Dram Technology Sr Layout Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s DRAM R&D Memory Group and help shape the future of memory technology. Our team develops the innovations that enable next-generation DRAM scaling in an industry-leading 300mm research facility located alongside our expanding manufacturing campus. We work at the intersection of device physics, process technology, and product innovation to solve some of the semiconductor industry’s most complex challenges. As a Process Integration Engineer, you will play a key role in developing and integrating critical technologies that enable future DRAM generations. You will define structural and electrical requirements, collaborate with cross-functional engineering teams, and drive solutions from concept through manufacturing transfer. This is an opportunity to influence core memory technology while working in a highly collaborative and technically rigorous environment. Responsibilities: Develop and integrate novel process flows for critical DRAM modules, including structural, electrical, and design rule requirements Design and execute experiments (DOE), analyze data using statistical methods, and apply findings to improve device performance and yield Partner with Design, Product Engineering, Process Development, Modeling, Yield Enhancement, Failure Analysis, Parametric, and Quality teams to resolve technical challenges Summarize complex issues, drive alignment across stakeholders, and implement effective solutions Collaborate with Manufacturing to successfully transfer new

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Process Integration Engineer in the Advanced DRAM organization, you will develop the innovative solutions required to produce the most advanced Memory products on the planet! You will work within a team of world-class engineers to drive new technology development and build Micron’s AI-enabled next-generation memories. This will require a strong background in materials science and semiconductor device physics, along with a creative mindset and a penchant for out-of-the-box thinking. Responsibilities: Lead technology pathfinding activities to enable state-of-the-art device components, such as charge storage devices, hi-k/metal gate transistors, thin-film transistors (TFTs), among others. Design experiments and analyze results, processing silicon and collaborating with the process, materials analysis, device characterization, modeling, reliability, and other teams. </s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Process Integration Engineer in the Advanced DRAM organization, you will develop the innovative solutions required to produce the most advanced Memory products on the planet! You will work within a team of world-class engineers to drive new technology development and build Micron’s cutting-edge next-generation memories. This will require a strong background in materials science and semiconductor device physics, along with a creative mindset and a penchant for out-of-the-box thinking. Responsibilities: Lead technology pathfinding activities to enable state-of-the-art device components, such as charge storage devices, hi-k/metal gate transistors, thin-film transistors (TFTs), among others. Design experiments and analyze results, processing silicon and collaborating with the process, materials analysis, device characterization, modeling, reliability, and other teams. Evaluate operating and failure mechanisms, sources of noise,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Dry Etch Lead Principal Engineer at Micron Technology, Inc. Micron is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM, and other memory-based systems. As the only memory fab in the western hemisphere, Micron is in the industry for over forty-five years and continues to stay as the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and still growing. Responsibilities: Develop dry etch processes to meet physical and electrical product requirements Optimize processes to reduce cost, variability, and improve capability Collaborate with integration and process teams to develop innovative solutions Perform root cause and failure mode analysis and drive vendor improvements Support pilot line operations and transfer processes to production sites Minimum Qualifications: Bachelor’s degree in Engineering, Physics, or related field 3&#43; years of relevant experience including internships Strong analytical and creative problem‑solving skills Working knowledge of statistics and statistical process control Ability to manage multiple projects and work independently Preferred Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Product Quality Engineering PQA Sr. manager, your role involves ensuring that DRAM products shipped from Micron Taiwan Frontend Manufacturing meet customer requirements in terms of performance and reliability. Simultaneously, you aim to minimize the overall Cost of Non-Conformance. In that, your responsibilities include for the comprehensive monitoring and analysis of probed wafers for potential Quality and Reliability risks and for the technical standard of the fail mode modelling on which the disposition decision is based. Collaborating with GQ and PE, you continuously improve product test coverage and setting of appropriate warning and screen limits to prevent escapes to Backend and Customer. Concurrently, your mission is to provide guidance for process improvements to enhance the baseline Probe-to-Ship yield and the overall ratio of prime Product Grading available for Micron shipment. In collaboration with Process QE and Fab Operation you assure the comprehensive Problem Solving of deviations that occur and seamless implementation of Preventive Actions and Shift-Left detection points. You also ensure that manufacturing process/equipment changes impacting products undergo a full risk assessment and qualification process by using AI methodlogy and solution. Responsibilities include but are not limited to the following: Define and maintain critical quality metrics aligned with