Dram Systems Architecture Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Understand the LPDRAM state machine and develop the hardware models for DRAM features and the related validation test bench. Develop memory controller models, including request scheduling and address mapping to enable new DRAM features. Develop the automation test scripts using Python to improve the overall simulation methodologies. Develop new DRAM technology changes per the spec and the state machine and the validation test bench. Develop system engineering, software engineering, system integration, or distributed system architectures. Identify system data, hardware, or software components required to meet user needs. Communicate with staff or clients to understand specific system requirements. Research, test, or verify proper functioning of software patches and fixes. Provide advice on project costs, design concepts, or design changes. Communicate project information through presentations, technical reports, or white papers. Design and conduct hardware or software tests. Establish functional or system standards to address operational requirements, quality requirements, and design constraints. Evaluate existing systems to determine effectiveness, and suggest changes to meet organizational requirements. Employer will accept a Master's degree in Electronics Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related field. Position requires: 1. C/C++ or Python; 2. Debugging interfaces, including GDB and PDB; 3. LPDRAM technology; 4. Computer Architecture; 5. Memory controller

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Silicon-to-systems solutions that transform how the world uses information. With over 45 years of industry leadership, Micron’s teams work across technology development, product engineering, and systems design to deliver high-performance, high-reliability memory products. As a Design Engineer, you will contribute to the design and analysis of digital and analog circuits used in memory technologies. You will collaborate with global, multi-functional engineering teams to optimize product performance, manufacturability, cost, and time-to-market while supporting end-to-end product development and validation. Responsibilities Design, simulate, and optimize memory circuits, including layout development and verification using industry-standard tools (e.g., SPICE, Verilog) Develop schematic blocks such as memory arrays, control logic, datapaths, address decoders, and internal test logic Analyze design trade-offs across power, speed, die size, and manufacturability to improve overall product performance Collaborate with Product Engineering, Test, Process Integration, Assembly, and Marketing teams to ensure robust and scalable designs Apply AI-enabled tools and methodologies to improve circuit design efficiency, simulation accuracy, and overall design flow optimization Minimum Qualifications Bachelor’s degree in Electrical Engineering (BSEE) or higher Foundational understanding of memory architectures, circuit design, and semiconductor device behavior Experienc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Architecture team defines the future of memory systems that enable next-generation AI, machine learning, and high-performance computing applications. By researching advanced memory architectures, system designs, and emerging technologies, the team develops innovative solutions that maximize performance, scalability, and efficiency for future memory products. As a Memory System Architect on the HBM Architecture team, you will contribute to the definition of future memory architectures supporting Generative AI and data-intensive workloads. You will research and evaluate advanced memory system concepts, analyze AI accelerator architectures, and develop models that guide product strategy and technology roadmaps for next-generation memory solutions. Responsibilities Research and evaluate advanced memory architecture concepts for AI accelerators, including GPU, TPU, and emerging compute platforms. Develop and analyze system-level models to assess performance, power, scalability, and efficiency across memory and compute architectures. Investigate memory hierarchy optimizations involving HBM, DRAM, cache, storage, and interconnect technologies. Evaluate architectural trade-offs and emerging technologies, including compute-near-memory concepts, to support future product development. Collaborate with cross-functional teams to translate research findings into architecture recommendations and long-term technology roadmaps.

