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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we accelerate the transformation of information into intelligence, enabling advances in learning, communication, and technology. Micron's Boise site is at the center of a historic semiconductor manufacturing expansion, supported by a $15 billion investment. This growth creates exciting opportunities for students to contribute to leading-edge DRAM manufacturing while developing technical expertise in one of the world's most advanced fabrication environments. The ID1 High Volume Manufacturing Process Engineer supports process quality, yield improvement, manufacturing efficiency, and cost reduction within a high-volume semiconductor fabrication environment. This role partners closely with equipment engineers, manufacturing teams, process owners, and operations leaders to find opportunities, resolve process issues, and optimize wafer output. The successful candidate will apply statistical analysis, engineering principles, and data-driven decision making to improve manufacturing performance, support operational excellence, and contribute to key area performance indicators. Responsibilities Monitor, analyze, and improve manufacturing processes to achieve yield, quality, throughput, and cost objectives. Apply SPC, FDC, Design of Experiments, and systematic problem-solving methodologies to identify and resolve process deviations and chronic is

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high-speed interface die, significantly increasing memory density and bandwidth for next-generation AI/ML accelerators and high-performance computing platforms. Our designs target the industry's lowest power-per-bit and highest bandwidth, enabling the most demanding compute workloads. We are seeking a SI/PI Engineer in HBM Build Architecture to develop high-quality SI/PI analysis for interposers, packages, and silicon channels. This work contributes directly to HBM build sign-off and product success. You will be involved in complex, multi-disciplinary SI/PI initiatives spanning multiple HBM product generations — from early interposer channel analysis and equalization co-design, PDN architecture, and system PI analysis. You will ensure Micron's HBM SI/PI architecture remains the industry benchmark for signal quality, power delivery integrity, and interface reliability. This role supports the design and deployment of AI-enabled solutions that improv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team drives leading-edge process capability, best-in-class yield (bits per wafer), high product quality, and rapid time to maturity through innovation and strong cross-functional collaboration. Supporting a global DRAM and NAND technology portfolio across development and manufacturing sites in the U.S., Japan, Taiwan, and Singapore, the team ensures consistent execution of manufacturing excellence worldwide! As a Frontend Central Process Integration Senior Engineer, you will identify, align, and deploy best-known methods across the global network and develop optimized processes to achieve product maturity and sustainable performance improvement. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline transparency to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. </li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team delivers best‑in‑class yield, quality, and cycle time through innovation and strong cross‑functional teamwork. Supporting diverse DRAM and NAND technologies across global development and manufacturing sites (Boise, Japan, and fabs in the U.S., Taiwan, Japan, and Singapore), the team identifies, aligns, and deploys best‑known methods across the network. As a Frontend Central Process Integration Senior Engineer, you will develop and optimize processes to drive rapid product maturity. Join us today and make a difference! Responsibilities and Tasks Drive rapid product maturity, improving yield (bits per wafer), repair density, and DPM through fast learning cycles. Apply deep process integration knowledge across FEOL, MOL, CELL, and BEOL to identify optimal solutions; design and circuit knowledge is a plus. Partner with Yield Engineering, Device, RDA, and Metrology teams to resolve key yield issues and build strong inline visibility for fast ramp and excursion prevention. Identify and standardize best‑known methods and business processes across DRAM and NAND sites. Travel to Micron sites as needed for onsite collaboration. Minimum Qualifications Bachelor’s degree in Engineering or a related field 5&#43; years of experience in process integration, product design, or equivalent technical roles Demonstrated ability to collaborate optimally with global, cross‑functional teams Proven t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the CMOS Device Integration Team at Micron, where we push the limits of memory technology every day. We work at the intersection of device physics, process integration, and product performance to enable the next wave of DRAM, HBM, and Compute-in-Memory innovation. If you’re excited by challenging technical problems and real-world impact, you’ll feel right at home here! In this role, you’ll serve as a technical leader shaping the future of Micron’s most advanced memory products. As a Distinguished Member of Technical Staff, you’ll drive CMOS device and module development that directly impacts array efficiency, data rates, and product scalability. Your expertise and influence will help guide technology decisions that power AI, high-performance computing, and emerging applications. Responsibilities: Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures Perform detailed electrical characterization of CMOS devices and circuits to drive performance improvements Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions Provide technical leadership, strategic recommendations, and clear presentations to guide technology direction Minimum Qualifications: Master’s degree or PhD in Electrical Engineering or equivalent practical experience 10 or more years of hands-on experience in advanced CMOS device design and/or integration 1