business objectives Establish clear goals and aggressive timelines to achiev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Sr Principal CAD & HPC Workflow Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Position Overview Micron is seeking a Senior Principal CAD Engineer to help shape the engineering environment that powers Memory product development across DRAM, HBM, NAND, and custom memory programs. In this high-impact technical role, you will partner with Micron’s CAD Software and HPC teams to architect, modernize, and scale the platforms our worldwide design teams rely on every day, from CAD software infrastructure, project setup flows, and quality-gating solutions to engineering automation and compute workload scalability. You will also define how success is measured. By developing improvement and quality metrics for job management and workflow performance, you will establish customer-facing service levels that give design teams clear visibility into the performance of their environment and give engineering leaders a data-driven path to continuous improvement. Along the way, you will help bring next-generation AI and agentic software solutions into Design Automation, working closely with CAD, Design Engineering, HPC, and EDA vendors. Key Responsibilities Serve as a senior engineer partnering with the CAD Software and HPC team

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer in the TDT (TD Taiwan) Device Team, you will drive DRAM device development projects supporting technology roadmap enablement, model delivery, performance optimization, reliability improvement, and technology transfer. You will collaborate closely with Technology Development organizations worldwide to advance next-generation CELL technologies from concept development through high-volume manufacturing. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making. Key Responsibilities Drive DRAM CELL device development projects supporting future technology roadmap requirements. Lead electrical characterization, margin assessment, performance optimization, and reliability improvement activities.</p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR4,LPDDR4,DDR5 and LPDDR5 that can operate at high speeds of up to 6400MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: • Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops • Strong judgment to validate AI outputs before use (review assumptions, align with specs/standards, cross-check with simulations, waveforms, assertions, and coverage reports, and document what was accepted/changed) prior to incorporating results into design decisions, verification plans, or debug conclusions • Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities · Lead pre-silicon readiness activities across new DRAM products, including risk assessment, DFMEA preparation, validation planning, and readiness reviews with cross-functional engineering teams. · Partner closely with Design, Verification, Component Validation, Product Engineering, Product Architecture, System Compatibility Group, and Silicon Strategy teams to identify product risks, define validation coverage, and align debug priorities. · Apply strong technical judgment to analyze circuit behavior, silicon data, validation results, failure signatures, and product-level interactions across design, test, and manufacturing flows. · Drive structured investigation and resolution of silicon findings, including root-cause analysis, experiment planning, evidence review, and alignment of mitigation or screen strategies to project milestones. · Influence product readiness decisions by connecting design intent, silicon behavior, validation results, manufacturing constraints, and customer quality expectations. · Mentor engineers, strengthen technical practices, and help capture lessons learned that improve execution, product robustness, and organizational readiness across future DRAM programs. ·Apply AI-enabled ways of working to improve engineering productivity, including use of approved AI tools for technical research, data synthesis, debug plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary Micron is seeking a Senior Digital Design Engineer to contribute to the development of advanced DRAM digital and mixed-signal blocks. This role is responsible for RTL design, implementation, synthesis, timing analysis, power optimization, and design quality throughout the RTL-to-GDS flow. The engineer will collaborate with architecture, verification, and physical design teams to deliver high-performance, power-efficient designs that meet product specifications and PPA (Power, Performance, Area) objectives for next-generation memory products. Responsibilities Design, develop, and deliver RTL for complex DRAM digital and mixed-signal blocks, ensuring alignment with product specifications and performance targets. Perform front-end design quality checks including linting, CDC/RDC analysis, logic synthesis, timing constraint development, and timing closure activities. Collaborate with architecture, verification, and physical design teams to optimize power, performance, area (PPA), and overall design quality. Develop and maintain synthesis and timing constraints (SDC), analyze timing reports, and drive timing closure across multiple operating scenarios. Improve design methodologies, automation, and RTL-to-GDS flows to enhance development efficiency, design quality, and time-to-market. Minimum Qualifications Master’s degree in Electrical Engineering (or equivalent) with 4&#43; years of experience, or Bachelor’s degree with 5&#43; years