Everpure (NYSE: P) has evolved from storage pioneer to data platform, closing fiscal 2026 with $3.7 billion in revenue, its first billion-dollar quarter, and accelerating growth into FY27. Our strategic agenda spans the companies defining the next era of technology - hyperscalers, AI labs, the AI hardware supply chain, data platform providers, and the broader AI ecosystem. This type of work—work that changes the world—is what the tech industry was founded on. So, if you're ready to seize the endless opportunities and leave your mark, come join us. THE ROLE Drive the technical foundation and supply integrity of Everpure’s enterprise flash arrays, blades, and server building blocks as Component Engineering Manager. You will lead a high-performing engineering team and serve as the final authority on component qualification, ensuring every storage node, CPU, memory subsystem, and interconnect module meets uncompromising performance and reliability standards. By bridging Hardware Engineering, Quality, Supply Chain, and global semiconductor vendors, you will directly influence product architecture while safeguarding manufacturing continuity and operational scale. WHAT YOU'LL DO Engineering Leadership & Talent Development: Build, direct, and mentor a specialized team of component engineers spanning flash/SSD technologies and server platform hardware, fostering technical growth and setting execution priorities. End-to-End Component Qualification: Own the complete qualification lifecycle—defining rigorous test plans, analyzing supplier data, and issuing final approval for design-in and mass production across NAND flash, CPUs, DRAM, power systems, and interconnects. Strategic Flash & SSD Oversight: Drive roadmap alignment and technology node transitions with key storage suppliers, governing media characterization, firmware qualification, and long-term architectural integration. Supply Resilience & Risk Mitigation: Establish multi-sourcing strategies, lead s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Lead the development of next-generation DRAM and LPDDR memory technologies that enable AI, mobile, automotive, and high-performance computing applications. Drive design innovation across memory sub-systems including array, datapath, sensing, repair, redundancy, IO, power management, and reliability features. Influence product architecture and technical roadmaps in collaboration with global engineering teams and technology leaders. Build and mentor a team of highly capable engineers while shaping the future design capabilities of the organization. Work closely with experts across design, modeling, layout, verification, product engineering, manufacturing, and system architecture. Lead adoption of advanced engineering methodologies, automation frameworks, and AI-enabled design workflows to accelerate development cycles and improve design quality. Help drive Micron's AI transformation through the practical application of Generative AI, Agentic AI, Large Language Models (LLMs), and data-driven engineering solutions. Responsibilities Define and drive strategic technical direction for memory circuit design activities across multiple projects and technology nodes. Build, lead, mentor, and develop a high-performing engineering team capable of delivering world-class memory products. Own execution, schedule, quality, and risk management for critical design deliverables. Partne

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We make sure Micron DRAM performs where it matters most: inside next-generation servers, client systems, and emerging compute platforms. Our team works at the intersection of memory technology, silicon behavior, platform architecture, firmware interaction, and system-level validation. We partner across engineering fields to bring new memory products from initial platform bring-up through qualification and readiness, helping develop the future of computing. In this role, you will validate Micron DRAM products on cutting-edge compute platforms and play a key role in ensuring system readiness before customer deployment. You will lead complex debug efforts, collaborate with internal teams and external platform partners, and use data-driven analysis to solve challenging technical issues. This hands-on position is ideal for an engineer who enjoys working in the lab, uncovering root causes, and driving issues through resolution. Responsibilities : Lead platform bring-up and system debug across server, client, and emerging compute platforms, including BIOS, firmware, memory training, and system stability Develop and implement memory validation plans to assess performance, compatibility, reliability, and platform readiness Drive failure analysis and root cause investigations, documenting findings, corrective actions, and readiness risks Partner with engineering, product, quality, and program teams to resolve technical issues and support pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary This position supports Micron’s DRAM Tester Solutions group, focusing on physical design implementation for processors, controller architectures, and ASICs. The role is responsible for full‑chip and block‑level physical design closure, low‑power implementation, timing, power, and signal integrity signoff, and successful tape‑out across advanced technology nodes. Responsibilities: Lead block‑level and full‑chip physical design including floorplanning, placement, CTS, routing, and tape‑out. Drive timing closure across multiple modes and corners using industry‑standard STA tools. Perform power integrity, IR/EM, and power grid closure to meet signoff requirements. Develop and optimize APR flows, scripts, and methodologies for PPA improvements. Own subsystem or full-chip closure work while coordinating with cross-functional teams. Minimum Qualifications: Bachelor’s degree or Master’s degree or equivalent experience in Electrical Engineering, Electronics, or Computer Architecture. Minimum of 15 years of hands‑on ASIC physical design implementation experience. Proven experience with multiple production tape‑outs in advanced process nodes. Strong expertise in low‑power design techniques including UPF/CPF and multi‑voltage systems. Proficiency in scripting languages such as Tcl, Perl, or Python for flow automation. Preferred Qualifications: Experience with Synopsys and Cadence physical design and ti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We validate Micron memory products on current and next-generation computing platforms. As an Intern System Compatibility Engineer, you will join our System Enablement and Test Development teams and gain hands-on experience with platform bring-up, system configuration, memory validation, test development, automation, data analysis, and AI-enabled engineering workflows under the guidance of experienced engineers. We will provide technical mentorship, structured onboarding, and exposure to DRAM, BIOS and firmware interactions, computer architecture, laboratory workflows, responsible use of approved AI tools, and the memory product lifecycle from initial bring-up through qualification and readiness. Key Responsibilities Set up and support Intel, AMD, and ARM-based systems in Linux, Windows, and UEFI environments; document hardware, BIOS, firmware, operating system, memory, and test configurations for repeatable execution and traceability. Implement memory validation activities that assess compatibility, stability, reliability, performance, and platform readiness. Reproduce and triage failures, collect logs and diagnostic data, use issue-tracking systems, apply structured failure-analysis methods, and support validation of corrective actions. Build or refine automation using Python, PowerShell, C++, or related languages; use approved AI-assisted tools to accelerate code development, test generation, log analysis, data summarization, technical research, documentation, and report