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design and maintain standard cells layout for new DRAM products on new technology Lead the stdcells layout projects from initial spec definition to till PPA qualified library release Closely collaborate with DTCO team to develop stdcells architecture for emerging technologies Perform layout verification like LVS/DRC/Latchup, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Guide junior team-members in their execution of Sub block-level layouts & review their work. Contribute to effective project-management. Develop new flows/methodologies to reduce the stdcells manual effort & increase the productivity Closely work with the Process team, CMOS and CAD to negotiate drc for new technology. Co-work with international colleagues on developing new flows and tools for stdcells layout & design Leverage AI tools to automate the tools and workflow Use AI-assisted workflows to improve design productivity About Micron Technology, Inc. We a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Contribute to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop advanced capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. applying Artificial Intelligence Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5&#43; years of direct CAD or Design experience in mixed

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Additional Responsibilities Align TDT CMOS Device development and transfer objectives with Technology Development sites. Drive and ensure close collaboration with Design, TCAD, Modeling, and Product Engineering groups across Micron sites. Collaborate with process integration module owners and process owners to drive electrical characterization of CMOS devices and CMOS circuits and identify device improvement opportunities. Utilize technology development and transfer knowledge to develop new technology nodes to mature manufacturing capability while achieving key program metrics. Ensure CMOS devices meet electrical, performance, power, variability, and reliability targets required for product success. Drive close collaboration with device and process integration development groups at other Technology Development sites. Collaborate closely with manufacturing fabs to facilitate successful technology transfer and production ramp. Contribute to the fundamental understanding of CMOS technology and its impact on overall product figures of merit. Lead cross-functional exploration and development of future CMOS device architectures, including non-planar transistor technologies, by partnering with Device, TCAD, Process Integration, Design, and Manufacturing teams to enable future DRAM technology roadmaps. Drive adoption of AI, machine learning, advanced analytics, and engineering automation solutions to accelerate technology development, r

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: <span

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Do you love the interaction of cutting-edge hardware and innovative software solutions? In today's data economy, Micron's memory and storage products are essential to advancing state of the art computing technology. Continued scaling of memory technology presents challenges that require complex and creative testing solutions. As a Product Test Engineer, you will be responsible for the development, debug and maintenance of test programs that help deliver Micron's world-class DRAM portfolio to market. A product test engineer can be focused on the health and quality of the memory cells [DRAM features 16 billion cells in less than 80mm^2 of area] or focused on high-speed interface, AI proficiency, AI supported workflow automation, and system level application testing. Responsibilities Develop, debug and support test programs from new product introduction phase up through high volume manufacturing Write test programs and support scripts in C&#43;&#43;, Python Contribute input and feedback to help define next generation 'design for test' capabilities Analyze device and test flow data to make informed test coverage decisions Balance test time objectives while maintaining optimal yield and quality Collaborate with partners in Design and Product Engineering, Fab, Manufacturing, Yield Enhancement, Global Quality, Systems Integrati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for early validation of DRAM products with customers' newest technology. Involved in computer system-level failure analysis, characterization, and qualification of our products. Run and configure diagnostic software, craft experiments, analyze and interpret data, debug fails, develop custom tools, and communicate data to customers both inside and outside Micron. Work with other specialists within the Systems Compatibility Group as well as multi-functional teams including Application Engineering Groups, Product Engineering, Return Material Authorization (RMA), and throughout Micron. Lead Micron Product Qualifications with Internal and External customers. Build and develop validation strategies for new or existing technologies, which may include developing system test methodologies and system diagnostic tools. Design and implement automation for System Level testing. Define and execute system test methodologies. Employer will accept a Master’s degree in Electrical Engineering, Computer Engineering or related field. Position requires: 1. Utilizing Knowledge of computer architecture to perform system-level memory validation, system characterization and failure analysis, and developing system diagnostic tools. 2. Utilizing Python to evaluate and develop diagnostic software, system debug and test methodologies. 3. Designing experiments, analyzing and interpreting data, crafting custom tools and communicating data to customers. 4. Building and developing validation strategies for new technology inc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Owner at Micron Technology, Inc., you will report to the Smart Manufacturing and Artificial Intelligence organization. The team defines, drives, and delivers end-to-end smart manufacturing solutions, integrated across functions of the business. The team applies industry-leading methodologies in automation, artificial intelligence (AI) , and generative AI (GenAI) to enhance Micron’s product development, business, and administrative processes across the company. Responsibilities and Tasks Support DRAM technology development, which includes deployment of existing smart-manufacturing solutions to TD as well as the development of new customized tools/solutions for TD. Work with users to capture and analyze information related to the adoption of apps for Smart Manufacturing. Identify gaps, weaknesses, and inefficiencies in current solutions, including opportunities for AI-driven enhancements. Define business solutions and propose projects for implementation, leveraging AI and GenAI technologies where applicable. Lead projects and activities requiring coordination, support, and management of resources from global teams. Collaborate with Data Engineers and Data Scientist to design, execute, and deliver smart manufacturing solutions. Use metrics and performance data to identify opportunities for improvement, including predictive analytics and intelligent decision support. Provide domain and system expertise; collaborate with data sci