Dram Technology Sr Layout Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Lead, PCVD Equipment, you will lead a team of equipment engineers responsible for improving manufacturing capability through equipment performance, yield improvement, throughput optimization, and quality excellence. You will set strategic direction, develop team capabilities, and collaborate with manufacturing, facilities, technology development, and global partners to achieve business objectives. This is a great opportunity to influence fab performance at scale while building a high-performing engineering organization. Responsibilities: Lead and develop a team of equipment engineers to achieve manufacturing, quality, output, and cost objectives Define team strategy, establish performance goals, and allocate resources to support business priorities Drive equipment optimization initiatives to enhance yield, throughput, and operational efficiency <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior PVD/CVD (Physical Vapor Deposition and/or Chemical Vapor Deposition) Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our PVD/CVD equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Installation and qualification of industry leading PVD/CVD equipment in ou

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Strong process area knowledge DRAM de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE &#43; 10 years or BSEE &#43; 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We make sure Micron DRAM performs where it matters most: inside next-generation servers, client systems, and emerging compute platforms. Our team works at the intersection of memory technology, silicon behavior, platform architecture, firmware interaction, and system-level validation. We partner across engineering fields to bring new memory products from initial platform bring-up through qualification and readiness, helping develop the future of computing. In this role, you will validate Micron DRAM products on cutting-edge compute platforms and play a key role in ensuring system readiness before customer deployment. You will lead complex debug efforts, collaborate with internal teams and external platform partners, and use data-driven analysis to solve challenging technical issues. This hands-on position is ideal for an engineer who enjoys working in the lab, uncovering root causes, and driving issues through resolution. Responsibilities : Lead platform bring-up and system debug across server, client, and emerging compute platforms, including BIOS, firmware, memory training, and system stability Develop and implement memory validation plans to assess performance, compatibility, reliability, and platform readiness Drive failure analysis and root cause investigations, documenting findings, corrective actions, and readiness risks Partner with engineering, product, quality, and program teams to resolve technical issues and support pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Static Timing Analysis (STA) Engineer — you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, DFT, verification, and product teams to ensure timing integrity and drive timing closure across all modes and corners from initial design through tape-out. This is a hands-on senior technical role focused on chip-level STA ownership, constraint authoring, timing closure, methodology development, and pre-/post-silicon timing correlation. Key Responsibilities Responsibilities will include, but are not limited to: Own end-to-end chip-level static timing analysis and sign-off across all checks, modes, corners, and voltage and temperature conditions. Develop, maintain, and validate sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, high-bandwidth memory (HBM) interfaces, design for test (DFT), and configuration logic. Drive timing closure at block, sub

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Diffusion Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our DIFI equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Installation and qualification of industry leading diffusion equipment in our new cleanroom Diffusion equipment performance, includin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We validate Micron memory products on current and next-generation computing platforms. As an Intern System Compatibility Engineer, you will join our System Enablement and Test Development teams and gain hands-on experience with platform bring-up, system configuration, memory validation, test development, automation, data analysis, and AI-enabled engineering workflows under the guidance of experienced engineers. We will provide technical mentorship, structured onboarding, and exposure to DRAM, BIOS and firmware interactions, computer architecture, laboratory workflows, responsible use of approved AI tools, and the memory product lifecycle from initial bring-up through qualification and readiness. Key Responsibilities Set up and support Intel, AMD, and ARM-based systems in Linux, Windows, and UEFI environments; document hardware, BIOS, firmware, operating system, memory, and test configurations for repeatable execution and traceability. Implement memory validation activities that assess compatibility, stability, reliability, performance, and platform readiness. Reproduce and triage failures, collect logs and diagnostic data, use issue-tracking systems, apply structured failure-analysis methods, and support validation of corrective actions. Build or refine automation using Python, PowerShell, C&#43;&#43;, or related languages; use approved AI-assisted tools to accelerate code development, test generation, log analysis, data summarization, technical research, documentation, and report

