Dram Design Technology Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: As a Mixed-Signal Design Engineer in Micron’s Pathfinding Design Team, you will play a key role in crafting next-generation memory technologies. This position involves contributing to defining, developing, and analyzing high-speed logics to operate the memory. These paths span from the memory array to the interface block for memory technologies, including DRAM and emerging memories. You will work on novel concept development, circuit simulation, optimization, and floor planning to enable groundbreaking memory solutions! Responsibilities: Provide technical direction and design implementation for a memory control circuits (both of digital and analog) from the memory array to the interface block. Collaborate closely with physical design teams to ensure timing closure, CDC robustness, and power intent alignment. Demonstrated experience working with custom mixed-signal IC build and development for volatile or nonvolatile memory technology. Experience with modeling and simulation of ICs using HSPICE/finesim. Minimum Qualifications: Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or related field. 7&#43; years of experience in custom mixed-signal circuit design. Proficiency with UNIX and CADENCE design environment (Simulation, Schematic entry, SPF extraction) </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Own and execute functional verification for block‑level and full‑chip designs from specification through tape‑out Develop, execute, and maintain verification plans , test strategies, and coverage models based on design specifications Architect, develop, and maintain SystemVerilog / UVM‑based testbenches , test vectors, and assertions Run directed and constrained‑random simulations and debug functional failures to root cause Drive coverage closure (functional, code, and assertion coverage) and identify verification gaps Work closely with design engineers to understand RTL, review specifications, and resolve design issues Provide verification status updates , summaries, and risk assessments to project stakeholders Collaborate with cross‑functional teams including design, validation, product engineering, and methodology teams across global sites Contribute to the development and improvement of verification tools, flows, and methodologies Provide verification support to design projects by simulating, analyzing and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for advanced DRAM and emerging memory products. Co-w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design onl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron research and development has an opening for Yield Analysis (DA) engineer to develop our next generation memory solution and to support production transfer for the next generation Micron products. As a DA engineer you will be responsible to characterize electrical data to identify and source out extrinsic and intrinsic device issues that are impacting yield. You will work closely with cross functional team from R&D and manufacturing to accelerate product to market timeline by applying device physics knowledge to develop end of line device performance prediction using machine learning. We need engineers who are passionate about detecting problems, making changes for the better, and seek out innovative ways in how predict end of line device performance. Your responsibilities will include, but are not limited to the following: Analyze end of line test, parametric and fab data to identify design, process, and test issues that are impacting yield Develop new tools for yield analysis and implement machine learning technique to improve analysis efficiency and accuracy, leveraging artificial intelligence (AI) to improve proficiency. Identify new creative and innovative ways to use existing tools to identify relevant process issues or device failures Identify interactions between process modules and/or equipment to detect fail mechanisms Use the data collected inline to drive process improvements Improve yield by standardizing methods and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enable rapid learning and effective technology transfer across the organization through deep involvement in defect detection equipment applications and advanced data analysis. Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams across process integration, process development, data science, and yield analysis to deliver solutions with global impact. Drive defect reduction and yield improvement efforts across multiple projects on Micron’s DRAM roadmap, including High Bandwidth Memory (HBM) and advanced DRAM technologies. Develop a comprehensive understanding of process flows, potential failure and defect modes through FMEA, and associated detection strategies for inline yield characterization. Define die loss paretos upon issue detection and partner with process and integration teams to design, execute, and analyze experiments and DOEs to resolve yield limitations. Monitor baseline inline yield health for owned process modules using SPC techniques to quickly identify excursions, process drift, and emerging risks. Protect line yield by proactively escalating issues and coordinating corrective actions. Apply advanced data science and data interpretation skills to analyze complex datasets, draw actionable conclusions, and communicate results effectively. Present findings and recommendations to internal teams and customers using analytical tools such as JMP and Python. Employer will accept a Master’s degree in Material Engineering, Chemical Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we're not just designing chips. We're building the physical architecture that powers artificial intelligence, accelerates cloud computing, enables autonomous vehicles, and connects the world through mobile and edge devices. Every breakthrough in AI — from large language models to next-generation data centers — runs on memory. And every bit of that memory lives inside a package that someone like you designs! We're looking for a Senior Package Design Engineer who is passionate about sadvanced semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This is a high-impact, highly visible role where you'll work across the full product lifecycle — from early-stage co-design with silicon teams all the way to High Volume Manufacturing (HVM). If you thrive where precision meets innovation, where your decisions shape products reaching millions of users worldwide, and where your expertise directly influences how the AI era unfolds — this role is for you! Responsibilites: Lead Co-Design from Silicon to System - Partner with silicon design, Business Units, customers, and package architecture teams to define new product concepts from the earliest stages of chip development - Optimize die floorplans, interconnection schemes, and package architectures — from concept to HVM - Drive trade-off studies and architecture decisions for advanced DRAM products targeting AI/D