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for early validation of DRAM products with customers' newest technology. Involved in computer system-level failure analysis, characterization, and qualification of our products. Run and configure diagnostic software, craft experiments, analyze and interpret data, debug fails, develop custom tools, and communicate data to customers both inside and outside Micron. Work with other specialists within the Systems Compatibility Group as well as multi-functional teams including Application Engineering Groups, Product Engineering, Return Material Authorization (RMA), and throughout Micron. Lead Micron Product Qualifications with Internal and External customers. Build and develop validation strategies for new or existing technologies, which may include developing system test methodologies and system diagnostic tools. Design and implement automation for System Level testing. Define and execute system test methodologies. Employer will accept a Master’s degree in Electrical Engineering, Computer Engineering or related field. Position requires: 1. Utilizing Knowledge of computer architecture to perform system-level memory validation, system characterization and failure analysis, and developing system diagnostic tools. 2. Utilizing Python to evaluate and develop diagnostic software, system debug and test methodologies. 3. Designing experiments, analyzing and interpreting data, crafting custom tools and communicating data to customers. 4. Building and developing validation strategies for new technology inc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build the Future of Memory and AI from India At Micron India , we are helping shape the next generation of memory and storage solutions that power Artificial Intelligence, cloud computing, mobile devices, automotive systems, and data centers worldwide. Join a team of innovators, engineers, and technology leaders working at the forefront of semiconductor design, verification, product development, advanced packaging, data analytics, and manufacturing technology. From pioneering High Bandwidth Memory (HBM) solutions for AI to developing next-generation DRAM and NAND technologies, Micron India plays a critical role in delivering innovations that enable the world's most demanding computing applications. As one of Micron's fastest-growing innovation hubs, our teams collaborate globally to solve complex engineering challenges, accelerate technology development, and transform breakthrough ideas into products used by billions of people around the world. Opportunities Across Micron India Engineering Teams DTPG (Design Technology & Product Group) Design and develop next-generation DRAM, NAND, and emerging memory technologies powering AI, high-performance computing, mobile, and cloud applications. Work across memory architecture, circuit design, layout, verification, characterization, and product engineering to bring cutting-edge semiconductor innovations to market. TD (Technology Development) Drive the future of memory technology

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction The Central Process Integration Engineering (cPIE) Loop Integration team drives process optimization, defect reduction, structural performance improvement, and technology integration across Micron's advanced DRAM and HBM manufacturing network. We are ready for the future! The team serves as the technical owner of critical process loops including FEOL, MOL, CAP, BEOL, Uniformity, and Backside Engineering, partnering closely with Process Engineering, Yield Engineering, RDA, Manufacturing, and Technology Development teams to accelerate yield learning and qualification readiness! Position Overview As a Senior Process Integration Engineer, you will own process loop performance across one or more critical semiconductor manufacturing modules. You will identify process interactions, drive yield improvement, characterize failure mechanisms, and enable successful deployment of new technologies from development through high-volume manufacturing. This role provides opportunities to influence process architecture, conversion strategies, inline monitoring systems, and technology ramp execution while collaborating with global engineering teams across multiple sites. In support of Micron's AI transformation, you will be expected to harness Artificial Intelligence tools and advanced analytics to improve engineering productivity, accelerate problem solving, and enhance process understanding. Responsibilities Drive process loop performance and structural optimization for assigned

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As a DRAM Architect, you will optimize DRAM solutions for power, performance, and cost while pioneering new memory features and system-level innovations. You will collaborate with global, multi-functional teams to deliver high-quality, reliable, and power-efficient DRAM solutions that meet aggressive performance and time-to-market goals. Responsibilities: Develop comprehensive DRAM system/component solutions, specifications, and methodologies to optimize DRAM performance, power efficiency, and cost. Collaborate with multi-functional teams to brainstorm and implement innovative ideas, assess solution efficiency, and make necessary adjustments. Drive innovation in future memory generations within a dynamic work environment. Analyze system behavior and assess solution effectiveness, make data-driven optimizations and trade-offs. Communicate complex technical concepts to engineers from various backgrounds. Minimum Qualifications: 3&#43; years of proven experience in memory design, product engineering, or system architecture and usage Self-motivated with exceptional problem-solving skills and a drive to discover new solutions. Excellent communication and interpersonal skills. Bachelor’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or a related field. <