Dram Technology Sr Layout Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is expanding its semiconductor manufacturing operations in Boise through a historic $15 billion investment that will support next-generation DRAM production and advanced manufacturing capabilities. This growth creates exciting opportunities for students to contribute to the future of semiconductor technology while working in a highly collaborative, data-driven manufacturing environment. The High Volume Manufacturing Process Engineer Intern supports process optimization, yield improvement, throughput enhancement, cost reduction, and issue resolution within a manufacturing area. This role partners closely with equipment engineering, operations teams, process owners, and cross-functional stakeholders to improve process performance and achieve key manufacturing objectives. Responsibilities Drive process optimization and manufacturing efficiency initiatives by monitoring process performance, analyzing data, and supporting area throughput and wafer output goals. Identify, troubleshoot, and resolve process issues that could result in yield loss, defects, equipment restrictions, excursions, or production impacts, escalating concerns when necessary. Apply SPC, FDC, Design of Experiments (DOE), and structured problem-solving methodologies, including 8D, to improve process capability and equipment performance. Partner with process owners, operations teams, and engineering stakeholders to address chronic process issues and support continuous improvement initiatives. Leverage Artificial Intelligence and data a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Ready to join a growing team!!! Micron Technology’s vision is to transform how the world uses information to enrich life and our dedication to people, innovation, tenacity, teamwork, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. We are the only company manufacturing today's major memory and storage technologies: DRAM, NAND and Emerging memory. We are looking for an energetic, ambitious, individual with strong work ethic and integrity to join us as the Scribe Design Senior Engineer. The Scribe Design Non-Array (SDNA) team is responsible for the design, layout, and verification of CMOS electrical test structures that enable CMOS device development, Compact modeling, Reliability modeling and Fab process monitoring. In this role you will work with a group of Engineers in India, Japan, and the US. As part of a global team, you will contribute to physical layout, floor planning and verifying through DRC and in-house verification tools. This role will allow you to work on all technology types at Micron. Responsibilities and Tasks include, but are not limited to: Proactively identify problem areas for improvement, propose, and develop innovative solutions. Continuously evaluate and implement new tools and technologies to improve the current automation flows. Demons

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the CMOS Device Integration Team at Micron, where we push the limits of memory technology every day. We work at the intersection of device physics, process integration, and product performance to enable the next wave of DRAM, HBM, and Compute-in-Memory innovation. If you’re excited by challenging technical problems and real-world impact, you’ll feel right at home here! In this role, you’ll serve as a technical leader shaping the future of Micron’s most advanced memory products. As a Distinguished Member of Technical Staff, you’ll drive CMOS device and module development that directly impacts array efficiency, data rates, and product scalability. Your expertise and influence will help guide technology decisions that power AI, high-performance computing, and emerging applications. Responsibilities: Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures Perform detailed electrical characterization of CMOS devices and circuits to drive performance improvements Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions Provide technical leadership, strategic recommendations, and clear presentations to guide technology direction Minimum Qualifications: Master’s degree or PhD in Electrical Engineering or equivalent practical experience 10 or more years of hands-on experience in advanced CMOS device design and/or integration 1

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures. Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability. Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals. Evaluate and implement new etch technologies, chemistries, and hardware platforms. Mentor and guide junior engineers; foster a culture of innovation and technical excellence. Interface with equipment vendors and external partners to co-develop solutions. Drive root cause analysis and continuous improvement initiatives for process-related issues. Present findings and recommendations to executive leadership and global teams. Qualifications: Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field. Minimum 10 years of hands-on experience in Dry Etch process development , preferably in DRAM or advanced memory technologies . Proven track record of technical leadership in semiconductor process engineering. Deep understanding of plasma etch mechanisms, process control, and defect mitigation. Experience with advanced etch tools (e.g., Lam, TEL, AMAT) and process characterization techniques. Strong analytical, problem-solving,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. Responsibilities: Safely identify, handle, and work with chemicals and associated hazards in the work area. Recognize and respond appropriately to safety alarms and events, including EES, fire alarms, MDA, and ERT notifications. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Process Control Engineer, you will be responsible for developing, driving, and sharing process and equipment control solutions. You'll have the opportunity to collaborate with process engineering, IT, equipment automation, data engineering, and data science teams to develop and deliver high quality control strategies and sophisticated methods of variation prediction, identification, and reduction. Specifically, we need someone to craft models and systems solutions to predict and control future process variation with an end goal of efficiency, process variation reduction and yield improvement. You will collaborate with a global community of control engineers to share best known methods and ensure global alignment. Are you curious and enjoy continually learning? Come join our team of dedicated engineers! Job Responsibilities: Design and implement solutions to reduce process variation and develop systems that automate or simplify process control tasks.</li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior/Staff/Principal Engineer and Member of the Technical Staff in the Procurement and Operations Central Teams (PROCT) and Advanced Development Team (ADT), you will primarily focus in the early maturity phase of new products as they transition from technology development centers to our high-volume manufacturing sites. Your contributions to our team will support innovation and enable improvements in product yield, quality and cost reduction that are vital to enable our manufacturing strategy. We are looking for outstanding candidates experienced with semiconductor process development/optimization, hardware and supplier management, and an understanding of NAND & DRAM integration to contribute and grow with our organization. Good organization skills and the ability to work independently or in teams is a must and because this role is essential to the success of Micron's products it will require international travel to Micron manufacturing and technology development sites. Responsibilities Collaborate with Technology Development (TD) on future technology requirements and model of record requirements to ensure manufacturing roadmap is aligned with the forward technology path Partner with TD and Manufacturing on supplier engagement to ensure resources meet Micron's strategic objectives. Collaborate with Manufacturing as new products are introduced to improve performance and enable customer qualification. Connect with corporate EHSS and site Process Hazard Analysis engine

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Micron’s High Bandwidth Memory (HBM) Design Verification team is responsible for ensuring the functionality, performance, and quality of next‑generation memory products that enable advanced computing applications. As a Senior Design Verification Engineer, you will collaborate closely with design, architecture, and product engineering teams to verify complex, high‑density DRAM circuits and deliver robust, production‑ready designs. This role combines deep technical verification expertise with cross‑functional collaboration in a global environment. You will be challenged by the complexity and difficulty of verifying high density memory chips (up to 32Gb) with huge scale of circuit capability (over 4M transistors), ultra-high speed designs, sophisticated functionality which includes next Generation DDR/LPDDR (ex: DDR5, LPDDR5) and advanced low power and power management technologies. You will be responsible to evaluate the functionality and performance of the Full-chip and block-level circuit designs using different verification tools, techniques, and strategies. In addition, you will also n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's ASIC Logic Design team develops next-generation ASICs and controller IP that enable industry-leading memory solutions. Working across advanced process technologies, the team collaborates with architecture, analog, verification, physical design, and validation engineers to deliver high-performance, production-ready silicon for future DRAM products. As an ASIC Digital Design Engineer, you will contribute to the design and development of RTL for next-generation DRAM memory controllers and subsystems. You will work in a collaborative engineering environment supporting design implementation, simulation, validation, and chip bring-up activities while leveraging AI-enabled tools to improve productivity and design quality. Responsibilities Design and develop RTL for DRAM memory controllers and subsystem components using SystemVerilog. Collaborate with analog, verification, physical design, validation, and other cross-functional teams to support successful product development. Develop and validate HDL models, support simulation and co-simulation activities, and analyze design functionality and performance. Support chip bring-up, debugging, and validation activities to identify and resolve design issues. Use scripting, automation, and AI-enabled tools to improve design workflows, productivity, and engineering efficiency. Minimum Qualifications 0-2 years of relevant experience through intern