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Customer Engineering team at Micron, where we partner directly with leading datacenter customers to solve complex challenges and bring cutting-edge memory solutions to life. Our work sits at the intersection of innovation and real-world impact—enabling faster computing, smarter systems, and breakthroughs across industries. This role is a key bridge between Micron and our customers. As a Datacenter DRAM Customer Engineer, you’ll act as a primary technical advisor, helping customers design, qualify, and deploy memory solutions that power next-generation compute platforms. You’ll collaborate across engineering, sales, and product teams while influencing both customer success and Micron’s product direction. Responsibilities: Drive design wins and product qualifications for DRAM, HBM, SSD, and compute-focused solutions Partner with sales and cross-functional teams to execute strategic customer plans and track progress Resolve system configuration, setup, and performance issues in customer environments Guide customers on memory architecture, system configuration, and optimization for cloud/datacenter workloads Support validation and deployment through lab activities, design reviews, and system-level testing utilize AI proficiency or AI‑enabled ways of working where applicable Minimum Qualifications: <s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Senior Verification Engineer with 4-8 years of Experience As a Senior RTL Verification Engineer you will work in a highly innovative, motivated, Upbeat, and dynamic design team capable of verifying complete products using innovative memory technologies. You will need to have the ability to drive the team and the overall verification effort to ensure the timely delivery of a functionally accurate design. Unique Opportunities Complete ownership of RTL verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR5, LPDDR5,DDR6 and LPDDR6 that can operate at high speeds of up to 9600MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work wi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR5, LPDDR5,DDR6 and LPDDR6 that can operate at high speeds of up to 9600MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work with international colleagues on developing new verification flows to take on the challenges in design. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Ability to identify verification pain points sui

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. Develop efficient and innovative solutions of production test flows through test algo optimization. Design test plans for new tests and test algorithms for DRAM, which cover test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Develop test programs for products using primarily C&#43;&#43; coding and Python on Automated Test Equipment (ATE) in the given area followed by test program release to manufacturing areas. Drive innovation and improvement through optimizing test programs by applying more efficient testing methods to reduce product test times and manufacturing costs. Demonstrate a thorough understanding of the device/part as it applies to device/part testing. Automate test processes by writing software to improve work efficiency. Develop tools to help provide better analysis and insight of the terabytes of probe data. Develop new Design for Test (DFT), Design For Manufacturability (DFM), and Design For Reliability (DFR) capabilities. Independently debug and identify root causes of test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and justification of program validation and its release to ensure program quality and data integrity. Evaluate and verify yields/quality with global teams to ensure shipping

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Craft and analyze digital and analog circuits used in the development of memory products including simulating, optimizing, and floor planning DRAM circuits. Collaborate with various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to proactively craft HBM products that optimize all manufacturing functions and assure the best performance, power, cost, quality, reliability, time-to-market, and customer happiness. Innovate and integrate end-toend groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). Employer will accept a Master’s degree in Electrical Engineering, Physics, Computer Engineering, Semiconductor Engineering or a related field and 10 years of experience in the job offered or in a related field. Position requires: 1. High-speed memory design on data paths, from I/O interface to core array 2. 2. Power domain network analysis 3. Memory test architectures like MBIST and production silicon validation 4. Digital design methodologies experience including RTL design, synthesis, and physical implementation 5. ASIC design development using digital design 6. Memory core timing, latency control, and signal integrity consideration in advanced designs <p style="

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE &#43; 10 years or BSEE &#43; 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work with international colleagues on developing new verification flows to take on the challenges in design. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Ability to identify verification pain points suitable for AI-based automation and collaborate with cross‑functional teams to deploy scalable solutions. Core Requirements Good communication skills and ability to work well in a team Exposure to gate level simulations ( with delays ) and Logic schematic analysis Analytical capability for complex CMOS and/or gate level circuit designs Proficient with Spice and Verilog simulations Qualifications & Skills Experience in DRAM, SRAM or other memory related fields Experience in python scripting Experience in timin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE &#43; 10 years or BSEE &#43; 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w