, product, and executive collaborators to ensure successful program delivery. Responsibilities: Lead end-to-end execution of HBM build achievements across DRAM, base die, test vehicles, interposers, IP, and sustaining development efforts Drive multi-functional alignment, manage dependencies, and maintain execution plans to achieve schedule, cost, and quality objectives Lead governance activities including design reviews, program reviews, risk management, and change control processes Partner with foundries, IP vendors, contractors, and procurement teams to resolve execution challenges and support design delivery Own roadmap communication, executive reporting, and collaborator alignment for HBM build programs Minimum Qualifications: Bachelor’s degree in Electri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DRAM System Engineer in the DRAM System Validation Group at Micron Technology, Inc., you will be responsible for system-level validation, system characterization, failure analysis and experimentation as requested. We will be running and configuring diagnostic software, designing experiments, analyzing and interpreting data, crafting custom tools, and presenting data to customers both inside and outside Micron. Apply AI-enabled tools (e.g., data analytics, automation, or Copilot-based solutions) to improve system-level validation, failure analysis, and engineering productivity. On occasion, you may need to carry out these responsibilities at the customer site. We will work with colleagues in the Systems Compatibility Group, in Application Engineering Groups, Product Engineering, Return Material Authorization (RMA), and throughout Micron! Education: Bachelor’s Degree in Electrical Engineering, related field of study, or equivalent experience Successful candidates for this position will have: Familiarity with DRAM and System operations Good understanding system level debug Good multi-tasking, teamwork and problem solving skills Strong verbal and written communication skills in English Preferred Skills and Experience with: Application engineering or design experience related to memory testing and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: As a Mixed-Signal Design Engineer in Micron’s Pathfinding Design Team, you will play a key role in crafting next-generation memory technologies. This position involves contributing to defining, developing, and analyzing high-speed logics to operate the memory. These paths span from the memory array to the interface block for memory technologies, including DRAM and emerging memories. You will work on novel concept development, circuit simulation, optimization, and floor planning to enable groundbreaking memory solutions! Responsibilities: Provide technical direction and design implementation for a memory control circuits (both of digital and analog) from the memory array to the interface block. Collaborate closely with physical design teams to ensure timing closure, CDC robustness, and power intent alignment. Demonstrated experience working with custom mixed-signal IC build and development for volatile or nonvolatile memory technology. Experience with modeling and simulation of ICs using HSPICE/finesim. Minimum Qualifications: Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or related field. 7&#43; years of experience in custom mixed-signal circuit design. Proficiency with UNIX and CADENCE design environment (Simulation, Schematic entry, SPF extraction) </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Own and execute functional verification for block‑level and full‑chip designs from specification through tape‑out Develop, execute, and maintain verification plans , test strategies, and coverage models based on design specifications Architect, develop, and maintain SystemVerilog / UVM‑based testbenches , test vectors, and assertions Run directed and constrained‑random simulations and debug functional failures to root cause Drive coverage closure (functional, code, and assertion coverage) and identify verification gaps Work closely with design engineers to understand RTL, review specifications, and resolve design issues Provide verification status updates , summaries, and risk assessments to project stakeholders Collaborate with cross‑functional teams including design, validation, product engineering, and methodology teams across global sites Contribute to the development and improvement of verification tools, flows, and methodologies Provide verification support to design projects by simulating, analyzing and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for advanced DRAM and emerging memory products. Co-w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron research and development has an opening for Yield Analysis (DA) engineer to develop our next generation memory solution and to support production transfer for the next generation Micron products. As a DA engineer you will be responsible to characterize electrical data to identify and source out extrinsic and intrinsic device issues that are impacting yield. You will work closely with cross functional team from R&D and manufacturing to accelerate product to market timeline by applying device physics knowledge to develop end of line device performance prediction using machine learning. We need engineers who are passionate about detecting problems, making changes for the better, and seek out innovative ways in how predict end of line device performance. Your responsibilities will include, but are not limited to the following: Analyze end of line test, parametric and fab data to identify design, process, and test issues that are impacting yield Develop new tools for yield analysis and implement machine learning technique to improve analysis efficiency and accuracy, leveraging artificial intelligence (AI) to improve proficiency. Identify new creative and innovative ways to use existing tools to identify relevant process issues or device failures Identify interactions between process modules and/or equipment to detect fail mechanisms Use the data collected inline to drive process improvements Improve yield by standardizing methods and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enable rapid learning and effective technology transfer across the organization through deep involvement in defect detection equipment applications and advanced data analysis. Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams across process integration, process development, data science, and yield analysis to deliver solutions with global impact. Drive defect reduction and yield improvement efforts across multiple projects on Micron’s DRAM roadmap, including High Bandwidth Memory (HBM) and advanced DRAM technologies. Develop a comprehensive understanding of process flows, potential failure and defect modes through FMEA, and associated detection strategies for inline yield characterization. Define die loss paretos upon issue detection and partner with process and integration teams to design, execute, and analyze experiments and DOEs to resolve yield limitations. Monitor baseline inline yield health for owned process modules using SPC techniques to quickly identify excursions, process drift, and emerging risks. Protect line yield by proactively escalating issues and coordinating corrective actions. Apply advanced data science and data interpretation skills to analyze complex datasets, draw actionable conclusions, and communicate results effectively. Present findings and recommendations to internal teams and customers using analytical tools such as JMP and Python. Employer will accept a Master’s degree in Material Engineering, Chemical Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we're not just designing chips. We're building the physical architecture that powers artificial intelligence, accelerates cloud computing, enables autonomous vehicles, and connects the world through mobile and edge devices. Every breakthrough in AI — from large language models to next-generation data centers — runs on memory. And every bit of that memory lives inside a package that someone like you designs! We're looking for a Senior Package Design Engineer who is passionate about sadvanced semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This is a high-impact, highly visible role where you'll work across the full product lifecycle — from early-stage co-design with silicon teams all the way to High Volume Manufacturing (HVM). If you thrive where precision meets innovation, where your decisions shape products reaching millions of users worldwide, and where your expertise directly influences how the AI era unfolds — this role is for you! Responsibilites: Lead Co-Design from Silicon to System - Partner with silicon design, Business Units, customers, and package architecture teams to define new product concepts from the earliest stages of chip development - Optimize die floorplans, interconnection schemes, and package architectures — from concept to HVM - Drive trade-off studies and architecture decisions for advanced DRAM products targeting AI/D

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Customer Engineering team at Micron, where we partner directly with leading datacenter customers to solve complex challenges and bring cutting-edge memory solutions to life. Our work sits at the intersection of innovation and real-world impact—enabling faster computing, smarter systems, and breakthroughs across industries. This role is a key bridge between Micron and our customers. As a Datacenter DRAM Customer Engineer, you’ll act as a primary technical advisor, helping customers design, qualify, and deploy memory solutions that power next-generation compute platforms. You’ll collaborate across engineering, sales, and product teams while influencing both customer success and Micron’s product direction. Responsibilities: Drive design wins and product qualifications for DRAM, HBM, SSD, and compute-focused solutions Partner with sales and cross-functional teams to execute strategic customer plans and track progress Resolve system configuration, setup, and performance issues in customer environments Guide customers on memory architecture, system configuration, and optimization for cloud/datacenter workloads Support validation and deployment through lab activities, design reviews, and system-level testing utilize AI proficiency or AI‑enabled ways of working where applicable Minimum Qualifications: <s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Senior Verification Engineer with 4-8 years of Experience As a Senior RTL Verification Engineer you will work in a highly innovative, motivated, Upbeat, and dynamic design team capable of verifying complete products using innovative memory technologies. You will need to have the ability to drive the team and the overall verification effort to ensure the timely delivery of a functionally accurate design. Unique Opportunities Complete ownership of RTL verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR5, LPDDR5,DDR6 and LPDDR6 that can operate at high speeds of up to 9600MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work wi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR5, LPDDR5,DDR6 and LPDDR6 that can operate at high speeds of up to 9600MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work with international colleagues on developing new verification flows to take on the challenges in design. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Ability to identify verification pain points sui

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE &#43; 10 years or BSEE &#43; 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE &#43; 10 years or BSEE &#43; 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w