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Utilize AI-enabled tools and data analytics solutions to improve engineering productivity, accelerate problem solving, an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in advanced semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s broader $150 billion global expansion, the High Volume Manufacturing (HVM) organization leverages AI-Enabled innovation, advanced analytics, and operational excellence to deliver world-class memory solutions at scale. As an ID1 High Volume Manufacturing Process Engineer Intern, you will support process optimization, yield improvement, and cost reduction within a high-volume fab environment. You will collaborate with equipment engineering, operations, and multi-functional partners while applying data-driven methodologies and Applying AI to improve wafer output, stability, and performance. Responsibilities Analyze manufacturing data and Apply SPC, FDC, and 8D methodologies alongside AI Assisted analytics to improve yield, reduce defects, and enhance tool availability. Investigate process excursions and Using AI, including LLMs and Generative AI tools, to identify trends, perform root-cause analysis, and recommend corrective actions. Collaborate with multi-functional teams to optimize wafer processing using AI-Enabled and data-driven decision-making approaches. Implement process improvement projects focused on increasing wafer outs, Using AI and visualization tools to enhance process capability and efficiency. Maintain and update process documentation, integrating insights gen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that transform how the world uses information to enrich life for all. With a relentless focus on customers, technology leadership, and manufacturing excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products. The Process & Engineering Improvement Section Manager is responsible for leading a team of engineers to drive manufacturing excellence through continuous improvement initiatives focused on productivity, cost optimization, equipment performance, quality enhancement, and Max Outs (MXT) performance within FAB 16. This leader will collaborate across engineering, manufacturing, and support organizations to identify opportunities, develop strategic improvement plans, and execute solutions that deliver sustainable business results. Key Responsibilities Lead and develop a high-performing engineering team to achieve FAB business objectives in Safety, Quality, Cost, Delivery, and MXT performance. Drive continuous improvement initiatives across processes, equipment, and operational systems to enhance manufacturing efficiency and productivity. <span style="font-siz

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life. Our commitment to people, innovation, tenacity, collaboration, and customer focus enables us to deliver leading memory and storage solutions that power artificial intelligence, data centers, mobile devices, automotive applications, and other emerging technologies. The DRAM Lithography team develops and optimizes advanced photolithography processes tha t support current and future semiconductor manufacturing technology. As a DRAM Lithography Intern, you will contribute to projects focused on advancing next-generation semiconductor manufacturing processes. You will collaborate with engineers across Photolithography, Metrology, Dry Etch, Wet Process, and other process areas to develop innovative solutions for process optimization and technology development. During the internship, you will complete one or more technical projects with opportunities to apply AI and data-driven approaches to complex manufacturing challenges. Responsibilities Design and execute experiments (DOE) to optimize photolithography processes, including EUV lithography, photoresist performance, and related process technologies. Plan, run, and document experiments in a semiconductor cleanroom environment using advanced process equipment. Analyze process images and manufacturing data using commercial and in-house software tools, including AI-enabled methodologies where appropriate. Support projects focused on photolithography simulations, process window opti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The role is junior level, only for fresh graduates.該職缺提供給畢業生。 The general responsibilities of the position are the following: DRAM Probe Testing Improve DRAM probe testing coverage and quality on DRAM products Own the DRAM probe test flow , review and sign off probe test program releases to ensure quality control Develop innovative DRAM test algorithms and Leveraging Artificial Intelligence to improve test efficiency and reduce test cost New Generation DRAM Product Development Responsible for new DRAM product startup and yield improvement Support design verification and in-depth DRAM circuit analysis using CAD tools and Verilog simulations Work with the wafer fab process / integration teams to address process-related defects impacting DRAM yield Identify design marginalities in DRAM circuits and recommend design fixes for circuit-related issues Functional and Design Validation (DRAM) Design novel DRAM test algorithms and develop test programs for validating DRAM features, modes, and commands Analyze failures generated from characterization and validation activities Automate DRAM test program development and engineering workflows using scripting and data processing tools DRAM Product Yield Enhance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, subsystem, and full‑chip levels while partnering closely with register‑transfer level (RTL) d