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary Micron is seeking a Senior Digital Design Engineer to contribute to the development of advanced DRAM digital and mixed-signal blocks. This role is responsible for RTL design, implementation, synthesis, timing analysis, power optimization, and design quality throughout the RTL-to-GDS flow. The engineer will collaborate with architecture, verification, and physical design teams to deliver high-performance, power-efficient designs that meet product specifications and PPA (Power, Performance, Area) objectives for next-generation memory products. Responsibilities Design, develop, and deliver RTL for complex DRAM digital and mixed-signal blocks, ensuring alignment with product specifications and performance targets. Perform front-end design quality checks including linting, CDC/RDC analysis, logic synthesis, timing constraint development, and timing closure activities. Collaborate with architecture, verification, and physical design teams to optimize power, performance, area (PPA), and overall design quality. Develop and maintain synthesis and timing constraints (SDC), analyze timing reports, and drive timing closure across multiple operating scenarios. Improve design methodologies, automation, and RTL-to-GDS flows to enhance development efficiency, design quality, and time-to-market. Minimum Qualifications Master’s degree in Electrical Engineering (or equivalent) with 4&#43; years of experience, or Bachelor’s degree with 5&#43; years

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We define ESD and latch-up architecture for next-generation HBM products across advanced nodes and 3D integration. Our team works across device, circuit, and packaging domains to solve reliability challenges that directly impact product quality. We take on complex problems and turn them into scalable solutions that enable high-performance memory! As an SMTS/DMTS HBM ESD/Latch-Up Architect, you will define protection strategies across base die, DRAM stacks, and interconnects. This role shapes product reliability from early architecture through silicon validation. You will work across teams and influence technical direction while solving system-level ESD challenges. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Define end-to-end ESD and latch-up architecture across base die, DRAM die, and interconnects Develop protection strategies for high-speed I/O, TSV interfaces, and advanced packaging Establish ESD/LUP standards, rule decks, and signoff criteria Drive correlation between d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary At Micron Technology, we are looking for a Senior RTL Engineer to build and develop DRAM digital and mixed-signal blocks for advanced memory products. In this role, you will support the RTL lifecycle from specification and implementation to signoff. You will collaborate with multi-functional teams to develop high-quality builds that meet power, performance, and area (PPA) targets. This position is based in Boise, Idaho, within a collaborative and innovative engineering environment. Responsibilities Contribute to RTL build of digital and mixed-signal components for DRAM using RTL-to-GDS flows. Implement and document high-performance, power- and area-efficient RTL designs meeting product specifications. Perform front-end quality checks including lint, CDC/RDC, synthesis, UPF, and timing QoR. Collaborate closely with physical design and implementation teams to achieve timing closure and PPA goals. Apply power-, clock-, and implementation-aware RTL design practices to minimize silicon risk. Minimum Qualifications Master’s degree in Electrical Engineering with 4&#43; years of experience, or Bachelor’s degree with 5&#43; years of pre-silicon RTL design experience. Demonstrated experience developing RTL for complex digital IP from specification through implementation handoff. Hands-on experience with ASIC low-power design methodologies, including UPF-based power intent and CDC/RDC analysis. Strong knowledge of ASIC design flows, including RTL design, logi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Join us as a Senior Verification Engineer and contribute to modular, scalable verification solutions for next-generation HBM DRAM products! You will work independently within a multi-functional team of technical domain experts, spanning both IP-level and SoC-level verification. You will collaborate with Design Engineering, Product Engineering, and Business Units to complete the HBM verification roadmap. You will apply your solid understanding of testbench architecture, custom or SoC verification methodologies, and 2.5D & 3D package integration to evaluate issues, define solutions, and broaden your expertise. Responsibilities: Develop and implement verification plans and architecture collateral across IP-level and SoC-level verification for current and future HBM designs Support co-verification of the overall system and participate in customer interactions to gather feedback and provide recommendations for future HBM solutions Build and improve verification methodology components and GenAI applications aligned to HBM design cycles, broadening cross-disc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop test plans at SOC Level and analyze Coverage. Build verification environments to verify complex SOCs. Develop Random/Directed test in RTL and GLS environments. Review architectural specifications to ensure high quality. Work with customers to understand their verification and validation requirements and provide the necessary collateral. Engage with customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions. Work with IP suppliers to ensure that proper verification and validation collaterals are provided. Identify and flag quality issues, performance problems, and opportunities to reduce power consumption. Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures. Employer will accept a Bachelor’s degree in Electrical and Computer Engineering, or related field and 3 years of experience in the job offered or in a related occupation. Position requires: 1. SoC or IP verification; 2. Writing tests and developing verification environments using System Verilog and UVM; 3. Building verification environments or validating complex SOCs; 4. Working with IP vendors and verifying IP integration; 5. Gate-level simulation (GLS); 6. Python; 7. UCIE, memory controller, NOCs, MBIST, or ATPG scan controllers; and 8. DRAM operation and JEDEC specifications such as HBM product family. <p